Nec Corporation

Hiroshi Ise

Makoto Hamada

Toshiaki Shironouchi

A semiconductor chip mounted on a lead frame is sealed in a synthetic resin package through a molding process, and pressure is applied to synthetic resin softened from granular. synthetic resin so as to evacuate the air from the synthetic resin before injecting the synthetic resin into cavities formed in a molding die, thereby preventing the synthetic resin package from void.

Process of packaging semiconductor chip in synthetic resin produced from pressurized granular synthetic resin and molding die used therein

Semiconductor chips are arranged on a panel in matrix, scaled in a piece of synthetic resin through a transfer molding, and the resultant structure is separated into dices through a cutting operation so that small semiconductor devices are economically produced.

Semiconductor device with economical compact package and process for fabricating semiconductor device

A metal mold for sealing a semiconductor device with a resin and including a shutter gate mechanism. The mold drives a shutter gate pin by using the ejection stroke of a conventional seal press, and therefore eliminates the need for an extra drive source. It follows that the mold can be implemented only if an existing facility is slightly modified, and it is lower in cost than conventional metal molds.

Growing community of inventors

Tokyo, Japan

Hiroshi Ise