Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Hiroshi Higashitani

Tsuyoshi Yoshino

Junichi Kurita

Takeo Yasuho

Masaaki Hayama

Kenji Kuranuki

Youichi Aoshima

Haruo Ohta

Yuji Mido

Etsuto Nakatsu

Kazuo Kawahito

Masaki Hayama

A solid electrolytic capacitor is formed by stacking flat solid electrolytic capacitor elements. Negative electrode sections of a part of the solid electrolytic capacitor elements and negative electrode sections of the remaining part of the solid electrolytic capacitor elements are led out so as to be faced to each other, and are connected to the first and second negative electrode lead frames which are independent to each other, respectively. Two of negative electrode sections are insulated from each other in the solid electrolytic capacitor.

Chip-type solid electrolytic capacitor and chip-type filter

A capacitor inspection device includes a substrate made of an insulating material, a first conductor unit and a second conductor unit arranged on the substrate, a signal input unit and a signal output unit attached to the substrate, a network analyzer and a pressurizing unit. The network analyzer has an input port connected to the signal input unit and an output port connected to the signal output unit. The first and second conductor units make contact with an anode and a cathode of a capacitor, respectively. The pressurizing unit presses the anode of capacitor onto the first conductor unit and the cathode onto the second conductor unit.

Solid electrolytic capacitor inspection device and inspection method

A printed board is mounted with a chip-type solid electrolytic capacitor of a four-terminal structure where a pair of positive electrode terminals are disposed at opposite positions and a pair of negative electrode terminals are disposed at opposite positions on a mounting surface. The printed board has a pair of positive electrode patterns and a pair of negative electrode patterns to which the positive electrode terminals and negative electrode terminals of the chip-type solid electrolytic capacitor are connected, respectively. The printed board further has an inductor section that is insulated from the negative electrode patterns, and electrically connects the positive electrode patterns.

Printed board and filter using the same

A chip-type filter has a laminated body formed by stacking a plurality of capacitor elements, a pair of positive electrode terminals, a pair of negative electrode terminals, insulating outer resin, and an inductor section. The laminated body includes capacitor elements in a first group and capacitor elements in a second group, the positive electrode sections in both groups are disposed on the opposite sides with respect to the negative electrode sections. Positive electrode terminals are electrically connected to the positive electrode sections of capacitor elements in the first group and those of capacitor elements in the second group, respectively. Negative electrode terminals are electrically connected to the negative electrode sections in the laminated body, and are disposed at both ends of the direction crossing the connecting direction between the positive electrode terminals. The inductor section is insulated from the negative electrode sections and couples the positive electrode terminals.

Chip-type filter

A module component which includes circuit substratehaving one or more componentson at least one of the surfaces, and junction circuit substratehaving hollow, or hole, disposed corresponding to the portion of the one or more componentsmounted on the one surface of circuit substratefor fitting the mounted componentsin. These substrates are laminated to form a single body so that mounted componentsis contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

Module part

A module component which includes circuit substratehaving one or more componentson at least one of the surfaces, and junction circuit substratehaving hollowor hole, disposed corresponding to the portion of the one or more componentsmounted on the one surface of circuit substratefor fitting the mounted componentsin. These substrates are laminated to form a single body so that mounted componentsis contained within the inside. The above configuration ensures high reliability in the layer-to-layer connection, and enables to mount a plurality of components densely with a high dimensional accuracy. Thus a highly reliable compact module component is offered.

DC/DC converter includes a voltage converting circuit connected between the input terminal and output terminal, a fast transient response circuit, a step-up and step-down operation determining circuit, a voltage comparator, and a switch control circuit.

Voltage step-up and step-down DC/DC converter

A voltage converter module is formed by multi-layering a first connecting layer, a first inner wiring layer, a component built-in layer, a second inner wiring layer, a second connecting layer, and a capacitor-mounted layer, and a capacitor built-in layer with resin composite. A connecting terminal formed on a terminal surface of the first connecting layer, the first inner wiring layer, the second inner wiring layer and the capacitor-mounted layer are electrically coupled to each other through via-hole conductors. The second inner wiring layer couples a voltage converter IC to peripheral components, both being incorporated in the component built-in layer. A first capacitor and a second capacitor incorporated in the capacitor built-in layer are mounted to the capacitor-mounted layer. This structure forms a circuit, in which the first capacitor is coupled to the second capacitor, between the voltage converter IC and the grounding.

Voltage converter module

A module component includes a wiring circuit pattern formed on an insulated resin layer, and a connecting conductor, which is formed within the insulated resin layers, for electrically connecting at least two of the wiring circuit patterns each other. The module component further includes an active component and a passive component, which are formed on at least one of the wiring circuit patterns and electrically connected thereto, and a coil formed within a laminated member. The coil is formed of a coil pattern made of a conductive material, and formed on the insulated resin layer. Magnetic materials, which are formed on the insulated resin layers, sandwich the coil pattern.

Module component

A digital modulating/demodulating apparatus includes a demodulator for demodulating a modulated signal into a demodulated positional signal in response to a receipt of the modulated signal, a decoder for decoding the demodulated positional signal into a digital signal of N bits. A previous signal point on the constellation plane is defined by a previous demodulated positional signal and a current signal point on the constellation plane is defined by a current demodulated positional signal. The decoder outputs a digital signal of N bits, based on en amplitude and a phase of the previous signal point and the amplitude and the phase of the current signal point.

Growing community of inventors

Osaka, Japan

Hiroshi Higashitani