Sony Corporation

Sony Corportion

Hiroshi Hibi

Hideto Isono

Isao Hirota

Kouichi Harada

Masaharu Suzuki

Tetsuya Iizuka

Hideo Miyamaki

Asako Tamura

Satoshi Tabuchi

Hiromichi Matsui

Thumbnails are used, facilitating any operation on an object that changes from time to time as in a moving picture, thereby to prevent failure in capturing important objects. The present invention provides an apparatus for processing images that includes a moving body detecting unit that detects an object from moving picture information input and checks the object for identity, thereby to determine whether the object is contained in two or more consecutive frames, a thumbnail displaying unit that displays any objects that have appeared within a prescribed period, as thumbnails extracted from a representative frame, on the basis of object information detected by the moving body detecting unit, an operation input unit that receives an operation input made when one of the thumbnails displayed by the thumbnail displaying unit is selected, and a moving picture displaying unit that displays a moving picture that contains the object identified by the selected thumbnail related to the operation input received by the operation input unit.

Apparatus for processing images, apparatus for processing reproduced images, method of processing images, and method of processing reproduced images

A semiconductor apparatus connected between a signal input line and a grounding line is formed on a semiconductor substrate with a protection circuit connected between the signal input line and the grounding line, in parallel with the semiconductor apparatus. The protection circuit is formed, for example, of bipolar transistors, diodes, or MOS transistors.

Semiconductor apparatus and horizontal register for solid-state image

In a semiconductor device such as a CCD solid-state imager having terminals connected with protection transistors, a strength against a static electricity applied between a terminal and a ground (GND) and a strength against a static electricity applied between a terminal and a substrate and a strength against a static electricity between terminals can be improved.

Protection circuit for electronic components employing bipolar

A semiconductor apparatus connected between a signal input line and a grounding line is formed on a semiconductor substrate with a protection circuit connected between the signal input line and the grounding line, in parallel with the semiconductor apparatus. The protection circuit is formed, for example, of bipolar transistors, diodes, or MOS transistors. The protection circuit is designed to prevent an excess signal supplied on the signal line from damaging the semiconductor apparatus, such as by breaking down a dielectric layer formed at a gate of a MOS transistor. The protection circuit may further be connected to a potential line that is connected to an external source of voltage.

A protective circuit protects a plurality of protected portions having different withstand voltages and operation voltages of an active portion of a CCD solid state imaging device or the like by protective elements (e.g., transistors). The respective protected portions can be protected in an optimum fashion in response to the withstand voltages and operation voltages thereof. The breakdown voltages of the respective protective transistors are made different in response to the withstand voltages and operation voltages of the protected portions.

Growing community of inventors

Kanagawa, Japan

Hiroshi Hibi