Denso Corporation

Aisin Corporation

Other

Toyota Jidosha Kabushiki Kaisha

Toyoda Gosei Co., Ltd.

Nifco Inc.

Hiroshi Ishiyama

Keishi Morita

Chiharu Totani

Toshinori Tanase

Daisuke Harada

Yoshiharu Furukawa

Shigenobu Nakamura

Hiroyuki Tajima

Takahisa Kaneko

Yasuo Ochiai

Hiroki Nakajima

Yoshikazu Suzuki

Yuichi Shirase

Fumitake Kobayashi

Yutaka Nagai

Yasuyuki Sakai

Kenta Tamabayashi

Minoru Chida

Norio Urushi

Etsuji Saito

Tadao Tanaka

Hidehiko Yasui

Kenichi Nakajima

Hirofumi Ooyama

Mitsuyoshi Ono

Kenji Omote

A rotor support member includes: a tubular portion having a tubular shape extending along an axial direction and supporting a rotor of a rotary electric machine; and a flange portion provided to extend along a radial direction on an inner side in radial direction with respect to tubular portion at a position adjacent to a first engagement device on a first side in the axial direction, and connected to tubular portion. The flange portion includes a cylinder forming portion protruding to first side in the axial direction so as to form a cylinder portion on which a first piston portion of the first engagement device slides. A rotation sensor includes a rotating body supported by an outer peripheral surface of cylinder forming portion on an outer side in the radial direction, and a fixed body disposed on the outer side in the radial direction with respect to the rotating body.

Vehicle drive device

A first inner support member that supports a first friction member of a first engagement device from an inner side in a radial direction includes a tubular support portion having a tubular shape extending along an axial direction and supporting the first friction member, and a radially extending support portion provided to extend to the inner side in the radial direction from the tubular support portion. The radially extending support portion is connected to the input member such that the input member and the first inner support member rotate integrally, and a first bearing that rotatably supports a rotor support member is disposed on a first side in the axial direction with respect to a rotor and is disposed on an outer side in the radial direction with respect to the tubular support portion.

A vehicle drive device includes: rotary electric machine; rotor support member; friction engagement device disposed at position on inner side in radial direction with respect to a rotor and at which friction engagement device overlaps rotor as viewed in radial direction along radial direction; and a first and second bearing that rotatably support rotor support member. Friction engagement device has a first and second engagement device disposed side by side in axial direction. First piston portion of first engagement device and a second piston portion of second engagement device are disposed separately on both sides in axial direction across a first and a second friction member. First bearing is disposed at a position at which first bearing overlaps first piston portion as viewed in the radial direction. Second bearing is disposed at a position at which second bearing overlaps second piston portion as viewed in the radial direction.

A semiconductor module having an integrated structure is manufactured by mounting a semiconductor chip on the side of a surface of a cooling plate via an insulating material, and by molding the semiconductor chip and the cooling plate by a resin-molded member. This method includes the steps of: (a) forming a sprayed insulating film as the insulating material on a surface of the cooling plate; (b) forming a sprayed conductive film on a face of the sprayed insulating film opposite to a face where the cooling plate is provided; (c) checking whether the sprayed conductive film is insulated from the cooling plate by using the sprayed conductive film and the cooling plate as electrodes and applying voltage therebetween; and (d) mounting the semiconductor chip on the upper side of the sprayed conductive film when the sprayed conductive film is insulated, and then resin-molding the semiconductor chip and the cooling plate.

Method of manufacturing semiconductor modules and semiconductor module

An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.

Electronic power converter and mounting structure of semiconductor device

Electric power converter and mounting structure of semiconductor device

A power stack includes cooling pipes and semiconductor modules which are alternately laminated. Each cooling pipe includes an inside space dissected into cooling passages in which coolant flows. Both surfaces of the semiconductor module in a laminating direction are brought into contact with surfaces of neighboring cooling pipes. The semiconductor modules are classified into a plurality of groups mutually differentiated in their heat generation rates. And, any two semiconductor modules belonging to the same group having the highest heat generation rate are spaced from each other so that a cooling pipe is not sandwiched between these semiconductor modules in the laminating direction.

Power stack

A semiconductor module includes a semiconductor chip having a first surface and a second surface; a first electrode plate contacting the first surface of the semiconductor chip; a second electrode plate contacting the second surface of the semiconductor chip; and a resin mold for sealing the first and second electrode plates and the semiconductor chip. The resin mold includes an inner pressure release portion for releasing a pressure in the resin mold.

Semiconductor module having inner pressure release portion

A semiconductor unit has semiconductor modules and cooling members. The semiconductor module includes power devices with a flat shape, the first electrode bonded to the first device surface, the second electrode bonded to the second device surface, the first terminals connecting to a device control circuit, the second terminals connecting to a device driving circuit, and mold resin unifying the devices, the first electrode, the second electrode, the first terminals, and the second terminals in a unit. The mold resin is so formed that the first electrode face and second electrode face are exposed. The cooling members sandwich the semiconductor modules through insulating members. The semiconductor unit has the first electrode face of the first electrode coplanar with the first resin face of the mold resin, and/or the second electrode face of the second electrode coplanar with the second resin face of the mold resin.

Semiconductor unit with cooling system

A holding mechanism for a rotating member includes a main member having a rotating shaft; a leg member rotationally attached to the rotating shaft to change from a housed state to a stand-up state; and a stopper formed on the main member at a position away from the rotating shaft. The stopper holds the stand-up state of the leg member. The leg member in the stand-up state can be rotated to the housed state by pushing the leg member.

Holding mechanism of rotating member

A guide plate,is placed at a guiding and holding member,which is fixed to a region of an inner panel,adjacent to the upper end portion,A of a B pillar garnish. The guide plate,has a base end portion,A which extends from the vehicle interior side to the vehicle exterior side. The base end portion,A is fixed to the guiding and holding member,. The cross sectional configuration of the guide plate,when viewed from the vehicle front is formed in a substantial U shape which surrounds the folded air bag body and whose opening portion faces the outer side of the vehicle interior. When the air bag body is expanded, the guide plate,is extended as well so as to cover the upper end portion,A of the center pillar garnish,. As a result, the air bag body can expand more smoothly, and the displacement of the center pillar garnish from the vehicle body can be prevented.

Structure for placement of head protecting air bag apparatus

An air bag cover is formed of synthetic resin and is connected to and held by the body of a car in a plurality of discontinuous portions thereof along the peripheral edge of an opening formed on the interior side of the car in such a manner that the air bag cover not only can cover an air bag folded in the peripheral edge of the opening on the car interior side, but also, when an air bag main body of the air bag is developed and expanded, can be so opened and moved as to allow the air bag main body to project toward the opening side. The air bag cover further includes a restricting wall which projects toward the body of the car in such a manner that it can connect together these connecting/holding portions while the restricting wall is disposed on the back surface side of the air bag cover, in more particular, on the side of the folded air bag main body that is distant from the opening and on the opening side of connecting/holding portions.

Air bag cover

Mounting portions of an air bag body are respectively nipped by positioning plates which are each fastened and fixed to a pillar inner panel by a weld nut and a bolt via the plates. Caulking portions are formed on the plates so that the mounting portions of the air bag device are in advance fixed between the plates. A convex portion is formed on the plate, and with the convex portion being engaged with a hole formed in the pillar inner panel, relative rotation of the plate and a vehicle body is prevented. As a result, rotation of the air bag body in a direction in which the mounting portions are fastened, which occurs during mounting of the air bag body to the vehicle body, can be prevented.

Growing community of inventors

Chiryu, Japan

Hiroshi Ishiyama