Kanken Techno Co., Ltd.

Toagosei Company, Ltd.

Hiroshi Imamura

Tsutomu Tsukada

Michihiko Yanagisawa

Hiroaki Kaneshiro

Hiroshi Suzuki

Hiroaki Takeuchi

Katsuyoshi Harada

Isamu Nagai

Koji Ishikawa

Masashi Maeda

Masamitsu Hagio

Hideharu Ohmae

Akira Moriya

Takashi Kataoka

Hiroki Kuzuoka

Shunsuke Yanai

Osamu Hamakawa

Hideki Okamoto

Akihisa Yoshida

A cylindrical heating unit of an exhaust gas processing device is installed in a reactor. The cylindrical heating unit is provided with an exhaust gas introduction port provided in an insertion base part and a heated exhaust gas outlet provided at insertion end. The cylindrical heating unit includes a hollow cylinder, insulators, electric heaters, and holding members. The hollow cylinder has a double structure with an inner cylinder and an outer cylinder made of metal. A plurality of the insulators surround the inner cylinder and are provided at intervals from each other in a heater installation space between the inner cylinder and the outer cylinder. Electric heaters are mounted to the insulators. The holding members are attached to one of the inner cylinder and the outer cylinder or both and hold the insulators in the heater installation space.

Cylindrical heating unit and exhaust gas processing device including the cylindrical heating unit

The present invention provides an energy-efficient method and apparatus that can achieve exhaust gas abatement with a minimum use of diluent nitrogen gas. More specifically, the present invention is directed to a method and apparatus for exhaust gas abatement under reduced pressure, in which an exhaust gas supplied from an exhaust gas source via a vacuum pump is decomposed by heat of a high-temperature plasma under a reduced pressure.

Method for exhaust gas abatement under reduced pressure and apparatus therefor

An apparatus for exhaust gas abatement under reduced pressure includes a reaction tube having, in an interior thereof, an exhaust gas treatment space in which an exhaust gas supplied from an exhaust gas source via a vacuum pump is heated by an electric heater or excited by a plasma for decomposition and/or reaction treatment. The apparatus also includes a downstream vacuum pump connected to an exhaust gas outlet located downstream of the reaction tube to reduce a pressure in a region located downstream of an outlet of the vacuum pump and including the interior of the reaction tube. The downstream vacuum pump is a water-sealed pump. The apparatus further includes a water-washing unit for washing a downstream end of an exhaust gas flow path in the reaction tube with washing water. The washing water supplied by the water-washing unit is reused as seal water for the downstream vacuum pump.

Apparatus for exhaust gas abatement under reduced pressure

An exhaust gas processing device preheats processing target exhaust gas in the presence of moisture with heat from at least either an electric heater or a heat exchanger and subsequently thermally decomposes the exhaust gas with an atmospheric pressure plasma. A device main body has a heating decomposition chamber therein. A plasma generator is installed at a top surface portion of the device main body. A reactor has a cylindrical shape and is installed within the device main body such that an upper end opening thereof is directed toward a plasma emission port of the plasma generator. A moisture supply unit is provided at an inlet side of the device main body. At least either the electric heater or the heat exchanger is disposed in a first space.

Exhaust gas processing device

Provided is an ammonia detoxification device that, when detoxifying ammonia by thermal decomposition, is capable of preventing the generation of nitrogen oxides. That is, the problem is solved by configuring the ammonia detoxification device using: an electric heater; an ammonia decomposition chamber that accepts an ammonia-containing gas to be treated and thermally decomposes the ammonia in the absence of oxygen using heat from the electric heater; a thermally decomposed gas-burning chamber that accepts the nitrogen- and hydrogen-containing gas to be treated that has been generated by the thermal decomposition of the ammonia and discharged from the ammonia decomposition chamber, and an air-supplying means for supplying air from the outside into the thermally the thermally decomposed gas-burning chamber to burn the hydrogen.

Ammonia detoxification device

Hexachlorodisilane is decomposed into hydrochloric acid, silicon dioxide and water by introducing hexachlorodisilane-containing flue gas into a reaction region without moistening the flue gas and by supplying oxygen-containing gas that also contains a small amount of moisture to the reaction region maintained at a temperature at which hexachlorodisilane decomposes.

Method for detoxifying HCD gas and apparatus therefor

A method of removing harmful components of a perfluorocarbon gas or a perfluorocompound including the step of mixing at least one of a hydrocarbon gas and NHgas with an exhaust gas containing a perfluorocarbon or a perfluorocompound discharged from manufacturing equipment. The method also includes the step of thermally decomposing the resulting mixed gas in a non-oxidizing atmosphere.

Method for removing harmful components in an exhaust gas

Apparatus for removing harmful components of a perfluorocarbon gas or a perfluorocompound. The apparatus includes a first water scrubber for washing an exhaust gas containing a perfluorocarbon or a perfluorocompound discharged from a manufacturing equipment. The apparatus further includes a gas decomposer-burner tower having a gas decomposer room connected to an upper end of the first water scrubber for mixing at least one of a hydrocarbon gas and NH gas with the exhaust gas washed by the first water scrubber and thermally decomposing a resulting mixed gas. The apparatus further includes a burner room, a heater below the heater in the gas decomposer room and the burner room, a grating below the heater in the gas decomposer room and the burner room. The apparatus further includes a pipe for supplying a reducing atmosphere forming agent to the gas decomposer room, an air-feeding pipe for supplying air to the burner room, a second water scrubber connected to a lower end of the burner room, and a water cistern on which the first and second scrubbers stand.

Method and apparatus for removing harmful components in an exhaust gas

An apparatus for removing harmful components in a semiconductor exhaust gas includes: a first water scrubber for washing with water a gas to be processed; a gas decomposer tower disposed downstream of the first water scrubber; a second water scrubber disposed downstream of the gas decomposer tower; and a burner tower disposed downstream of the second water scrubber for burning the processed gas, wherein the gas decomposer tower is capable of thermally decomposing a mixture gas of a saturated or unsaturated hydrocarbon gas and a perfluorocarbon or a perfluoride compound by maintaining the mixture gas at a temperature of 600.degree. C. or more in the absence of separated O.sub.2.

Apparatus for removing harmful components in a semiconductor exhaust gas

A method for removing harmful substances of an exhaust gas discharged from a semiconductor manufacturing process. The method includes the steps of: removing at least one of a water-soluble component, a hydrolyzable component and dust contained in the exhaust gas discharged from semiconductor manufacturing equipment by water scrubbing; heating the water-scrubbed exhaust gas to thermally decompose a thermally-decomposable component contained therein and removing dust generated by the thermal decomposition from the thermally-decomposed exhaust gas by water scrubbing to render the thermally decomposed exhaust gas into a clean exhaust gas.

Method for removing harmful substances of exhaust gas discharged from

Apparatus for removing harmful substances of an exhaust gas discharged from a semiconductor manufacturing process are provided. The apparatus includes a mechanism for: removing at least one of a water-soluble component, a hydrolyzable component and dust contained in the exhaust gas discharged from semiconductor manufacturing equipment by water scrubbing; heating the water-scrubbed exhaust gas to thermally decompose a thermally-decomposable component contained therein; and removing dust generated by the thermal decomposition from the thermally-decomposed exhaust gas by water scrubbing to render the thermally decomposed exhaust gas into a clean exhaust gas.

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Nagaokakyo, Japan

Hiroshi Imamura