Tdk Corporation

Nissan Motor Company Limited

Hiroshi Kamiyama

Makoto Yoshida

Tomonaga Nishikawa

Tomokazu Ito

Fumio Watanabe

Kazuhiko Maejima

Takeshi Okumura

Naozumi Ishikawa

Sho Nakagomi

Makoto Hasegawa

Makoto Kimura

Katsumichi Tagami

Tsuneo Kuwahara

Hiroki Matsukuma

Mitsuyoshi Kawai

Masashi Sugiuchi

Atsuhiro Nonaka

Teruhisa Shindo

Tatsuya Karakame

A coil componentincludes a thin-film coil layer including spiral conductors and bump electrodestoformed on a surface of the thin-film coil layer. The thin-film coil layer includes internal terminal electrodestoconnected respectively to corresponding one ends of the spiral conductors, and a fourth insulating layercovering the internal terminal electrodetoand having openings ha to hd. Both a top surface TS and a side surface SS of each of the internal terminal electrodestoare exposed through the corresponding opening. The bump electrodestoare each brought into contact with both the top surface TS and side surface SS of each of the internal terminal electrodestoin the corresponding opening.

Electronic component and manufacturing method thereof

A first alignment mark is given to a substrate, and a second alignment mark is given to a mask. The mask forms an electronic circuit pattern on the substrate. A control unit performs alignment of the mask and the substrate based on the first and second alignment marks. The second alignment mark is formed to surround the first alignment mark. The second alignment mark has a step pattern therein.

Manufacturing apparatus of electronic component and manufacturing method thereof

An electronic component includes a first conductor layer including a first conductor pattern P, a first insulating layer covering the first conductor layer, a first opening hpassing through the first insulting layer to expose top and side surfaces of the first conductor pattern Ptherethrough, and a second conductor layer formed on the first insulating layer and including a second conductor pattern Pconnected to the first conductor pattern Pthrough the first opening h. A first opening region which is a planar region inside the first opening hincludes a first region in which the first conductor pattern Pis formed and a second region in which the first conductor pattern Pis not formed. The second conductor pattern Pis embedded in both the first and second regions of the first opening h

An electronic component is provided with a substrate, a thin-film element layer provided on the substrate, first and second bump electrodes, provided on a surface of the thin-film element layer, and an insulator layer provided between the first bump electrode and the second bump electrode. The thin-film element layer contains a first spiral conductor which is a plane coil pattern. The first bump electrode is connected to an internal peripheral end of the first spiral conductor. The second bump electrode is connected to an external peripheral end of the first spiral conductor. Both of the first and second bump electrodes, have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer.

Electronic component

A coil componentis provided with a substrate, a thin-film coil layerprovided on the substrate, first and second bump electrodesprovided on a surface of the thin-film coil layer, a first lead conductorprovided on the surface of the thin-film coil layertogether with the first and second bump electrodesand formed integrally with the first bump electrode, and an insulator layerprovided between the first bump electrodeand the second bump electrode. The thin-film coil layercontains a first spiral conductorwhich is a plane coil pattern. The first bump electrodeis connected to an internal peripheral end of the first spiral conductorvia the first lead conductor. The second bump electrodeis connected to an external peripheral end of the first spiral conductor

Coil component and method of manufacturing the same

A manufacturing method of electronic components includes forming a first insulation layer on a substrate, forming a plurality of passive elements on the first insulation layer, forming a second insulation layer on the passive elements, forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of the second insulation layer to be exposed to an upper surface of each electronic component, and forming grooves between the electronic components including the respective passive elements to expose side surfaces of each electronic component and parts of the conductor layers from the side surfaces of each electronic component. The manufacturing method further including plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each electronic component, and cutting the substrate to completely separate into individual electronic components.

Electronic component and manufacturing method of electronic component

A thin-film magnetic head has a plurality of MR read head elements. Each MR read head element includes shield layers electrically insulated from the ground. An electrical resistor layer is electrically connected between the shield layer of one of the plurality of MR read head elements and the shield layer of the other one of the plurality of MR read head elements.

Electrostatic protection for a magnetic tape head having multiple MR read elements

A thin-film magnetic head that shows stable read and/or write performances, maintaining the reliability over time by suppressing the wear of the head sufficiently, is provided. The head comprises: a substrate having an element-formed surface and an opposed-to-medium surface; a magnetic head element; an overcoat layer formed on the element-formed surface so as to cover the magnetic head element; a closure provided on the overcoat layer, a surface of the closure being in contact with the upper surface of the overcoat layer; and an element contact pad formed in a sliding-side surface of the head and having a contact surface including a part of the opposed-to-medium surface, a part of an end surface of the overcoat layer and a part of an end surface of the closure, one end of the magnetic head element reaching the contact surface.

Thin-film magnetic head comprising contact pad including portions of closure and substrate and magnetic recording apparatus comprising the head

A manufacturing method of a thin-film head includes the steps of, laminating and patterning a soft magnetic layer with iron alloy that contains silicon and aluminum through a base layer on a substrate; laminating an insulating layer on the patterned soft magnetic layer; performing a chemical-mechanical polishing of a surface of the laminated insulating layer and the patterned soft magnetic layer with a first acid slurry; forming a lower shield layer by a mechanical polishing with a second weak acid, or neutral slurry with a pH different from that of the first slurry; and forming a lower shield gap layer and a magnetoresistive effect layer on the lower shield layer.

Manufacturing method of a thin-film magnetic head

A common mode filter is provided as one in a three-layered structure with improved high-frequency characteristics. The common mode filterhas the three-layered structure including a first coil layera second coil layerand a lead layerA first planar coiland a second planar coilof a substantially circular spiral shape are formed in the first and second coil layersrespectively. A first lead wireand a second lead wireformed in a lead layerhave a first straight portionc and a second straight portionc, respectively. The first straight portionc is located on a straight line Lperpendicular to a plurality of first tangent lines to spiralsat a plurality of respective intersection points with the spirals. The second straight portionc is located on a straight line Lperpendicular to a plurality of second tangent lines to the spiralsat a plurality of respective intersection points with the spirals

Common mode filter

The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a coil component having high electrical characteristics. A common mode filter includes a coil conductor formed in a spiral shape, cut ends which are parts of the coil conductor cut to face each other, and bridge conductors formed so that an insulation film is interposed between the coil conductor and the same to connect the cut ends to each other.

Coil component

The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a low-cost coil component having a low direct-current resistance. A common mode filter includes a bridge conductor layer which has a bridge conductor one end of which is connected to one end of a lead wire and another end of which is connected to an inner circumferential end of a coil conductor and another bridge conductor one end of which is connected to one end of another lead wire and another end of which is connected to an inner circumferential end of another coil conductor, the bridge conductor layer being formed between two coil conductor layers with an insulation film interposed between the bridge conductor layer and each of the coil conductor layers.

A variable cam engine comprises a low speed power cam arranged so as to generate high power at low engine speeds, a high speed power cam arranged so as to generate high power at high engine speeds, and an economy cam arranged so as to give good fuel cost performance. The engine is provided with a device for detecting the running condition of the engine, a device for identifying a target cam from among the cams depending on the running condition of the engine, a device for identifying a present cam, a device for selecting either the target cam or another cam depending on whichever gives the smaller torque step with respect to the present cam, and a device for transmitting the motion of the cam selected to a valve. In the above construction, when there is a large torque step between the present cam and the target cam, cams can be changed over via a cam intermediate between the two. The torque step when the cams are changed over is therefore reduced, and the change-over to the target cam proceeds smoothly.

Variable cam engine

A system and method for recognizing an elevated vehicle running environment are disclosed in which, when a detected vehicle speed exceeds a predetermined speed and is continued for a predetermined time, the system and method determine that a predetermined running condition is satisfied, then, the system and method detect the steering angle of the steering wheel of the vehicle and determine whether the accumulated value of the steering angle data exceeds a predetermined value, if yes, the system and method determine that the vehicle is running on an elevated freeway. Thus the reliability of recognition for elevated running environments can be remarkably improved for vehicular navigation systems.

Growing community of inventors

Tokyo, Japan

Hiroshi Kamiyama