Fuji Photo Film Company, Limited

Sumitomo Electric Industries, Limited

Canon Kabushiki Kaisha

Teijin Limited

Sumitomo Electric Device Innovations, Inc.

Taiyo Yuden Co., Ltd.

Mitsubishi Heavy Industries Limited

Taisho Pharmaceutical Co., Ltd.

Mitsubishi Heavy Industries Machinery Systems, Ltd.

Nippon Electric Co., Ltd.

Epoch Company, Ltd.

Nec Corporation

Fujifilm Corporation

Japan Tobacco Inc.

Clariant Finance (bvi) Limited

Hiroshi Hara

Yoshiaki Suzuki

Kozo Sato

Kotaro Nakamura

Hideki Naito

Toshiaki Aono

Jiro Sekine

Nobuyuki Kameyama

Hiroshi Komatsuzaki

Hiroyuki Hirai

Katsuya Sennyu

Masanobu Kawamura

Fumihiro Nakajima

Takashi Tobioka

Kazuo Shiota

Kazushige Oki

Kiichiro Sakamoto

Seiji Asano

Yuji Oshikoshi

Nobumitsu Takehara

Yoshiharu Yabuki

Keiichi Adachi

Takuya Arai

Hiroshi Ohmura

Yasushi Fujimura

Shinsaku Fujita

Toshio Yoshida

Masumi Hirata

Eiji Tsumura

Hiroki Sano

Takeshi Yoshino

Tetuo Nishizawa

Ken Kawata

Minoru Ishiguro

Hiroshi Ogawa

Tadao Shishido

Satoshi Yoshimura

Osamu Iwasaki

Michio Suzuki

Kazumi Umezawa

Seiji Sagara

Hiroyuki Miyake

Atsuaki Arai

Junichi Takagi

Haruo Seto

Sosaku Sawada

Sadafumi Omura

Satoru Sawada

Hitoshi Ebihara

Hiraku Sonobe

Noboru Otake

Fuyuki Yonehara

Hitoshi Mikoshiba

Kazutoshi Mizoue

Morio Yagihara

Tadashi Suzuki

Naoki Takahashi

Tadashi Ikeda

Shigeo Hirano

Takanori Hioki

Koki Nakamura

Osamu Koyama

Takahiro Saito

Koichi Nakamura

Atsushi Kubota

Minoru Yamada

Seimei Ushiro

Seiiti Kubodera

Kazunori Ohno

Katsuyuki Watanabe

Shigeyoshi Onoda

Tomoya Saeki

Koji Kubo

Masamichi Tateoka

Munetaka Kurokawa

Hideki Hosoya

Hirotoshi Kishi

Masaaki Tsukase

Isao Shimamura

Osamu Funayama

Masatoshi Kato

Takushi Miyazako

Naoki Itabashi

Hajime Katayama

Kiyoteru Miyake

Kuniyuki Ishii

Keizo Koya

Reiichi Ohi

Yoshiharu Fuseya

Katsuji Muramatsu

Masashi Suda

Kazunori Hanada

Masashi Takamura

Shuho Tsubota

Koichi Koyama

Yusaku Takada

Akihiro Sanda

Yasuhisa Okamoto

Takehisa Okuda

Tateki Nagaoka

An optical device according to one embodiment includes: a light-emitting element; first and second lenses optically coupled with the light-emitting element; an optical component provided between the light-emitting element and the second lens, optically coupling each of the light-emitting element and the second lens, and multiplexing input lights; and a base having a lower plate having a plurality of convex mounting surfaces with each of the light-emitting element, the first lens, the second lens, and the optical component being mounted thereon and a side wall with a receptacle being connected thereto.

Optical device and manufacturing method for optical device

An optical receiver according to one embodiment includes a transimpedance amplifier including a first pad, a second pad provided on an insulating layer, connected to a cathode wiring layer through a first via, arranged at a position interposing the first pad, and connected to a first cathode pad of a light-receiving element, and a third pad connected to the second cathode pad of the light-receiving element. The light-receiving element is connected to an anode pad mounted on the transimpedance amplifier and connected through an anode electrode and an anode wiring pattern provided on a surface facing the transimpedance amplifier and a first cathode pad and a second cathode pad connected through a cathode electrode and a cathode wiring pattern and arranged at positions interposing the anode pad.

Optical receiver

An optical transmitter according to one embodiment includes a housing with an emission end, a light emitting element mounted on a first mounting portion of the housing, and a light receiving element mounted on a second mounting portion of the housing to monitor output light from the light emitting element. The second mounting portion is provided with a carrier, a first resin located on an emission end side of a lower side of the carrier, and a second resin located on a light emitting element side of the lower side of the carrier. A coefficient of thermal expansion of the first resin is smaller than a coefficient of thermal expansion of the second resin.

Optical transmitter

An optical module includes a circuit board having a through hole for the lead terminal, a signal wiring connected to the lead terminal, a ground layer providing a reference potential, an opening through which the ground layer is exposed, and a bonding material connecting the ground layer to the metallic base. The lead terminal extends in a first direction, and the circuit board and the signal wiring extend in a second direction. When the circuit board is viewed from the first direction, the opening overlaps with the signal wiring, or when the opening does not overlap with the signal wiring, a first distance between the signal wiring and a closest point of the opening to the signal wiring is smaller than a second distance between the closest point and an edge of the circuit board.

Optical module and manufacturing method of the same

An optical module of the present disclosure includes an optical element, a first optical component that is optically coupled to the optical element, a second optical component that is optically coupled to the first optical component, a receptacle to which an optical fiber that transmits the incident light to the second optical component is connected, a terminal unit that electrically outputs an output signal of the optical element to the outside, and a package that accommodates the optical element, the first optical component, and the second optical component and is provided with the receptacle on a first surface and the terminal unit on a second surface facing the first surface, wherein the wiring extends from the first surface side to the second surface side and electrically connects the second optical component and the terminal unit.

Optical module

An optical transmitter module includes a semiconductor laser device, optical modulator, temperature adjusting device which includes a substrate, a first installation part and a second installation part, a package having a bottom surface opposite to a back surface of the substrate, the package housing the semiconductor laser device, the optical modulator, and the temperature adjusting device; and a middle block disposed between a first temperature controlling element a the second temperature controlling element, the middle block having a back surface directly or indirectly fastened to a principal surface of the substrate.

Optical transmitter module, optical transmitter-receiver module, and optical module

A package for optical receiver module includes a conductive housing and a feedthrough. The conductive housing includes a first sidewall having an optical port for receiving an optical signal along an optical axis, a second sidewall separated from the first sidewall along the optical axis, and an interior space for housing a photodetector. The feedthrough includes first to third layers extending from the second sidewall to an opposite direction of the first sidewall, and the third layer is provided between the first and second layers. The feedthrough includes first to fourth wirings, a grounding wiring, and a plurality of first conductive cells. The first and second wirings face the interior space. The third wirings, the fourth wiring, the grounding wiring are formed in the first layer or the second layer. The plurality of first conductive cells are arranged in the third layer, and are electrically connected to the grounding wiring.

Optical receiver module and package for optical receiver module

A package for an optical receiver module is disclosed. The package includes a housing having electrically conductive walls including a rear wall and a pair of side walls, and a feed-through provided in the rear wall. The feed-through includes an internal portion having an upper rear face and a lower rear face, and an external portion protruding from the upper rear face and the lower rear face outwardly and having a top face and/or a back face continuous to the upper rear face and/or the lower rear face of the internal portion, a first top face, a second back face, and a pair of side faces, the rear face and the side faces connecting the first top face with the second back face, the first top face including DC lines, the second back face including transmission lines, and the transmission lines.

Package for optical receiver module

An optical module according to an aspect of the present disclosure includes a substrate having a base plane, an optical circuit element having an optical waveguide and a reflector, a support member, a photo detector mounted on the base plane, the photo detector including a condenser lens and a light-receiving layer. The light beam travels along an optical path from the reflector to the tangent plane, the optical path having a shortest distance set to be smaller than a preset value, and as viewed from a direction perpendicular to the base plane, the light beam has an optical axis set apart from the top of the condenser lens by an offset distance.

Optical module including photo detector with lens

A receiver module includes: a photodiode; a carrier configured to mount the photodiode; a base having a surface on which the carrier is mounted; a conductive pattern provided on the carrier, being conductively joined to a cathode electrode of the photodiode; a transimpedance amplifier having a first terminal connected to the conductive pattern through a bonding wire and a second terminal electrically connected to an anode electrode of the photodiode; and a capacitor having a first end electrically connected to the conductive pattern through a conductor having inductance smaller than inductance of the bonding wire and a second end electrically connected to the surface of the base.

Receiver module

Provided is a multiple-electrode monorail guide catheter for use in vascular insertion, including: an elongated catheter main body having a proximal end and a distal end; a guidewire inlet opening on the distal end; a guidewire outlet opening; an operation tube; a terminal unit on the proximal end; an electrode assembly having a double-lumen structure composed of an outer tube having electrodes on an outer surface of the outer tube and an inner tube independently provided from the outer tube, allowing insertion of a guidewire, having an outer diameter smaller than an inner diameter of the outer tube, and being accommodated within an outer tube lumen; a clearance defined by the outer tube luminal surface and an inner tube outer circumferential surface; and lead wires extending from the electrodes to the terminal unit on the proximal end and being inserted into the lumen of the outer tube.

Multiple-electrode guide catheter for use in peripheral vessel

A wavelength de-multiplexing system that receives a wavelength multiplexed signal and generates electrical signals corresponding to the optical signals is disclosed. The optical receiver module includes a lens, a lens unit, and an optical de-multiplexer (O-DeMux). The lens converts the wavelength multiplexed signal into a quasi-collimated beam. The lens unit narrows a diameter of the quasi-collimated beam. The O-DeMux de-multiplexes the narrowed quasi-collimated beam coming from the lens unit by wavelength selective filters (WSFs) each having optical distances from the lens unit different from each other.

Wavelength de-multiplexing system and optical receiver module

A package for an optical receiver module is disclosed. The package includes a housing having electrically conductive walls including a rear and a pair of side walls, and a feed-through provided in the rear wall. The feed-through includes an internal portion, and an external portion protruding from the internal portion. The internal portion has a top face and a back face, the top face including ground lines, the back face including transmission lines with signal lines and ground lines.

An optical module that provides a bridge substrate for carrying a driving signal from a wiring substrate to a laser diode (LD) element is disclosed. The optical module provides a carrier, first and second assemblies, and the bridge substrate. The first assembly, which includes the LD element, stacks a first compensating substrate and a semiconductor substrate on the carrier, where the semiconductor substrate includes the LD element. The second assembly stacks a second compensating substrate and the wiring substrate on the carrier. The first compensating substrate is made of a material same with a material of the wiring substrate and has a thickness same with that of the wiring substrate. The second compensating substrate is made of a material same with a material of the semiconductor substrate and has a thickness same with that of the semiconductor substrate.

Growing community of inventors

Tokyo, Japan

Hiroshi Hara