Kabushiki Kaisha Toshiba

Sumitomo Electric Industries, Limited

Kabuhsiki Kaisha Toshiba

Hiroshi Hamasaki

Hideto Furuyama

Yoshiaki Sugizaki

Naofumi Nakamura

Hideo Numata

Kentaro Kobayashi

Michihiko Nishigaki

Akihiro Kojima

Yutaka Onozuka

Hiroko Miki

Chiaki Takubo

Wataru Sakurai

Tamon Kobayashi

Kazuhito Saito

Takashi Imoto

Mitsuhiro Kushibe

Mitsuaki Tamura

Keiji Takaoka

Masaru Nakamura

Katsuji Kaminishi

Fumihiko Kuroda

Mayumi Sakaguchi

A chemical sensor system includes a first chemical sensor, a second chemical sensor unit, and a first sample atmosphere tank located between the first chemical sensor and the second chemical sensor unit, and includes an air supply mechanism that executes a first operation of supplying a sample atmosphere from the first chemical sensor to the first sample atmosphere tank, a second operation of supplying the sample atmosphere from the first sample atmosphere tank to the second chemical sensor unit, and a third operation of discharging the sample atmosphere in the first sample atmosphere tank.

Chemical sensor system

A gas concentration device includes a first container, a second container, a pressure control device, and a path. The first container includes a first space surrounded by a first partition wall and stores a specimen, and a pressure inside the first space is reduced. The second container is airtightly connected to the first container by a first path and has a second space surrounded by a second partition wall and stores a gas flowing in from the first space. The pressure control device reduces a volume of the second space. A gas inside the second space is discharged through a second path.

Gas concentration device, gas detection system, gas concentration method, and gas detection method

According to one embodiment, a particle inspection system includes a voltage driving circuit which applies a driving voltage for a particle inspection to a particle inspection chip, a current-voltage conversion circuit which converts, into a voltage signal, a current signal output from the particle inspection chip when the driving voltage is applied to the particle inspection chip, a detection circuit which detects, based on the voltage signal, whether the sample liquid is introduced into a detection region of the particle inspection chip, and an analysis circuit which analyzes the fine particle, in the sample liquid based on the voltage signal. The voltage driving circuit varies the driving voltage based on the detection result of the detection circuit.

Particle inspection system and driving method employed therein

According to one embodiment, a microanalysis chip includes a substrate, a flow channel in which a sample liquid is allowed to flow, the flow channel being provided on a main surface side of the substrate, a reservoir in which the sample liquid is allowed to be stored, the reservoir being provided on a main surface of the substrate, including a bank having a go-around shape and further including a liquid introduction inlet for connection to an end of the flow channel, the liquid introduction inlet being provided on the main surface of the substrate in the bank, and a filter which is provided between the liquid introduction inlet and the end of the flow channel and includes a first micropore for allowing passage of a fine particle in the sample liquid.

Microanalysis chip

According to one embodiment, a semiconductor micro-analysis chip includes a first flow channel provided with a substrate surface, the flow channel engraved on the substrate into which a sample liquid can flow, micropore provided with a part of the flow channel, a reservoir provided with at least one end of the flow channel, the reservoir engraved on the substrate for inlet and outlet of the sample liquid, and a first electrode provided with a part of the flow channel or of the reservoir. The electrode is disposed from the bottom surface of the flow channel or of the reservoir to the substrate surface, and a side surface which connects the bottom surface and the substrate surface is tapered for reducing a bend in a height direction of the electrode.

Semiconductor micro-analysis chip and method of manufacturing the same

According to one embodiment, a semiconductor analysis chip for detecting a particle in a sample liquid includes a semiconductor substrate, a first flow channel provided in a surface portion of the semiconductor substrate, a second flow channel provided in a surface portion of the semiconductor substrate, part of the second flow channel contacting or intersecting the first flow channel, a micropore provided in a contact portion or an intersection of the first and second flow channels, and configured to permit the particle to pass therethrough, a first electrode provided in the first flow channels, a second electrode provided in the second passage, and a third electrode provided in the first flow channel downstream of the first electrode.

Semiconductor analysis chip and particle inspection method

According to one embodiment, an analysis package, including a board, an analysis chip provided on the board, the chip including a detector for detecting a particle, a flow channel of a sample liquid, and a liquid receiver of the sample liquid, a first mold layer provided on the analysis chip, the first mold layer including an opening above the liquid receiver, and a second mold layer provided on the board and the first mold layer, the second mold layer including an opening above the opening of the first mold layer, wherein the respective openings of the first and second mold layers are connected above the liquid receiver to allow the sample liquid to be introduced into the liquid receiver from outside.

Analysis package for detecting particles in a sample liquid

According to one embodiment, an analysis package including an analysis chip provided on a main surface of a semiconductor substrate, the chip including a flow channel, both ends of which are open at peripheral parts of the substrate, and a microaperture which is provided in a middle of the flow channel and which allows a particle to pass therethrough, a package board on which the chip is mounted, liquid receivers provided on the package board, the liquid receivers being connected to openings, and electrodes, at least parts of which are provided on parts of bottom surfaces of the liquid receivers, the electrodes being provided at positions corresponding to an upstream side and a downstream side of the microaperture.

Analysis package for detecting particles in a sample liquid including an analysis chip mounted on a package board

According to one embodiment, an analysis package including a board including an electrical terminal, an analysis chip provided at the board, the chip including a detector for detecting a particle, a flow channel of a sample liquid for particle detection to the detector, and a liquid receiver for introducing the sample liquid into the flow channel, a mold provided to cover the board on which the analysis chip is provided, the mold comprising an opening above the liquid receiver, a first shield layer provided on a back surface of the board, and a second shield layer provided to be attachable and detachable on an opposite side to the analysis chip of the mold, the second shield layer being electrically connected to a part of the electrical terminal.

Analysis package for detecting particles in a sample liquid, and including shield layers

According to one embodiment, a semiconductor light emitting device includes a semiconductor layer including a first surface, a second surface opposite to the first surface, and a light emitting layer; a p-side electrode provided on the second surface of the semiconductor layer in a region including the light emitting layer; an n-side electrode provided on the second surface of the semiconductor layer in a region not including the light emitting layer; an insulating film being more flexible than the semiconductor layer, the insulating film provided on the second surface and a side surface of the semiconductor layer, and the insulating film having a first opening reaching the p-side electrode and a second opening reaching the n-side electrode; a p-side interconnection layer provided on the insulating film and connected to the p-side electrode; and an n-side interconnection layer provided on the insulating film and connected to the n-side electrode.

Method for manufacturing semiconductor light emitting device

According to one embodiment, a method for manufacturing a semiconductor light emitting device includes forming a separation groove on a major surface of a substrate. A semiconductor layer including a light emitting layer is formed on the substrate. The separation groove separates the semiconductor layer into a plurality of elements. The method includes forming an insulating film on the major surface of the substrate. The insulating film covers the semiconductor layer and a bottom surface of the separation groove provided on the substrate. The method includes separating the substrate from the semiconductor layer by irradiating the semiconductor layer with laser light from an surface of the substrate opposite to the major surface. An edge portion of irradiation area of the laser light is positioned near an edge portion of the semiconductor layer neighboring the separation groove.

In an optoelectronic conversion header, a ferrule holds an optical waveguide in a predetermined position so that an end face of the optical waveguide protrudes from an mounting surface of the ferrule. An electric wire is provided on the mounting surface of the ferrule, a optical semiconductor device is mounted on the mounting surface of the ferrule and electrically connected to the electric wire. From the end face of the optical waveguide, an optical signal is transferred in a transfer direction and the mounting surface of the ferrule is so arranged as to be deviated two degrees or more from a plane vertical to the transfer direction.

Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system

Growing community of inventors

Hiratsuka, Japan

Hiroshi Hamasaki