Asahi Kasei Chemicals Corporation

Asahi Kasei Kabushiki Kaisha

Hiroshi Kamo

Toru Yamaguchi

Akio Fujiwara

Yuuji Kusumi

Yoshifumi Araki

Masanori Ikeda

Takashi Ono

Tomohiro Kondo

Hiroshi Nishino

Yoshikuni Akiyama

Shunichiro I

Tetsuo Kurihara

Yukihiro Ban

Hiroyuki Shinryu

Shingo Kuga

It is intended to provide a polyethylene powder which can offer a fiber excellent in resistance to end breakage, dimensional stability, and acid resistance and/or a microporous membrane excellent in dimensional stability and acid resistance, and a microporous membrane and a fiber which are obtained by forming the polyethylene powder. The present invention provides a polyethylene powder comprising: 0.5 ppm or higher and 3,000 ppm or lower of aluminum hydroxide having an average particle size smaller than 50 &#x3bc;m; and 0.5 ppm or higher and 12 ppm or lower of a magnesium element, wherein the polyethylene has a viscosity-average molecular weight of 100,000 or larger.

Polyethylene powder, microporous membrane, and fiber

A film is used as a TAB leader tape. The film comprises 45 parts by mass or more of a polyphenylene ether-based resin and 55 parts by mass or less of at least one component selected from a thermoplastic resin and a plasticizer based on 100 parts by mass of the film. The film optionally includes inorganic filler and other additional components.

TAB leader tape made of polyphenylene ether-based resin

The polyphenylene ether according to the present invention includes 5 to 20% by mass of a component having a molecular weight of 50,000 or more and 12 to 30% by mass of a component having a molecular weight of 8,000 or less. The resin composition according to the present invention includes the polyphenylene ether (a) and a hydrogenated block copolymer (b) prepared by hydrogenating a block copolymer including at least two polymer blocks A having a vinyl aromatic compound and at least one polymer block B having a conjugated diene compound, wherein the number average molecular weight (Mnb) of the hydrogenated block copolymer is 100,000 or less, and the number average molecular weight (MnbA) of at least one polymer block of the polymer blocks A is 8,000 or more.

Polyphenylene ether, resin composition, and molded body of resin composition

It is an object to provide a resin composition in which fluidity is conferred while maintaining the high heat resistance of a highly heat-resistant non-crystalline resin, an amount of foreign matter is greatly reduced, there is no mold deposit, the metering stability is excellent, and the transparency is also good, and a resin composition in which good heat resistance and fluidity are both achieved, the amount of foreign matter is reduced, generation of fines is reduced, and there is no bleeding out. According to the present invention, there is provided a resin composition comprising; (A) a resin component comprising 70 to 100% by weight of at least one resin selected from the group consisting of a polyphenylene ether resin, a polycarbonate resin, a polysulfone resin, a polyethersulfone resin, a polyarylate resin, a polyamide-imide resin, a polyetherimide resin, and a thermoplastic polyimide resin; and (B) an organic compound having a melting point of not less than 200&#xb0; C., the organic compound being from 0.1 to 40 parts by weight based on 100 parts by weight of the resin component (A).

Resin composition

There is provided automotive lamp peripheral parts excellent in heat resistance, rigidity and fogging property. The lamp peripheral part according to the invention is obtained from a resin composition containing 70% by mass or more of a polyphenylene ether (A) and a styrene-based resin (B), and has a haze value of a glass plate of 1.0% or less after the glass plate is subjected to a fogging test using an apparatus according to ISO 6452.

Automotive lamp peripheral parts

The present invention relates to a mold releasing film for printed circuit board production, which comprises a resin layer (P) containing (A) a polyphenylene ether-based resin in an amount of 50 wt % or more. According to the present invention, it is possible to provide a mold releasing film suitable for production of printed circuit boards, particularly flexible printed circuit boards, which is excellent in mold-releasing property, exhibits little heat shrinkage, hardly imparts wrinkles to printed circuit board products, itself hardly gets wrinkled, and is excellent in contamination resistance since no bleeding-out is observed, and which is also excellent in an anti-moisture absorbing property, shape-following property, less overflow of adhesive, adhesion between multilayer films and slipping property between films.

Mold releasing film for printed circuit board production

A hard disk drive inner part formed of a resin which exhibits well-balanced low outgassing properties, ultrasonic cleaning resistance, low ionic contamination properties, low particulate contamination properties, repeated removability, heat resistance, specific gravity, and water-absorbing properties. The hard disk drive inner part includes a resin composition which includes a polyphenylene ether resin (A).

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Tokyo, Japan

Hiroshi Kamo