Shin-etsu Chemical Co., Ltd.

Hiroshi Kanbara

Hiroshige Okinoshima

Hideto Kato

Tomoyoshi Furihata

Yoshinori Hirano

Seizi Katayama

Jun Hatakeyama

Satoshi Okazaki

Tetsuya Inukai

Yoshinori Hida

Mitsuo Umemura

Kazuhiro Nishikawa

Shohei Kozakai

A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, providing the inorganic material film with an aperture, and etching away the sacrificial film pattern through the aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) forming a sacrificial film using a composition comprising a cresol novolac resin and a crosslinker, (B) exposing patternwise the film to first high-energy radiation, (C) developing, and (D) exposing the sacrificial film pattern to second high-energy radiation and heat treating for thereby forming crosslinks within the cresol novolac resin.

Method for manufacturing micro-structure

In a resist composition, a novolak resin including at least one recurring unit of the formula (1): ##STR1## wherein n is an integer of 1 to 4 and m is an integer of 0 to 3, having a weight average molecular weight of 1,000 to 10,000 calculated as polystyrene, and having the hydrogen atom of a hydroxyl group therein replaced by a 1,2-naphthoquinonediazidosulfonyl group in a proportion of 0.03 to 0.27 mol per hydrogen atom serves as an alkali-soluble resin and a photosensitive agent. The composition is uniform in that the photosensitive agent is uniformly incorporated in the novolak resin, and thus forms a uniform resist film. It is a useful positive resist having improved sensitivity, resolution, heat resistance, and film retentivity.

Resist compositions

The present polyamido-acid copolymer has a polymerization backbone chain represented by the following formula: ##STR1## wherein q represents a bivalent organic group and R represents a tetravalent aromatic group. This copolymer forms a polyimide resin film excellent in adhesion to various inorganic substances and mechanical strength.

Polyamido-acid copolymer and its manufacture

Siloxane compounds having the general formula [1]: ##STR1## wherein R is a substituted or unsubstituted monovalent hydrocarbon group having from 1 to 10 carbon atoms, and n is an integer of from 0 to 100. The compound, because of the two vinylsilyl groups and two acid anhydride groups introduced into the molecule thereof, is useful as an intermediate or modifying agent in the synthesis of various organic resins such as polyimide resins.

Siloxane compound containing tetrahydrophthalic anhydride group and

A UV curable composition of a specific organopolysiloxane having mercaptoalkyl and phenylene groups and a vinyl-containing organopolysiloxane cures into a film which emits little stimulative sulfur odor and has enough resistance to light or UV radiation to retain its as-cured properties even after long-term exposure to sunlight or UV radiation.

UV curable compositions of organopolysiloxane containing mercaptoalkyl

Siloxane compounds having the following formula [1]: ##STR1## wherein each R is a substituted or unsubstituted monovalent hydrocarbon group having from 1 to 10 carbon atoms, and n is an integer of from 0 to 100. The compounds are extremely high in reactivity and, therefore, useful as an intermediate or modifying agent in the synthesis of silicone resins and other various organic resins.

Butadienyl group-containing siloxane compounds and method of producing

Novel organosilicon compounds containing a mercapto group are provided, which compounds are of the following general formula, HSCH.sub.2 C.sub.6 H.sub.4 (CH.sub.2).sub.n Si(CH.sub.3).sub.3-m (OR).sub.m, wherein R represents a methyl group or an ethyl group, n is a value of 0,1 or 2, and m is a value or 1, 2 or 3. the ocmpounds are substantially free of any offensive odor derived from the mercapto group and are useful as a silane coupling or crosslinking agent.

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Annaka, Japan

Hiroshi Kanbara