Matsushita Electric Industrial Co., Ltd.

Hiroshi Horiki

Masanori Minamio

Tetsushi Nishio

Toshiyuki Fukuda

A resin-encapsulated semiconductor device includes a semiconductor chip, a plurality of inner leads that are connected to a group of electrodes of the semiconductor chip, respectively, and an encapsulating resin that encapsulates a connection part located between the semiconductor chip and the inner leads. Each of the inner leads includes a protruded portion provided on a surface thereof on an outer side relative to the periphery of the semiconductor chip. The protruded portion protrudes in a thickness direction and is provided with a step portion formed in its side portion. The group of electrodes of the semiconductor chip is connected to surfaces of inner portions of the inner leads located on an inner side relative to their protruded portions, through electroconductive bumps, respectively. The encapsulating resin encapsulates the semiconductor chip and the electroconductive bumps and is formed to expose surfaces of the protruded portions. The surfaces of the protruded portions that function as external terminals can be reduced in size and thereby the pitch between the external terminals can be reduced.

Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same

An inventive leadframe includes an outer frame, a die pad, and a plurality of leads each having land portions and connections. The land portions each have an upper surface serving as a bonding pad to be connected with a metal wiring, and a lowermost part serving as an external terminal. The connections are each devoid of its lower part so as to be thinner than the land portion, and are provided between the outer frame and the land portions, between the land portions associated with each other in each lead, and between the land portions and the die pad. Furthermore, the inventive leadframe is provided with no member that functions as a suspension lead for connecting the outer frame and the die pad to each other during plastic encapsulation.

Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same

A method for producing a solid-state imaging device including a base of an insulation material having a frame form in planar shape with an aperture formed in an inner region thereof and having a substantially uniform thickness; a wiring provided on one surface of the base and extending toward the outside from the peripheral portion of the aperture; and an imaging element mounted on the surface of the base provided with the wiring so that a light-receptive region of the element faces the aperture. Cavities for resin-molding a plurality of the bases are formed and a tape member supporting thin metal plate leads for forming a plurality of sets of wirings corresponding to the respective bases is loaded between molds having pins for forming positioning holes of the base; and the thin metal plate leads are placed in the cavities. Then, a sealing resin is filled in the cavities and cured. A resin molded member, in which the thin metal plate leads are embedded, is taken out; and the tape member is removed from the resin molded member, and the resin molded member is divided into a plurality of pieces on which an imaging element is mounted. The base on which the imaging element is mounted can be formed to have a practically sufficient flatness.

Growing community of inventors

Funai-gun, Japan

Hiroshi Horiki