Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Other

Krosakiharima Corporation

Hiroshi Haji

Kiyoshi Arita

Shoji Sakemi

Wataru Hidese

Tetsuhiro Iwai

Mitsuru Ozono

Kazuhiro Noda

Masaru Nonomura

Satoshi Shida

Shinji Kanayama

Shoriki Narita

Akira Nakagawa

Naoyuki Kitamura

Shuichi Hirata

Teruaki Nishinaka

Nobuhiro Nakai

Shunji Onobori

Teruaki Kasai

Toshiaki Nakashima

Mamoru Nakao

Kunio Oe

Akira Kugihara

Ryuji Nagadome

Maiko Matsuo

Yoshitaka Etoh

Tadahiko Sakai

Toshihide Maeda

Yasuhiko Tanaka

Isamu Morisako

Yutaka Koma

Toshiro Hirakawa

Taiji Matano

Yosuhiko Tanaka

Nobuhiro Satou

Isam Morisako

Eisuke Waki

Tsuyoshi Takata

A light-emitting components containing body includes plural light-emitting components, a containing body which contains the plural light-emitting components. The containing body contains the plural light-emitting components of the same rank among light-emitting components that are classified into plural ranks according to positional deviations of their light emission portions from their light emission portion reference position.

Light-emitting components containing body, manufacturing method of light-emitting components containing body, components mounting apparatus, components mounting method, and components mounting system

A cultivation system moves containers between a growing area and a monitoring area. The containers hold cultivation beds for cultivating plants, and the cultivation system includes: a grow light emitting unit emitting grow light for growing the cultivated plants in the containers located in the growing area; an imaging unit capturing the cultivated plants in the containers located in the monitoring area; and a control unit causing the grow light emitting unit to stop emitting the grow light when the imaging unit captures the plants.

Cultivation system

An irrigation device includes: a nozzle discharging liquid; a cover preventing the liquid discharged from the nozzle from splattering around the container; and a moving mechanism moving the cover between a first position and a second position. When moved to the first position, the cover covers space above the container. When moved to the second position, the cover is removed from the space above the container and the space is uncovered. The moving mechanism moves the cover (i) to the first position when the liquid is supplied to a plant, and (ii) to the second position when the supplying of the liquid to the plant ends.

Plant cultivation system

Provided is a component bonding method of bonding a semiconductor component having a thermosetting adhesive layer formed on a lower surface thereof to a circuit board having a resin layer formed on a surface thereof. In the method, wettability is improved by surface modification that performs a plasma treatment on a resin surface of the circuit board, the semiconductor component is held by a component holding nozzle having a heater, the adhesive layer is contacted to the surface-modified resin layer, and the adhesive layer is heated and thermally cured by the heater. Thereby, adhesion between the adhesive layer and the resin surface is improved, and thus the component holding nozzle can be separated from the semiconductor component without wait for completely hardening the adhesive layer. Accordingly, it is possible to improve productivity in the heat pressing process by reducing the time required for the component bonding.

Component bonding method, component laminating method and bonded component structure

A plasma processing apparatus includes: a vacuum chamber; a plasma processing execution portion; a discharge state detecting unit; a window portion; a camera; a first storing portion; a second storing portion; and an image data extracting unit. The image data extracting unit extracts at least moving image data, which show the generation state of the abnormal discharge, from the first storing portion and stores the extracted moving image data in the second storing portion when the discharge state detecting unit detects the abnormal discharge.

Plasma processing apparatus

A plasma processing apparatus includes a vacuum chamber, a plasma processing execution portion, a discharge state detecting unit, a window portion, a camera, a first storing portion, a second storing portion and an image data extracting unit. When an abnormal discharge is detected, the image data extracting unit extracts at least moving image data showing a generation state of the abnormal discharge from the first storing portion and stores the extracted moving image data in the second storing portion. When plasma processing is ended without the detection of the abnormal discharge, the image data extracting unit extracts, from the first storing portion, moving image data of a predetermined specific period or still image data of a specific period derived from the moving image data of the first storing portion and stores the extracted moving image data or the extracted still image data in the second storing portion.

To provide a substrate processing method and a semiconductor chip manufacturing method that enable low-cost formation of a mask for etching using plasma etching. During formation of a mask used in plasma dicing for separating a semiconductor waferinto discrete semiconductor chipsby means of etching using plasma processing, there is adopted a method including printing a lyophobic liquid in an area on a rear surfacethat is to be an objective of etching, thereby forming a lyophobic pattern made up of lyophobic films; supplying a low viscosity resinand a high viscosity resin, in this sequence, to the rear surfaceon which the lyophobic pattern is formed, thereby forming a resin filmthat is thicker than the lyophobic filmsin an area where the lyophobic filmsare not present; and curing the resin film, to thus form a mask* that covers an area except for the area to be etched. Thus, a mask for etching purpose can be formed at low cost without use of a high-cost method, like photolithography.

Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method

In the pickup apparatus wherein a chip adhered on a sheet is sucked and held by a picking nozzle and then picked up by the nozzle, a sheet push-up member configured by forming flexible elastic material such as rubber in a spherical shape is attached on the abutment supporting surface of the upper surface of a tool, then the push-up surface of the sheet push-up member is followed in a flat surface state along the lower surface of the sheet and abutted thereto in the moving down state of the picking nozzle, and then the push-up surface pushes up the lower surface of the sheet while being deformed in a upwardly protruded curved surface shape in the moving up operation where the picking nozzle moves up together with the chip. Thus, the chip can be released from the sheet from the outer peripheral side of the chip.

Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method

A mask used when a semiconductor wafer is diced into individual semiconductor chips by plasma etching is formed as follows. First, a pattern of a liquid-repellent film is formed by printing a liquid-repellent liquid on the area to be etched on the rear surface of the semiconductor wafer. Next, a resin film thicker than the liquid-repellent film is formed in the area not having the liquid-repellent film by supplying a liquid resin to the rear surface on which the liquid-repellent pattern has been formed. Then, the resin film is cured to form the mask covering the area other than the area to be removed by the etching. This method allows the formation of an etching mask without using a high-cost method such as photolithography.

Method for processing a substrate, method for manufacturing a semiconductor chip, and method for manufacturing a semiconductor chip having a resin adhesive layer

In a laser processing step S, boundary sections among semiconductor elementsof a resist filmare exposed to a laser beam, to thus form in the resist filmboundary grooves&#x2014;which partition the semiconductor elementsfrom each other&#x2014;and to uncover a surfaceof a semiconductor waferin the boundary grooves. In a plasma etching step S, the surfaceof the semiconductor waferexposed in the boundary groovesis etched by means of plasma Pf of a fluorine-based gas, to thus separate the semiconductor waferinto individual semiconductor chips' along the boundary grooves. Between the laser processing step Sand the plasma etching step S, there is performed processing pertaining to a boundary-groove-surface smoothing step Sfor smoothing, by means of plasma Po of oxygen gas, surfaces of the boundary grooveshaving assumed an irregular shape in the laser processing step S

Method for manufacturing semiconductor chip and method for processing semiconductor wafer

In a semiconductor wafer including a plurality of imaginary-divided-regions which are partitioned by imaginary-dividing-lines that are respectively arranged in a grid-like arrangement on the semiconductor wafer and a circumferential line that is the outer periphery outline of the semiconductor wafer, a mask is placed so as to expose an entirety of surfaces of the wafer corresponding to respective removal-regions. The removal-regions are regions in approximately triangular form partitioned by the circumferential line of the wafer and the imaginary-dividing-lines. Then, plasma etching is performed on a mask placement-side surface of the wafer, by which the semiconductor wafer is divided into the individual semiconductor devices along dividing lines while portions corresponding to the removal-regions of the wafer are removed.

Method for dividing semiconductor wafer and manufacturing method for semiconductor devices

In component mounting process for a plurality of components to be mounted onto a board, a plurality of bump electrode portions formed on mounting-side surfaces of the components to be mounted onto the board are brought into contact with a bonding-assistant agent so that the bonding-assistant agent is supplied thereto to allow the bonding-assistant agent-supplied components to be mounted onto the board, the component mounting process includes, supplying the bonding-assistant agent to a first component among the plurality of components, and starting the supply of the bonding-assistant agent to a second component among the plurality of components before completion of the mounting of the bonding-assistant agent-supplied first component onto the board.

Component mounting apparatus

After a film layerformed from a die attach filmand a UV tapehas been provided as a mask on a semiconductor wafer, boundary trenchesfor partitioning semiconductor elementsformed on a circuit pattern formation surfaceare formed in the film layer, thereby making a surfaceof a semiconductor waferexposed. The exposed surfaceof the semiconductor waferin the boundary trenchesis etched by means of plasma of a fluorine-based gas, and the semiconductor waferis sliced into semiconductor chips' along the boundary trenches

Method for fabricating semiconductor chip

On a mask placement-side surface of a semiconductor wafer in which a plurality of semiconductor devices are formed, a mask is placed, while dicing lines for dicing the semiconductor wafer into the respective separate semiconductor devices are defined and a surface of a flawed semiconductor device among the respective semiconductor devices is partially exposed, and then plasma etching is applied to the mask placement-side surface of the semiconductor wafer so as to dice the semiconductor wafer into the respective semiconductor devices along the defined dicing lines, and an exposed portion of the flawed semiconductor device is removed so as to form a removed portion as a flawed semiconductor device distinguishing mark.

Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks

With use of a length-dimension of a second-line-segment of a unit-device-formation-region as an arrangement interval, a plurality of parallel lines are disposed in a device-formation-effective-region on a wafer so as to form a plurality of parallel-line-partition-regions, the unit-device-formation-regions are arranged in each of the parallel-line-partition-regions independently of and separately from other parallel-line-partition-regions so that the acquisition number of the unit-device-formation-regions is maximized, and an arrangement of the respective unit-device-formation-regions in the respective parallel-line-partition-regions is determined as an arrangement of the entire device-formation-effective-region.

Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regions

Growing community of inventors

Fukuoka, Japan

Hiroshi Haji