Toyota Jidosha Kabushiki Kaisha

Toyoda Gosei Co., Ltd.

Kabushiki Kaisha Toyota Chuo Kenkyusho

Toyota Jidosha Kogyo Kabushiki Kaisha

Nichiha Corp.

Other

Kyocera Corporation

Nippondenso Co., Ltd.

Ngk Spark Plug Company, Limited

Taiho Kogyo Co., Ltd.

Kabushiki Kaisha Tokai Rika Denki Seisakusho

Hitachi Cable, Inc.

Emhart Inc.

Toyota School Foundation

Rinnai Kabushiki Kaisha

Hiroshi Ito

Tadashi Ichikawa

Nobuyuki Kobayashi

Manabu Kagami

Shigemichi Yamada

Akihiro Misawa

Satoru Kato

Kazushi Noda

Teruo Akashi

Yoshio Shindo

Tatsuya Yamashita

Takayuki Kamiya

Shinya Nakamura

Mitsuhiro Nawashiro

Kuniyoshi Kondo

Yukitoshi Inui

Akari Kawasaki

Katsumi Kono

Kagenori Fukumura

Masataka Osawa

Ryoichi Hibino

Masatoshi Yamada

Taketoshi Minohara

Seitoku Kubo

Daisuke Inoue

Takashi Ohta

Takashi Yamamoto

Takao Kawamura

Mamoru Kobashi

Norio Sato

Osamu Yamanaka

Yoshio Sano

Naooki Miyamoto

Tsutomu Tsunooka

Kazuo Hasegawa

Hitoshi Takemura

Hideki Yasue

Tadanobu Iwasa

Akane Okada

Tokuyuki Takahashi

Yuji Kashihara

Seiji Yamaguchi

Tomoyoshi Motohiro

Mitsumasa Matsushita

Shin Sato

Nobuhisa Ohkawa

Tatsumi Hioki

Tadaoki Ichikawa

Hiroshi Sugihara

Tadaoki Okumoto

Naohiko Kato

Yoshio Takagi

Yutaka Taga

Hiromichi Kimura

Shinichi Takeshima

Yasuo Hojo

Morimichi Watanabe

Mitsuru Takada

Kazuhisa Ozaki

Takafumi Inagaki

Hiroshi Hattori

Toshiki Kanada

Yoshio Fuwa

Makoto Funahashi

Kotaro Hayashi

Hiroyuki Matsubara

Minoru Todo

Nobutada Sugiura

Akio Sato

Kazumasa Nakamura

Yasunari Nakamura

Masayoshi Ichikawa

Toshinori Takahashi

Tetsu Kachi

Kojiro Kuramochi

Akihito Hongo

Kazuyoshi Tomita

Satoshi Inagaki

Hideki Kokubu

Seiji Kojima

Yasuhiko Takeda

Youichi Hayakawa

Hideaki Shimazu

Shuji Inui

Makoto Tamaki

Kazumasa Ohsono

Shinichiro Tanaka

Takuya Ishii

Tetsuya Yamashita

Osamu Watanabe

Bing Yao

Norihito Kino

Hiroshi Mizuno

Yuji Tanaka

Keiichi Shimasaki

Hisao Yamaguchi

Kenichi Yamakoshi

Mitsushi Terakami

Takamasa Suzuki

Yasuaki Goto

A sliding member () includes a base material (), a porous sintered layer () provided on the base material (), and a resin layer () impregnated into the porous sintered layer () and provided on the porous sintered layer (). In the porous sintered layer (), a porosity decreases from a second surface (S) opposite to a first surface (S) closer to the base material, toward the first surface (S), the first surface and the second surface each being one of end surfaces in the thickness direction, and a decrease rate of the porosity in the thickness direction (Z) in a first region (E) occupying 50% or more of the thickness of the porous sintered layer () from the second surface (S) toward the first surface (S) is larger than a decrease rate of the porosity in the thickness direction (Z) in a second region (E) other than the first region (E) in the porous sintered layer ().

Sliding member

A light emitting device includes a substrate, a light emitting element mounted on the substrate, an uninterrupted annular sealing member installed in such a manner as to surround the light emitting element, a waterproof sheet installed in such a manner as to cover an upper side of the light emitting element and the sealing member, and transmit light emitted from the light emitting element, and an uninterrupted annular cover installed on the waterproof sheet, with a region of the cover being open above the light emitting element. The waterproof sheet is being fixed by sandwiching the waterproof sheet between the sealing member and the cover. A mounting region for the light emitting element on the substrate, which is being laterally surrounded by the sealing member while being covered by the waterproof sheet, is being hermetically sealed.

Light emitting device

A light-emitting device includes a circuit board including a wiring on a surface of a substrate, the wiring including a raised portion, and a light-emitting element mounted on the raised portion. When the light-emitting element is of a flip-chip type, an element electrode thereof is connected to the raised portion such that an edge of the element electrode on an outer periphery side of the light-emitting element is located outside of the raised portion in a top view and an exposed portion of the element electrode is covered with a white or transparent resin. When the light-emitting element is of a face-up type, an element substrate thereof is bonded to the raised portion such that the raised portion is located inside the element substrate in the top view and an exposed portion of a bottom surface of the element substrate is covered with a white resin.

Light-emitting device and method of manufacturing the same

To prevent cracks on a sealing glass or a substrate in a LED package in which a light-emitting device is sealed with a sealing glass. The LED package comprises a substrate, a LED mounted on the substrate, and a sealing glass for sealing a LED formed on the substrate. A wiring pattern being connected to an electrode of the LED is formed on the surface of the substrate. A back electrode pattern is formed on the rear surface of the substrate. A columnar via is formed in the substrate. Thus, the wiring pattern on the surface of the substrate and the back electrode pattern on the rear surface of the substrate are electrically connected. A softening point of the substrate is set higher than softening point of the sealing glass.

LED package

A light-emitting device includes a first light-emitting element, a phosphor, and a second light-emitting element having a peak wavelength between peak wavelengths of two peaks that define a deepest dip in a composite emission spectrum of the first light-emitting element and the phosphor.

Light-emitting device

A light-emitting device includes a first light-emitting element disposed on a substrate, a convex-shaped first sealing resin that includes an annular portion formed in a closed annular shape in a top view and seals the first light-emitting element, a second light-emitting element disposed on the substrate in a region surrounded by the annular portion of the first sealing resin, and a second sealing resin filled in the region surrounded by the annular portion so as to seal the second light-emitting element. One of the first and second sealing resin includes a phosphor particle or the first and second sealing resins include a phosphor particle to emit a different fluorescent color from each other.

A method for manufacturing a semiconductor light emitting device comprises a sealing step of sealing a semiconductor chip fixed on a lead frame with a sealing member, a removal step of removing the sealing member until a surface of the semiconductor chip becomes exposed, an irregularity formation step of forming fine irregularities on a bond surface formed in the removal step, and a bonding step of bonding a wavelength conversion member to the bond surface.

Method for manufacturing semiconductor light emitting device

A construction structure of wall surface includes: a hat joiner; and a building board. The hat joiner has a fixing plate portion and a design portion, and the building board has a design portion extending linearly on a surface. A joint at which the design portion of the hat joiner constitutes a design surface, and a design pattern at which the design portion of the building board constitutes a design surface, are formed in a same direction, by arranging the building board in plurality to left and right, or above and below, of the design portion of the hat joiner. A width of the joint at the design portion of the hat joiner is the same as a width of each of the design portions on the surface of each of the building boards.

Construction structure of wall surface

In an LED lamp device including a surface mount device type of LED lamp, an LED lighting circuit protecting part, a resistive element, a circuit part, and a case part, the circuit part has a metal plate which is embedded in the case part in a state where the metal plate is partially exposed, the LED lamp is mounted on the exposed portion on a front side of the metal plate, and the resistive element is mounted on the exposed portion on a rear side of the metal plate.

LED lamp device

It is suppressed that nanoparticles generated in an internal combustion engine are discharged into the atmosphere. In a cylinder or an exhaust system of the internal combustion engine, microparticles having a particle diameter larger than that of the nanoparticles are generated, and the nanoparticles generated in the internal combustion engine are adsorbed by the microparticles, thereby increasing the diameter of the nanoparticles. The microparticles can be generated in the cylinder as the soot, for example. Additionally, by providing a carbon microparticle generation device in the exhaust system, the microparticles can be generated, too. By making the nanoparticles adsorbed by the microparticles and increasing the diameter of the nanoparticles, discharging of the nanoparticles can be suppressed.

Control device and exhaust purification method of internal combustion engine

An optical fiber laser, according to the present invention, has an optical fiber including a core to which a rare earth element is added and a clad disposed around the core, and also has an excitation light source for emitting excitation light incident on a side of the optical fiber. The optical fiber has a corrugated shape on the outer circumference of the clad along the longitudinal direction thereof; and the optical fiber is wound in a spiral form and is bundled in such a way that adjacent sides of the clad are brought into contact with one another.

Optical fiber laser and exciting method using same

A joint member capable of forming a joint portion that can be easily constructed and has an excellent design and a high waterproof capacity even if it is manufactured at a low cost. A joint member 1 is composed of a hat joinerand a joint cover, and the hat joineris composed of a base plateto be fastened to the body side of building frame and a convex portionprotruding from the base plateto the surface side. The joint coveris provided with a joint groove portionthat covers a top surfaceof the convex portionin the course of construction, and a lower edge portionextending from the lower end of the joint groove portionand brought into contact with the surface of an external wall panelB in the course of construction. An elastic water proof materialis attached to the rear surface of the lower edge portion

Joint member

A transparent vessel is filled with a mixture solution containing a first photo-curable resin of a low refractive index and a second photo-curable resin of a high refractive index different in curing mechanism. When light at a wavelength capable of curing the first photo-curable resin but incapable of curing the second photo-curable resin is applied to the mixture solution through an optical fiber, the first photo-curable resin can be cured in a state in which the second photo-curable resin is enclosed in the cured first photo-curable resin. Because the refractive index increases according to curing, a self-condensing phenomenon can be generated so that an optical path portion is formed. The optical path portion emits leakage light to its surroundings to thereby form an outer circumferential portion. Then, all uncured resins in the mixture solution are cured. The outer circumferential portion containing a high percentage of the cured first photo-curable resin serves as a clad because the refractive index of the outer circumferential portion is lower than that of the optical path portion.

Material composition for producing optical waveguide and method for producing optical waveguide

A light source comprising a light emitting diode comprising a GaN-based compound and having a single quantum well structure, and a driving voltage source for applying a pulse voltage to the light emitting diode, wherein a voltage at a low level of the pulse voltage is set to a voltage lower than a voltage at which a fall time of the light emitting diode is made the longest.

Light source

An LED lamp apparatus includes an LED and a light diffuser located on a light emission side of the LED. The light diffuser is made of at least one light transmittable material and has a light diffusing member at a peripheral portion of a light passing area of the LED. Alternatively, the light diffuser may be formed of at least one light transmittable material, and the light diffusing member may be located at a center portion of the light passing area of the LED.

LED lamp apparatus

Growing community of inventors

Aichi, Japan

Hiroshi Ito