Canon Kabushiki Kaisha

International Business Machines Corporation

Fujitsu Corporation

Kyocera Corporation

J-devices Corporation

Murata Manufacturing Co., Ltd.

Nissan Motor Company Limited

Schlumberger Technology Corporation

Sap Se

Mitsui Toatsu Chemicals, Incorporated

Chiyoda Corporation

Anest Iwata Corporation

Fuji Oil Holdings Inc.

Canon Kasei Kabushiki Kaisha

Hiroshi Inoue

Atsushi Mizutome

Akira Tsuboyama

Hideo Kanno

Osamu Taniguchi

Tadashi Mihara

Yoshiyuki Osada

Yutaka Inaba

Katsuhiro Miyamoto

Shinichi Yamashita

Hideaki Komatsu

Osamu Yuki

Masahiro Terada

Shuntaro Aratani

Kazunori Katakura

Mitsutaka Sato

Masaaki Imaizumi

Toshio Hamano

Moriyoshi Ohara

Toshiyuki Nakagawa

Peng Wu

Masaki Yamada

Junichiro Kanbe

Atsushi Ikeda

Yoshihiro Onitsuka

Hiroshi Netsu

Mitsuru Maeda

Masahiro Baba

Takashi Kato

Keiichi Betsui

Atsushi Iwasaki

Masahiko Enari

Yuichi Matsumoto

Tohru Takahashi

Tsutomu Yamate

Takashi Ono

Mauricio J Serrano

Kenta Okino

Kazutaka Nakamura

Yoshikazu Yokomizo

Tetsuo Hino

Takashi Tsunoda

Takashi Miyake

Eiji Sakamoto

Hiroaki Watanabe

Takumi Furukawa

Tadashi Yamakawa

Yutaka Inoue

Akio Yoshida

Hiroshi Satomura

Tomohito Taniguchi

Aiko Enomoto

Naoki Fuei

Masamichi Ohshima

Masaki Kuribayashi

Toshiaki Shingu

Seiichi Orimo

Yoshitsugu Katoh

Tetsuya Fujisawa

Mamoru Tanaka

Takao Moriyama

Yoshihiro Kubota

Mitsuo Abe

Hiroshige Hayashizaki

Kazumi Suga

Noriaki Kuroda

Osamu Yamagata

Akio Katsumata

Satoshi Omata

Masaaki Seki

Yuya Tomomizu

Norifumi Muranaka

Mitsutoshi Kuno

Masafumi Kyogaku

Yoshitaka Aiba

Ryuji Nomoto

Kenya Terada

Akira Okada

Tsutomu Ando

Satoshi Yoshihara

Yoshio Yoshida

Shinji Doi

Yoshihiko Ikemoto

Masaki Waki

Yukihiko Sohda

Hiroaki Matsubara

Seiji Tsuru

Tomoshige Chikai

Kazuhide Nagamine

Hisao Kato

Kazuhiko Mitobe

Toshimitsu Nakazawa

Katsuhiro Hayashida

Yoshitsugi Kikkawa

Jiro Takeda

Kiminori Ishido

Toshiaki Moriya

Takashi Shigehisa

Tadayuki Watanabe

Satoshi Sakuragi

An electro-conductive layer of an electrophotographic electro-conductive member has a matrix-domain structure. The matrix contains a first rubber. The domain contains a second rubber and electro-conductive particles. Where &#x3bc; represents an average of ratios of the cross-sectional area of the electro-conductive particles contained in each of the domains to the cross-sectional area of each of the domains appearing on a cross-section of the electro-conductive layer in a thickness direction, and &#x3c3; represents a standard deviation of the ratios, &#x3c3;/&#x3bc; is 0 or more and 0.4 or less, and &#x3bc; is 20% or more and 40% or less. At least eight of samples with a first cubic shape 9 &#x3bc;m on a side, which are sampled at arbitrary nine positions on the electro-conductive layer, satisfy the specified condition.

Electro-conductive member, method for producing same, process cartridge and electrophotographic image forming apparatus

A peptide having an effect of suppressing hepatic lipogenesis, where a peptide is one or two or more peptides selected from 11 dipeptides (Ala-Gly, His-Asn, His-Ser, His-Thr, His-Trp, Val-Met, Trp-Glu, Trp-Lys, Tyr-Lys, Tyr-Ser and Tyr-Tyr) and 25 tripeptides (Val-Ile-Leu, Gly-Ser-Leu, Val-Leu-Gln, His-Ala-Gln, Arg-Ala-Val, Lys-Leu-Gly, Ile-Val-Ile, Lys-Pro-Ile, Leu- Val-Ile, Leu-Arg-Asp, Gln-Glu-Glu, Ser-Gly-Glu, Arg-Trp-Phe, Asp-Phe-Phe, Asp-Val-Phe, Pro-Phe-Tyr, Phe-Ile-Arg, Asn-Gly-Arg, Ile-Ile-Pro, Ile-Asp-Arg, Ile-His-Arg, Ile-Asp-Arg, Asn-Arg-Val, Ser-Ser-Val and Val-Phe-Val), is provided. The peptide may be used in a food composition for suppressing hepatic lipogenesis and an agent for suppressing hepatic lipogenesis.

Food composition for suppressing hepatic lipogenesis

An HEMSprovided in a consumer having a gas power-generatorrequiring start-up power for starting power generation and power supply means (PV, storage battery, PCS, distribution board) for supplying power to a load, and controlling the gas power-generatorand the power supply means, detects supply power that can be supplied by the power supply means; and controls the power supply means such that the supply power does not fall below the start-up power of the gas power-generator

Control device, power control system, and power control method

A control apparatus includes a control unit which instructs a constant temperature mode to the fuel cell unit as one of operation modes, the constant temperature mode being a mode for performing an control to cover power consumption of the auxiliaries by power supplied from the outside and an control to keep a temperature of the power generation unit constant within a prescribed temperature range. In the constant temperature mode, power output from the power generation unit is at least smaller than the power consumption of the auxiliaries.

Control apparatus, fuel cell unit and control method

The present invention provides a technique to control a distribution of electric power depending on electric power consumption of each of a plurality of electric power receiving apparatuses. An electric power supply apparatus includes an acquisition unit configured to acquire information associated with electric power consumption of each of the plurality of electric power receiving apparatuses, a determination unit configured to determine the distribution of electric power to the plurality of electric power receiving apparatuses based on the information acquired by the acquisition unit such that a greater amount of distribution of electric power is assigned to an electric power receiving apparatus having greater electric power consumption, and an electric power supply unit configured to supply electric power to each of the plurality of electric power receiving apparatuses according to the distribution of electric power determined by the determination unit.

Electric power supply apparatus, electric power receiving apparatus, method of controlling electric power supply apparatus, and method of controlling electric power receiving apparatus

A semiconductor device including: a support plate; a semiconductor chipmounted on one principal surface of the support platevia an adhesive layer, with the element circuit surface of the chip being directed upward; an insulation material layerthat seals the semiconductor chipand the periphery of the semiconductor chip; openings formed on an electrode arranged on the element circuit surface of the semiconductor chipin the insulation material layer; conductive portionsformed in the openings so as to be connected to the electrode of the semiconductor chip; a wiring layerformed on the insulation material layerso as to be connected to the conductive portionsand partially extending to the peripheral region of the semiconductor chip; and external electrodesformed on the wiring layer

Semiconductor device and method of manufacturing semiconductor device

A method and apparatus are provided to perform efficient merging operations of two or more streams of data by using SIMD instruction. Streams of data are merged together in parallel and with mitigated or removed conditional branching. The merge operations of the streams of data include Merge AND and Merge OR operations.

Merging sorted data arrays based on vector minimum, maximum, and permute instructions

A method of manufacturing a semiconductor device having an insulating substrate, a semiconductor element which is mounted on one main surface of the insulating substrate via adhesive, with an element circuit surface of the semiconductor element facing upwards, a first insulating material layer (A) which seals the element circuit surface of the semiconductor element and the insulating substrate peripheral thereto, a first metal thin film wire layer provided on the first insulating material layer (A) and a portion of which is exposed to an external surface, a first insulating material layer (B) provided on the first metal thin film wire layer, a second insulating material layer provided on a main surface of the insulating substrate where the semiconductor element is not mounted, a second metal thin film wire layer provided inside the second insulating material layer.

Semiconductor device, semiconductor stacked module structure, stacked module structure and method of manufacturing same

A semiconductor device, having an insulating substrate; a semiconductor element which is mounted on one main surface of the insulating substrate via adhesive, with an element circuit surface of the semiconductor element facing upwards; a first insulating material layer which seals the element circuit surface of the semiconductor element and the insulating substrate peripheral thereto; a first metal thin film wire layer which is provided on the first insulating material layer (A) and a portion of which is exposed to an external surface; a first insulating material layer (B) which is provided on the first metal thin film wire layer; a second insulating material layer which is provided on a main surface of the insulating substrate where the semiconductor element is not mounted; and a second metal thin film wire layer which is provided inside the second insulating material layer.

A semiconductor device containing: a semiconductor element; a support substrate; an insulating material layer for sealing the semiconductor element and a periphery thereof; a metal thin film wiring layer provided in the insulating material layer, with a part thereof being exposed on an external surface; and metal vias provided in the insulating material layer and electrically connected to the metal thin film wiring layer. The semiconductor element is provided in a plurality of units and the respective semiconductor elements are stacked via an insulating material such that a circuit surface of each semiconductor element faces the metal thin film wiring layer, and electrode pads of each semiconductor element are exposed without being hidden by the semiconductor element stacked thereabove.

Semiconductor device and manufacturing method thereof

An apparatus includes a processor for executing instructions at runtime and instructions for dynamically compiling the set of instructions executing at runtime. A memory device stores the instructions to be executed and the dynamic compiling instructions. A memory device serves as a trace buffer used to store traces during formation during the dynamic compiling. The dynamic compiling instructions includes a next-executing-cycle (N-E-C) trace selection process for forming traces for the instructions executing at runtime. The N-E-C trace selection process continues through an existing trace-head when forming traces without terminating a recording of a current trace if an existing trace-head is encountered.

Adaptive next-executing-cycle trace selection for trace-driven code optimizers

A wireless communication apparatus () includes a broadcast/multicast reception determination unit () for determining whether data distributed by broadcast/multicast is being received or not; a wireless session close process unit () for performing a wireless session close process when a wireless session close timer is expired; and a control unit () for controlling the wireless session close process unit to hold the wireless session close process activated based on expiration of the wireless session close timer until reception of data distributed by broadcast/multicast is completed, in case that it is determined that data distributed by the broadcast/multicast is being received when the wireless session close timer is expired.

Wireless communication apparatus

An execution trace of building blocks of computer code includes a head building block at which the execution trace starts, and a tail building block at which the execution trace ends. The building blocks are executable in a sequence from the head building block to the tail building block. The execution trace is truncated at a particular building block of the execution trace, which becomes the tail building block. The particular building block can correspond to a head building block of an additional execution trace, and/or to a loop header building block of a loop within the execution trace and at which the loop is entered. The execution trace is a compilation unit on which basis a trace-based compiler computer program generates an executable version of the code at least by compiling these units.

Execution trace truncation

An object is to calculate an accurate motion vector with a small computational effort. To this end, provided is a system for compressing a motion picture generated by projecting objects onto a screen, the objects moving relatively to the screen in a 3D space, the system including: a motion calculating component which calculates a motion vector of the object within the screen by projecting onto the screen a motion of the object in the 3D space between a time corresponding to a compression target frame and a time corresponding to another frame; and a compressing component which compresses the compression target frame by motion compensation based on the motion vector.

Compression system, program and method

A wireless communication method and a wireless communication apparatus capable of efficiently improving communication throughput of a second wireless communication system while securing a capturing capability of informative information in a first wireless communication system are provided. A transmitting/receiving unit () capable of transmitting/receiving information through first and second wireless communication systems (1x and EVDO) and a receiving unit () capable of receiving information through the first and second wireless communication systems and whose reception gain in the first wireless communication system is smaller than the transmitting/receiving unit are used to detect that a reception sensitivity of informative information notifying a reception by the transmitting/receiving unit through the first wireless communication system has exceeded a first threshold or a second threshold set in accordance with a reception gain difference between the transmitting/receiving unit and the receiving unit when information is being transmitted/received by the transmitting/receiving unit through the second wireless communication system, and to switch reception of the informative information from the transmitting/receiving unit to the receiving unit.

Wireless communication method and wireless communication apparatus

Growing community of inventors

Yokohama, Japan

Hiroshi Inoue