Kuraray Co., Ltd.

Hiroshi Hayashihara

Kazushige Ishiura

Kenji Shachi

Kazuhiko Maekawa

Hideaki Oka

Tsugunori Kashimura

Shinichi Yokota

Shiroh Kishii

Masanari Uno

Shigeru Kawahara

Atsushi Itoh

A thermoplastic polymer composition is provided that includes 100 parts by weight of a block copolymer and/or its hydrogenate having polymer blocks of an aromatic vinyl compound and polymer blocks of a conjugated diene compound, and from 5 to 95 parts by weight of a block copolymer having polymer blocks of an aromatic vinyl compound and/or an olefinic compound and polymer blocks having a constitutional unit derived from a (meth) acrylic compound, a laminate containing a layer of the composition, and a hot-melt adhesive that includes the composition. Because it has good melt adhesiveness, the composition of the invention can firmly adhere in melt to various polar or non-polar materials. Using the composition, it is easy to produce laminates having a layer of the composition and a layer of some other material, through melt shaping or any other melt adhesion techniques. Since the composition of the invention is satisfactorily elastic and flexible, the laminates having a layer of the composition on their surface are flexible and elastic and have a good feel, and, in addition, they are safe because of their shock absorbability and cushionability.

Thermoplastic polymer composition having a thermoplastic elastic polymer

A closure or sealing element for containers, comprising a resin composition principally composed of a polyolefin resin (A) and a block copolymer (B) of a polymer block of an aromatic vinyl compound and an isobutylenic polymer block at a (A)/(B) weigh ratio within a range of 100/5 to 100/100, has so suitable pliability and excellent thermal resistance, good gas barrier properties and great oil resistance, that the closure or sealing element has good mountability onto (into) containers and excellent sealing properties of the containers in addition to good long-term shelf stability of the contents.

Closure and sealing element

Disclosed is a polymer composition which comprises as the main components an ethylene-vinyl alcohol base copolymer (A) and a block copolymer (B) which has a polymer block containing an aromatic vinyl monomer unit and a polymer block containing an isobutylene unit, and in which a phase composed of said component (A) and a phase composed of said component (B) are separated each other. This polymer composition has good flexibility or rubber elasticity and also good barrier properties to gases or the like and it can be molded or formed into a product having such properties without a vulcanization step so that it is useful as a material for packaging material for food or drink, container packing, medical container for infusion fluid or the like.

Polymer compositions and usage thereof

A polyamide (9-T polyamide) comprising (a) 60 to 100 mole of terephthalic acid and (b) a diamine component comprising 60 to 100 mole % of 1,9-nonanediamine, said polyamide having an intrinsic viscosity �.eta.! as determined by measurement in concentrated sulfuric acid at 30.degree. C. of 0.6 to 2.0 dl/g and having at least 10% of terminal groups thereof blocked. Another polyamide (9M-T polyamide) comprises a dicarboxylic acid component (a) comprising 60 to 100 mole % of terephthalic acid and a diamine component (b) comprising 60 to 100 mole % of 1,9-nonanediamine and 2-methyl-1,8octanediamine, the molar ratio between said 1,9 nonanediamine and said 2-methyl-1,8-octanediamine being in a range of 60:40 to 99:1, said polyamide having an intrinsic viscosity �.eta.! as determined by measurement in concentrated sulfuric acid at 30.degree. C. of 0.4 to 3.0 dl/g. These polyamides have excellent moldability, as well as excellent hot water resistance, surface neatness, heat resistance, mechanical characteristics, low-water-absorption property and chemical resistance. Polyamide compositions comprising the 9-T polyamide or 9M-T polyamide and a filler are suitably used as engineering plastics.

Polyamide and polyamide composition

Growing community of inventors

Tsukuba, Japan

Hiroshi Hayashihara