Hitachi, Ltd.

Hiroshi Houzouji

Atsushi Saito

Akitoyo Konno

Toshiaki Morita

Katsuhiro Higuchi

Yoshimasa Takahashi

Toshiya Sato

Hidekazu Nishidai

An object of the present invention is to provide a semiconductor module that can improve the dissipation of heat from semiconductor elements toward a cooling body. A semiconductor module of the present invention includes a plurality of resin-molded semiconductor devices that are mounted on a single metal base and are electrically connected. The plurality of semiconductor devices each have a structure in which a metal heat dissipation plate, which is formed on a surface of an insulating substrate on the side opposite to a semiconductor-element-mount surface, is exposed from a resin mold, and the metal heat dissipation plate is embedded in each opening provided in the metal base, so that the rear surface of the metal heat dissipation plate becomes a plane to be disposed on a cooling body.

Semiconductor module having an embedded metal heat dissipation plate

A semiconductor device in which the lifetime of mounted components can be prolonged. A cooling system for controlling the temperature of a refrigerant through a heating section and a radiator is provided. The semiconductor device is connected to the cooling system and is cooled. A variation width (&#x394;T) of temperature controlled by the cooling system through the heating section and the radiator is smaller than a temperature variation (&#x394;T) of the refrigerant caused by variations in operating conditions of the semiconductor device (&#x394;T&#x2266;&#x394;T).

Semiconductor device

Growing community of inventors

Tokyo, Japan

Hiroshi Houzouji