Dowa Metaltech Co., Ltd.

Tokyo University of Science Foundation

Hiroshi Hyodo

Hisashi Suda

Akira Sugawara

Takuya Hashimoto

Kohei Soga

Hiroshi Yorifuji

Wanqing Jiang

A copper alloy sheet material having improved etching characteristics contains (in mass %) Ni: 1.00 to 4.50%, Si: 0.10 to 1.40%, and optionally one or more kind of Co, Mg, Cr, P, B, Mn, Sn, Ti, Zr, Al, Fe, Zn, and Ag. The sheet material has an area ratio S/Sof 0.40 or more in an EBSD measurement on a cross section perpendicular to a rolling direction, wherein Srepresents area of a region satisfying at least one of conditions of a crystal orientation difference from the S1 {241} <112>orientation of 10° or less or a crystal orientation difference from the S2 {231}<124>orientation of 10° or less, and Srepresents an area of a region having a crystal orientation difference from the Brass {011}<211>orientation of 10° or less.

Cu—Ni—Si-based copper alloy sheet material, method for producing same, and current-carrying component

[Object] To provide a Cu—Ti-based copper alloy sheet material having a strength, an electrical conductivity, bending workability, and a stress relaxation property all at high levels in a good balance, and also having a reduced density (specific gravity). [Means for Solution] A copper alloy sheet material composed of, in mass %, Ti: 1.0 to 5.0%, Al: 0.5 to 3.0%, Ag: 0 to 0.3%, B: 0 to 0.3%, Be: 0 to 0.15%, Co: 0 to 1.0%, Cr: 0 to 1.0%, Fe: 0 to 1.0%, Mg: 0 to 0.5%, Mn: 0 to 1.5%, Nb: 0 to 0.5%, Ni: 0 to 1.0%, P: 0 to 0.2%, Si: 0 to 0.5%, Sn: 0 to 1.5%, V: 0 to 1.0%, Zn: 0 to 2.0%, Zr: 0 to 1.0%, S: 0 to 0.2%, rare earth elements: 0 to 3.0%, and the balance substantially being Cu, wherein a maximum width of a grain boundary reaction type precipitate existing region is 1000 nm or less, a KAM value when a boundary with a crystal orientation difference of 15° or more measured by EBSD (step size: 0.1 μm) is rewarded as a crystal grain boundary is 3.0° or less, and a tensile strength in a rolling direction is 850 MPa or more.

Cu—Ti-based copper alloy sheet material, method for producing the same, electric current carrying component, and heat radiation component

A copper alloy sheet material has a composition containing from 0.20 to 6.00% in total of Ni and Co, from 0 to 3.00% of Ni, from 0.20 to 4.00% of Co, and from 0.10 to 1.50% of Si, all in mass %, one or more of Fe, Mg, Zn, Mn, B, P, Cr, Al, Zr, Ti, Sn contained appropriately depending on necessity, the balance of Cu and unavoidable impurities, and has on a polished sheet surface thereof, a ratio S/Sof 2.0 or more and an area ratio of Soccupied on the surface of 5.0% or more, wherein Srepresents an area of a region having a crystal orientation difference from a Brass orientation {011} &#x3c;211&#x3e; measured by EBSD (electron backscattered diffraction) of 100 or less, and Srepresents an area of a region having a crystal orientation difference from a Cube orientation {001} &#x3c;100&#x3e; of 10&#xb0; or less.

Cu&#x2014;Co&#x2014;Si-based copper alloy sheet material and method for producing the same, and component using the sheet material

The present invention provides a method of producing a nanoparticle dispersion liquid, including: altering a surface of a nanoparticle in the presence of an ion by contacting a complex that includes the nanoparticle and a solid material present around the nanoparticle with a surface altering agent-containing liquid, that includes a surface altering agent for altering the surface of the nanoparticle and a solvent for dissolving the solid material and that has a viscosity of 1.10 mPa&#xb7;s or more at 25&#xb0; C.; and a dispersing step of dispersing the surface-altered nanoparticle in the solvent.

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Tokyo, Japan

Hiroshi Hyodo