Dai Nippon Printing Co., Ltd.

Hiroshi Harima

Jun Takahashi

Seiichi Nishikawa

Kazuyoshi Irisawa

Yoshikazu Fukushima

Akiko Moriyama

Mayumi Inada

Masaki Wakamatsu

A sheet-framed IC carrier has a sheet frame having an aperature, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperature of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.

Sheet-framed IC carrier, method for producing the same, and IC carrier case

A sheet-framed IC carrier has a sheet frame having an aperture, and a backing film with a pressure-sensitive adhesive layer on one surface thereof which is adhered to the back surface of the sheet frame. An IC carrier having an IC module is secured in the aperture of the sheet frame with the adhesive layer on the backing film. When the IC carrier is removed from the sheet-framed IC carrier, no excessive load is exerted on the IC module and no projection remains on the peripheral edge of the carrier base.

Sheet-framed IC carrier, method for producing the same, and IC carrier

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Tokyo, Japan

Hiroshi Harima