Dic Corporation

Hiroshi Isozumi

Masanori Kasai

Hideki Etori

Shou Inagaki

Masayoshi Kotake

Yasuhiro Sente

Norimasa Fukazawa

Hideyuki Murata

Toshihiro Ebine

There is provided a conductive paste for screen printing. The conductive paste includes: metal nanoparticles (Y) having a surface coated with a polymer compound having a branched polyalkyleneimine chain and a polymer chain selected from the group consisting of a polyoxyalkylene chain, a polymer chain composed of a polyvinyl alcohol, a polymer chain composed of a water-soluble poly(meth)acrylic acid, a polyacylalkyleneimine chain, and a polymer chain composed of a polyacrylamide; an aliphatic monocarboxylic acid having 6 to 10 carbon atoms and/or succinic anhydride; and an organic solvent (B). A polyalkylene glycol is used as the organic solvent (B).

Conductive paste for screen printing

There is provided a conductive paste for screen printing. The conductive paste includes: metal nanoparticles (Y) having an average particle diameter of 1 to 50 nm and protected with a polymer compound having a branched polyalkyleneimine chain and a polymer chain selected from the group consisting of a polyoxyalkylene chain, a polymer chain composed of a polyvinyl alcohol, a polymer chain composed of a water-soluble poly(meth)acrylic acid, a polyacylalkyleneimine chain having a hydrophilic substituent, and a polymer chain composed of a polyacrylamide; metal particles (Z) having an average particle diameter of 200 to 600 nm; a deprotecting agent (A) for the metal nanoparticles; and an organic solvent (B). An aliphatic monocarboxylic acid having 6 to 10 carbon atoms is used as the deprotecting agent (A) for the metal nanoparticles. A polyalkylene glycol is used as the organic solvent (B).

An insulating ink composition for forming an insulating film, which sufficiently achieves a low calcination temperature, solvent resistance and an insulating property, is provided. Furthermore, an ink composition for forming an insulating film which can form, by the printing method, fine insulating film patterns necessary for formation of highly integrated organic transistors is provided. The present invention provides an ink composition which forms an insulating film, and includes an organic solvent, a polyvinylphenol-based resin, an epoxy resin and a cross-linking aid. Particularly, the ink composition is a composition wherein the organic solvent includes an organic solvent which has a vapor pressure of 11.3&#xd7;10Pa or higher at 20&#xb0; C. and a boiling point of lower than 115&#xb0; C. under atmospheric pressure and an organic solvent which has a vapor pressure of less than 11.3&#xd7;10Pa at 20&#xb0; C. and a boiling point of 115&#xb0; C. or higher under atmospheric pressure; the ink composition includes a extender component having a volume average particle diameter of 1 to 150 nm and a silicone-based releasing component.

Ink composition for forming insulating film and insulating film formed from the ink composition

There is provided an ink composition for forming a light shielding film in an organic semiconductor device which is capable of stably forming a fine pattern when forming a finely patterned light shielding film by the letterpress reverse printing method or microcontact printing method, which can be baked at a temperature equal to or less than the substrate heatproof temperature, and which is also capable of providing light shielding property and mechanical strength, the ink composition for forming a light shielding film in an organic semiconductor device which is an ink composition for forming a light shielding film in an organic semiconductor device comprising a black pigment; a resin component; a surface energy modifier; a quick-drying organic solvent; a slow-drying organic solvent; and a mold releasing agent, wherein the resin component comprises a solid resin that is in a solid state at 200&#xb0; C. or less and a liquid resin that is in a liquid state at 10 to 50&#xb0; C. at a ratio (solid resin/liquid resin) of 0.2 to 0.6.

Ink composition for forming light shielding film of organic semiconductor device, method for forming light shielding film, and organic transistor device having light shielding film

The present invention provides phthalocyanine nanowires having a minor diameter of 100 nm or less and a ratio (length/minor diameter) of length to minor diameter of 10 or more, an ink composition characterized by containing, as essential components, the phthalocyanine nanowires and an organic solvent, a film including the phthalocyanine nanowires, and an electronic element including a film. Since by using an ink composition containing the phthalocyanine nanowires of the present invention a phthalocyanine film can be formed by a wet process such as coating or printing, a break-proof, lightweight, low-cost electronic element can be provided on a flexible plastic substrate.

Phthalocyanine nanowires, ink composition and electronic element each containing same, and method for producing phthalocyanine nanowires

The present invention provides a conductive ink for forming a fine conductive pattern on a substrate by letterpress reverse printing. In particular, the conductive ink enables the pattern to be formed stably without the occurrence of transfer failures and is able to impart superior conductivity by low-temperature baking. The conductive ink, which contains substantially no binder component, comprises as essential components thereof conductive particles having a volume average particle diameter (Mv) of 10 to 700 nm, a release agent, a surface energy regulator and a solvent component, the solvent component being a mixture of a solvent having a surface energy at 25&#xb0; C. of 27 mN/m or more (high surface energy solvent) and a volatile solvent having a boiling point at atmospheric pressure of 120&#xb0; C. or lower (low boiling point solvent), and the surface energy of the ink at 25&#xb0; C. is 10 to 21 mN/m.

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Tokyo, Japan

Hiroshi Isozumi