Fujitsu Corporation

Fujitsu Semiconductor Limited

Hiroshi Kaiya

Toshiyuki Honda

Masanori Onodera

Kazuto Tsuji

Hiroshi Aoki

Susumu Moriya

Izumi Kobayashi

A semiconductor device includes a resin housing provided with a functional part, a wire pattern made of a conductive material and molded in the resin housing, a part of the wire pattern being exposed from the resin housing, an electronic part connected with the wire pattern in a state where the electronic parts is molded in the resin housing, and a semiconductor element connected to the part of the wire pattern being exposed from the resin housing. The semiconductor element provides a designated function in cooperation with a functional part of the resin housing.

Semiconductor device and method for making the same

A module of a combination card can be incorporated into a card body with solder being easily melted, and heat transmission to portions other than the antenna connection terminals is reduced. A card body is provided with an antenna. The module includes a substrate which has a terminal surface on which at least one external connection terminal is formed and a mounting surface opposite to the terminal surface. An IC chip is mounted on the mounting surface. The module includes at least one antenna connection terminal located on the mounting surface. The antenna connection terminal is connected to the antenna, and at least a part of the antenna connection terminal is exposed on the terminal surface.

Combination card having an IC chip module

Growing community of inventors

Kawasaki, Japan

Hiroshi Kaiya