Sumitomo Bakelite Company Limited

Fujirebio Inc.

Sumitomo Bakelight Co., Ltd.

Rebio Gen, Inc.

Sumitomo Baeklite Company Limited

Hiroshi Hirose

Kensuke Nakamura

Hirotaka Nonaka

Akiko Okubo

Yoshiyuki Goh

Yoshihito Akiyama

Maki Sugawara

Motowo Tomita

Yasuko Nakano

Koichi Matsubara

Hiroyuki Tanaka

Masahiro Wada

Hitoshi Kawaguchi

Toru Meura

Hironori Maruyama

Kenya Tachibana

Hideaki Sasajima

Teppei Itoh

Koichi c/o Chugai Seiyaku Kabushiki Kaisha Matsubara

There are provided an epoxy resin composition exhibiting less warpage after molding and during a solder treatment process as well as during a low temperature process of, for example, a temperature cycle test, and excellent in flame retardancy, solder crack resistance, and flowability; and a semiconductor device using the same. The epoxy resin composition used in the semiconductor device contains at least one type of epoxy resin (A) selected from a trifunctional epoxy resin and a tetrafunctional epoxy resin, a curing agent (B) having at least two hydroxyl groups per molecule, a compound (C) having at least two cyanate groups per molecule, and an inorganic filler (D), as essential components.

Epoxy resin composition and semiconductor device

A multilayered circuit board of the present invention has a single-side laminated structure and does not include a core substrate having via-holes formed therethrough and vias for providing electrical connection through the via-holes. The multilayered circuit board includes a plurality of pairs of layers, each pair including a conductor circuit layer and an insulator layer, wherein a glass transition temperature of each insulator layer is 170&#xb0; C. or higher, a coefficient of thermal expansion at the glass transition temperature or lower of each insulator layer is 35 ppm or less, and a modulus of elasticity of each insulator layer is 5 GPa or more.

Multilayered circuit board and semiconductor device

The invention offers technology for suppressing damage to semiconductor devices due to temperature changes. When flip-chip mounting a silicon chip on a buildup type multilayer substrate having a structure with a thinned core, a core having a small coefficient of thermal expansion is used in the multilayer substrate, and the coefficient of thermal expansion and glass transition point of the underfill are appropriately designed in accordance with the thickness and coefficient of thermal expansion of the core. By doing so, it is possible to relieve stresses inside the semiconductor package caused by deformation of the multilayer substrate due to temperature changes, and thereby to suppress damage to the semiconductor package due to temperature changes.

Semiconductor device

The present invention provides a solder resist material, which can suppress the warpage of a semiconductor package upon exposure to heat or impact even when used in a thin wiring board and meets a demand for size reduction in electronic devices and a higher level of integration, and a wiring board comprising the solder resist material and a semiconductor package. The solder resist material of the present invention can effectively suppress the warpage of a semiconductor package through a fiber base material-containing layer interposed between resin layers. The fiber base material-containing layer is preferably unevenly distributed in the thickness direction of the solder resist material.

Solder resist material, wiring board using the solder resist material, and semiconductor package

A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).

Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt

This invention provides a method for diagnosing geriatric diseases associated with insulin resistance, such as type II diabetes, at an early stage and a method for monitoring the therapeutic effects of agents for type II diabetes by quantitatively assaying GBP28 with the use of a monoclonal antibody that can assay adiponectin (GBP28) in a sample.

Method for diagnosing type II diabetes or monitoring therapeutic effects of therapeutic agents for type II diabetes

Curing accelerator, epoxy resin composition, and semiconductor device

Method for diagnosing or monitoring carbohydrate metabolism disorders

Growing community of inventors

Tokyo, Japan

Hiroshi Hirose