Dowa Electronics Materials Co., Ltd.

Hiroshi Kamiga

Noriaki Nogami

Taro Nakanoya

Naoki Tahara

Yoshiyuki Michiaki

Kenichi Harigae

Aiko Hirata

A conductive paste including: a conductive powder containing silver; an indium powder; a silver-tellurium-coated glass powder; a solvent; and an organic binder, wherein the silver-tellurium-coated glass powder is a silver-tellurium-coated glass powder including a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more, and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component.

Conductive paste, method for producing same, and method for producing solar cell

A silver powder, wherein the silver powder satisfies D-IPA&#x3e;D-W, where in measurement of a volume-based particle size distribution of the silver powder by a laser diffraction particle size distribution analysis, D-IPA (&#x3bc;m) is a cumulative 50% point of particle diameter of the silver powder when isopropyl alcohol (IPA) is used as a measurement solvent for dispersing the silver powder, and D-W (&#x3bc;m) is a cumulative 50% point of particle diameter of the silver powder when water is used as a measurement solvent for dispersing the silver powder, and wherein a phosphorus content in the silver powder is 0.01% by mass or more but 0.3% by mass or less.

Silver powder, method for producing same, and hydrophilic conductive paste

There is provided a silver-coated copper powder which can improve the conversion efficiency of a solar cell in comparison with conventional silver-coated copper powders when it is used in an electrically conductive paste used for forming the busbar electrodes of the solar cell, the silver-coated copper powder being capable of producing a solar cell having a high conversion efficiency which is the same degree as that of a solar cell using silver powder, and a method for producing the same. A silver-coated copper powder obtained by coating the surface of a copper powder, which is obtained by the atomizing method or the like, with 5 wt % or more (with respect to the silver-coated copper powder) of a silver containing layer of silver or a silver compound, is added to a cyanide solution, such as a potassium silver cyanide solution, a potassium gold cyanide solution, a potassium cyanide solution or a sodium cyanide solution, to cause the copper powder coated with the silver containing layer to contain 3 to 3000 ppm of cyanogen.

Silver-coated copper powder and method for producing same

Provided is a silver-tellurium-coated glass powder including: a tellurium-based glass powder containing tellurium in an amount of 20% by mass or more; and a coating layer on a surface of the tellurium-based glass powder, the coating layer containing silver and tellurium as a main component. Preferable aspects include an aspect where the coating layer containing silver and tellurium as a main component further contains a component that is other than silver and tellurium and contained in the tellurium-based glass powder, and an aspect where the component that is lo other than silver and tellurium and contained in the tellurium-based glass powder contains one or more kinds selected from zinc, lead, bismuth, silicon, lithium, and aluminum.

Silver-tellurium-coated glass powder, production method for silver-tellurium-coated glass powder, conductive paste, and production method for conductive paste

To provide a silver powder including alkenylsuccinic anhydride and/or alkenylsuccinic acid on a surface of the silver powder.

Silver powder, manufacturing method therefor, and conductive paste

A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a ratio of (Casson yield value/BET specific surface area) is 500 or less, where the Casson yield value is a Casson yield value of a conductive paste and the BET specific surface area is a BET specific surface area of the silver powder, where the conductive paste has a composition in which the silver powder is 86% by mass, a glass fit is 1% by mass, ethyl cellulose is 0.6% by mass, texanol is 10.5% by mass, and zinc oxide is 1.9% by mass, and the conductive paste is prepared by kneading the composition with a planetary centrifugal stirrer and bubble remover and dispersing with a triple roll mill.

Silver powder, method for producing same, and conductive paste

There is provided a silver powder, which is able to obtain a conductive paste having a high thixotropic ratio and a high Casson yield value and which is able to form a conductive pattern having a low resistance, and a method for producing the same. An aliphatic amine such as hexadecylamine is added to a silver powder, the surface of which is coated with a fatty acid such as stearic acid, to be stirred and mixed to form the aliphatic amine on the outermost surface of the silver powder while allowing the fatty acid to react with the aliphatic amine to form an aliphatic amide such as hexadecanamide between the fatty acid and the aliphatic amine.

Silver powder and method for producing same

A silver powder, including: an organic substance on a surface of the silver powder, the organic substance containing at least one carboxyl group and at least one hydroxyl group in one molecule of the organic substance, wherein a BET specific surface area of the silver powder is 0.1 m/g or more but 2.0 m/g or less, and wherein a cumulative 50% point of particle diameter (D) of the silver powder in a volume-based particle size distribution of the silver powder as measured by a laser diffraction particle size distribution analysis is 0.1 &#x3bc;m or more but 6.0 &#x3bc;m or less, and a ratio of [(D&#x2212;D)/D] is 3.0 or less, where Dis the cumulative 50% point of particle diameter, Dis a cumulative 90% point of particle diameter of the silver powder, and Dis a cumulative 10% point of particle diameter of the silver powder.

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Tokyo, Japan

Hiroshi Kamiga