Sumitomo Bakelite Company Limited

Hiroshi Hayai

Takayuki Baba

Takeshi Hosomi

The present invention provides a photosensitive adhesive composition for additive plating, comprising the following components (a), (b), (c), (d), (e) and (f) as essential components; and an excellent multilayer printed circuit board obtained by using the adhesive composition:

Photosensitive adhesive composition for additive plating

A process for producing a multilayer printed circuit board, comprising the steps of: impregnating a thermosetting resin in a base material to form a prepreg, applying a thermosetting epoxy resin undercoating agent comprising dicyandiamide and a micro-capsulated imidazole compound to at least one side of an interlayer circuit board on at least one side of which circuit has been formed, heating the applied undercoating agent to dry or semi-cure the undercoating agent, and laying the prepreg on at least one side of the dried or semi-cured undercoating agent-applied interlayer circuit board and subjecting them to laminating press.

Multilayer printed circuit board and process for producing and using the

The present invention provides a rein composition comprising the following components (a), (b), (c), (d) and (e) as essential components; and an excellent multilayer printed circuit board obtained by using the resin composition: (a) a polyfunctional epoxy resin having an epoxy equivalent of 120-500, (b) a modified phenol novolac obtained by reacting 20-60 mole % of the phenolic hydroxyl groups of a phenol novolac obtained by condensing a phenol compound with formaldehyde in the presence of an acidic catalyst, with a glycidyl group-containing acrylate or methacrylate, (c) an epoxy acrylate or epoxy methacrylate compound, (d) a diluent consisting of a polyfunctional monomer having a plurality of photosensitive functional groups or a polyfunctional monomer having a photosensitive functional group and a heat-sensitive functional group, or a diluent consisting of a combination of the two monomers, and (e) a photopolymerization initiator.

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Fujieda, Japan

Hiroshi Hayai