Canon Kabushiki Kaisha

Sony Corporation

Ricoh Company, Ltd.

Kabushiki Kaisha Tivoli

Hiroshi Higuchi

Masataka Kato

Toshiyasu Sakai

Takayuki Kamimura

Yoshinao Ogata

Masaya Uyama

Mikio Ishii

Atsunori Terasaki

Seiko Minami

Shoji Kosuge

Yoshiyuki Fukumoto

Masahiro Take

Shuichi Tamatsukuri

Masahiko Kubota

Nobuyuki Ishikawa

Tamaki Sato

Ryoji Kanri

Taku Kihara

Makoto Terui

Masafumi Morisue

Akio Goto

Tetsushi Ishikawa

Yasuaki Tominaga

Shinichi Tanabe

Fumio Ishikawa

Hisaaki Narahara

Shingo Shimazaki

Katsuhiko Tsushima

A liquid ejection head includes a first substrate including a structure and a second substrate bonded to the first substrate with an adhesive, wherein the first substrate includes a bonding surface bonded to the second substrate with the adhesive and a non-bonding surface that is not bonded to the second substrate, and wherein a recessed portion is disposed in the non-bonding surface between the structure and a bonding end of the bonding surface adjacent to the structure.

Liquid ejection head

A liquid ejection apparatus includes at least one ink tank which is ink-refillable from outside, a liquid ejection head that ejects an ink supplied from the ink tank, and a housing that contains the ink tank and the liquid ejection head inside. The at least one ink tank is fixed to a housing wall of at least one surface out of surfaces forming the housing. Moreover, one surface out of surfaces forming the ink tank, which is attached to the housing wall, is either a surface having the largest area of the ink tank or a surface opposed to the surface having the largest area.

Liquid ejection apparatus

A method of manufacturing an inkjet head substrate is provided. The inkjet head substrate includes an ink supply port having a through portion and a non-through portion, and the non-through portion is disposed at a position closer than the through portion to the energy generating element. The method includes disposing a mask having an opening that has a relatively large opening-width portion and a relatively small opening-width portion. The method also includes forming the through portion in the substrate at a position corresponding to the relatively large opening-width portion and the non-through portion in the substrate at a position corresponding to the relatively small opening-width portion by performing reactive ion etching on the substrate through the opening of the mask in one operation.

Method of manufacturing inkjet head substrate

A liquid discharge head includes a substrate that is provided with a supply passage having an opening; an energy generating element that is disposed on a surface of the substrate; an electric wiring layer; an insulation layer; and a discharge port member that forms a discharge port. The insulation layer has an end portion adjacent to the opening of the supply passage and set back from an edge of the opening of the supply passage toward a side where the energy generating element is disposed. The electric wiring layer includes a plurality of electric wiring layers layered on each other.

Liquid discharge head, recording apparatus, and method of manufacturing liquid discharge head

Provided is a liquid ejection head substrate, in which a plurality of units are arranged. Each of the units includes: a pressure generating element formed on a first surface of a support substrate; and a pair of independent liquid chambers, which are formed on both sides of the pressure generating element so as to be opposed to each other, and are opened to the first surface of the support substrate. The liquid ejection head substrate includes, in the support substrate: a first common liquid chamber communicating to a plurality of independent liquid chambers on one side of the pair of independent liquid chambers; a second common liquid chamber communicating to a plurality of independent liquid chambers on another side of the pair of independent liquid chambers; and a partition wall separating the first common liquid chamber and the second common liquid chamber from each other.

Liquid ejection head substrate

A method for manufacturing a structure having a substrate in which holes are formed and a photosensitive resin layer provided on the substrate in such a manner as to cover at least a part of the holes includes a process of preparing a substrate in which holes formed by a surface in which a wavelike shape is formed and a photosensitive resin layer provided on the substrate in such a manner as to cover at least a part of the holes and an exposure process of exposing the photosensitive resin layer on the substrate.

Method for manufacturing structure

A method of forming a through-substrate having a first surface and a second surface opposite to the first surface, the method causing the first surface to communicate with the second surface through the substrate, the method including: a first step that forms a first trench from the first surface side of the substrate using dry etching, the first trench having side surfaces on which protective film is formed; and a second step that forms a second trench from the second surface side using dry etching, the second trench communicating with the first trench having the side surfaces on which the protective film is formed.

Method of forming through-substrate

A substrate processing method includes forming a first hole in a first surface of a silicon substrate to have a depth that it does not extend through the substrate and forming a second hole in a second surface to make the second hole to communicate with the first hole, so that a through hole formed of the first and second holes is formed in the substrate. The process of forming the second hole includes forming a communication portion wider than an opening of the first hole between the first and second holes after the second hole has been made to communicate with the first hole by dry etching.

Substrate processing method and method of manufacturing substrate for liquid discharge head including forming hole in substrate by dry etching

A liquid discharge head including a substrate, and an energy-generating element. The substrate is provided with a flow path that penetrates through the substrate from the first surface to a second surface, the flow path supplying the liquid from the second surface side to the first surface side. The flow path includes a plurality of first flow paths and a second flow path that is positioned on the second surface side with respect to the first flow paths. The plurality of first flow paths are open on a bottom portion of the second flow path, and the plurality of first flow paths include a long flow path relatively long in a direction perpendicular to the first surface, and a relatively short flow path. The long flow path has a flow path resistance per unit length that is smaller than that of the short flow path.

Liquid discharge head, liquid discharge apparatus, and method of manufacturing liquid discharge head

A liquid discharge head includes a substrate and a flow-path-forming member that forms a plurality of flow paths and discharge ports that are in communication with the flow paths on the substrate. Liquid is to be discharged from the discharge ports. A space is formed between the plurality of flow paths and is filled with a filling material. In the case where a direction in which the liquid is to be discharged from the discharge ports is an upward direction, a top surface of the filling material is positioned at the same height as a face surface of the flow-path-forming member or is positioned higher than the face surface of the flow-path-forming member in the upward direction.

Liquid discharge head and method of manufacturing the same

A method for processing a silicon substrate, comprising the steps of providing a silicon substrate having a first surface and a second surface, forming a non-penetrated hole extending from the first surface toward the second surface side in the silicon substrate, sticking a sealing tape comprising a support member and an adhesive layer on the first surface and filling at least part of the non-penetrated hole with the adhesive layer, performing reactive ion etching from the second surface toward the first surface side to allow the reactive ion etching to reach the adhesive layer filled in the non-penetrated hole and to expose the adhesive layer, and peeling the sealing tape from the silicon substrate to form a through hole in the silicon substrate.

Method for processing silicon substrate

A method of making a semiconductor substrate having a through-hole includes a step of forming an etching mask on a semiconductor substrate in accordance with a pattern corresponding to the through-hole, and a step of forming the through-hole by etching the semiconductor substrate, on which the etching mask has been formed, by reactive ion etching. At least a part of the pattern corresponding to the through-hole is formed so that the semiconductor substrate is exposed in a frame-like shape along the inner edge of the through-hole.

Method of making semiconductor substrate using an etching mask and method of making liquid ejection head substrate using an etching mask

A liquid ejection head includes a substrate and a flow path forming member on the substrate, the flow path forming member forming an ejection orifice from which a liquid is ejected and a liquid flow path. The flow path forming member is formed of an inorganic material, contains at least a flow path side wall portion forming a side of the liquid flow path and has a member covering a substrate side end part of an inner wall of the flow path side wall portion.

Liquid ejection head and production process thereof

A liquid ejection head includes a substrate, an energy-generating element provided on a front surface side of the substrate, the energy-generating element generating energy for ejecting liquid, sidewall members of a liquid flow path, and an ejection port forming member that defines an ejection port from which the liquid is ejected. In the liquid ejection head, sidewalls of the liquid flow path are formed of the sidewall members and a top wall of the liquid flow path is formed of the ejection port forming member, the sidewall members are each formed of a core member that extends from a front surface of the substrate and a covering member that covers the surface of the core member, the covering member covers the front surface of the substrate, and the ejection port forming member is formed of an inorganic material.

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Atsugi, Japan

Hiroshi Higuchi