Fuji Photo Film Company, Limited

Nippon Telegraph and Telephone Corporation

Hitachi, Ltd.

Nec Corporation

Fujifilm Corporation

Hitachi High-tech Corporation

Olympus Corporation

Hitachi-high-technologies Corporation

Hino Motors, Ltd.

Kabushiki Kaisha Toshiba

Chugai Seiyaku Kabushiki Kaisha

Olympus Optical Company, Ltd.

Tokyo Shibaura Denki Kabushiki Kaisha

Fuji Photo Optical Co., Ltd.

Fujisawa Pharmaceutical Company, Ltd.

Hiroshi Fukuda

Toru Miura

Masahiro Fukuda

Yasunori Ohta

Naoyuki Nishino

Eiichi Kito

Ken Tsuzuki

Koichi Sakamoto

Naoki Kobayashi

Hiroki Kawada

Masahiko Sugimoto

Toshihiko Tanaka

Nobuo Shimma

Takashi Azuma

Natsuki Yokoyama

Yoshihiro Shiroishi

Shuntaro Machida

Osamu Komuro

Susumu Ogawa

Toshihiro Yamada

Yusuke Takahashi

Kenichi Takeda

Tatsuya Kato

Toshiyuki Mine

Makoto Isozaki

Kenichi Kawasaki

Naoki Yamamoto

Noriyuki Sakuma

Tatsuya Nagata

Harukazu Miyamoto

Yoshihiro Yamaguchi

Mikio Watanabe

Tadashi Suzuki

Yutaka Yoshida

Hiroyuki Matsukawa

Ryo Kawai

Kazuhisa Horikiri

Katsuro Watanabe

Keiji Tsubota

Hiroki Tanaka

Shin Kamei

Yoshiho Maeda

Daiki Harada

Kiyofumi Kikuchi

Naoki Mochizuki

Atsuhiko Ishihara

Atsuko Yamaguchi

Isao Umeda

Kazuhiko Takemura

Masahiro Sakaitani

Nobuhiro Oikawa

Takashi Saida

David Arfon Williams

Tsukasa Fujimori

Masayoshi Omura

Kazuo Miyaji

Yuko Hanaoka

Wataru Hattori

Susumu Komiyama

Tatsuya Maeda

Takao Ina

Kazuharu Ueta

Shunichi Soma

Takafumi Matsumura

Takuo Tsukuda

Nobuaki Kimura

Shiro Hashimoto

Tsuneo Tsukagoshi

Nobuhiro Aoki

Koji Yoshida

Shinichiro Umemura

Yoshiyuki Hirayama

Katsuyoshi Washio

Keishi Ohashi

Masukazu Igarashi

Takeshi Kamiya

Yuichi Suzuki

Shin-ichiro Umemura

Junko Ushiyama

Tomohiro Okada

Heewon Jeong

Masao Isshiki

Shuhei Yoshida

Yusuke Konishi

Shinji Mino

Satoshi Ueda

Nobuo Katsuma

Masahiro Tanomura

Motohaya Ishii

Hisayoshi Tsubaki

Yasuharu Hakamatsuka

Akira Kawase

Ikuya Tagawa

Sugio Makishima

Hideo Miura

Mizuki Iwanami

Toshihiro Itoh

Hiroyuki Irie

Hideyuki Kokubo

Kotaro Takeda

An object is to provide a measurement system or the like that enables selection of appropriate new measurement targets by performing measurement on a limited number of measurement points. Proposed is a system including a measurement tool; and a computer system configured to communicate with the measurement tool, in which the computer system is configured to calculate, based on feature data of a plurality of locations on a wafer received from the measurement tool, an in-plane distribution of the feature data on the wafer (C), select, based on the calculated in-plane distribution, a new measurement point for acquiring the feature data (D), calculate, based on feature data acquired by measuring the selected new measurement point (B), a new in-plane distribution of the feature data on the wafer (F), and output at least one of the feature data of the new measurement point and the in-plane distribution which are acquired by executing the selection of the new measurement point and the calculation of the new in-plane distribution at least once (H).

Measurement method, measurement system, and non-transitory computer readable medium

In an embodiment, an optical inspection circuit includes: an optical modulator comprising an optical waveguide on a substrate, the optical waveguide having a core comprising a semiconductor; a first input waveguide optically connected to the optical modulator, the first input waveguide having a core comprising the semiconductor; an output waveguide optically connected to the optical modulator, the output waveguide having a core comprising the semiconductor; a photodiode on the substrate in a vicinity of the optical modulator; a wire electrically connecting the optical modulator and the photodiode; and a second input waveguide optically connected to the photodiode, the second input waveguide having a core comprising the semiconductor.

Optical inspection circuit and optical inspection method

The purpose of this invention is to estimate the occurrence of defects such as probability pattern defects, with a small number of inspection points. To achieve this purpose, the present invention proposes a system and a computer-readable medium. The system comprises: a step in which first data pertaining to the probability that the edge of a pattern determined on the basis of measurement data for a plurality of measurement points on a wafer is present at a first position is acquired or is generated; a step in which, if the edge is at the first position, second data pertaining to the probability that a film defect covers a region including the first position and a second position which is different to said first position is acquired or generated; and a step in which the probability of the defect occurring is predicted on the basis of the first data and the second data.

System for estimating the occurrence of defects, and computer-readable medium

There is provided an optical waveguide constituted by a core made of a semiconductor and formed on a substrate. A grating coupler is provided at one end of the optical waveguide. Further, a reflecting portion formed on the optical waveguide by being optically coupled to the optical waveguide is provided at the other end of the optical waveguide. The optical waveguide constituted by the core includes a light intensity modulation unit that modulates an intensity of guided light in the optical waveguide. The light intensity modulation unit is constituted by a variable optical attenuator.

Optical circuit for alignment and optical alignment method

An alignment optical circuit includes: a plurality of grating couplers that are formed on a substrate and arranged on a line; a plurality of optical waveguides that are connected to the plurality of grating couplers, respectively. Further, the alignment optical circuit includes an optical sensor that is formed on the substrate and measures optical intensity at a first light-receiving spot and a second light-receiving spot on a line along an arrangement direction of the plurality of grating couplers.

Aligning optical circuit and aligning method

A stage, electric probes, an optical probe, an electric measurement device, an optical measurement device, and a first positioning mechanism are provided. The stage includes a second positioning mechanism that changes relative positional relationship between the electric probes and an electric connection portion of each of the optical elements. The electric probes electrically connect the electric measurement device and each of the optical elements. The optical probe optically connects the optical measurement device and each of the optical elements. The first positioning mechanism changes relative positional relationship between the optical probe and an optical connection portion of each of the optical elements.

Inspection device and method

An authentication device includes: a wearing position determination unit that determines a wearing position, the wearing position being a position at which a wearable article comprising a sensor is being worn on a body; and an authentication unit that performs authentication by using biometric information of the body, the biometric information being detected by the sensor at the wearing position.

Authentication device, authentication system, authentication method, and program

This invention relates to a method for manufacturing 9-ethyl-6,6-dimethyl-8-[4-(morpholin-4-yl)piperidin-1-yl]-11-oxo-6,11-dihydro-5H-benzo[b]carbazole-3-carbonitrile, and is industrially preferable, allowing an objective substance to be obtained in high yield more safely and easily than the conventional method.

Method for producing tetracyclic compound

A wearable article includes: an annular casing that surrounds a space into which a body of a user is to be inserted; a light-emitting element that is provided in the casing, the light-emitting element emitting light towards the space; an imaging element that is provided in the casing, the imaging element capturing and obtaining an image of the space when the light-emitting element emits light; and an authentication circuit that authenticates the user based on a vein pattern obtained in advance and the image.

Mount, authentication device, authentication method, and program

Plural grating couplers having grating conditions different from each other and plural optical waveguides respectively connected with the plural grating couplers are included. The plural grating couplers have the same arraying directions of gratings. Further, each of the plural grating couplers has a different grating interval as a grating condition. Further, plural reflection units respectively provided to the plural optical waveguides are included.

Optical circuit for alignment

An embodiment optical test circuit includes a first optical circuit and a second optical circuit formed on a substrate, an input optical waveguide optically connected to the first optical circuit and the second optical circuit, and an output optical waveguide optically connected to the first optical circuit and the second optical circuit. The optical test circuit also includes a light emitting diode optically connected to the input optical waveguide, and a photodiode optically connected to the output optical waveguide.

Optical test circuit

The purpose of the present invention is to provide a pattern measurement device that achieves both high-throughput measurement using a small number of measurements and high-accuracy measurement that uses statistical processing. To accomplish this purpose, the present invention proposes a pattern measurement device provided with a calculation processing device that acquires the signal intensity distribution for a plurality of positions included in a scanning region from a signal obtained through beam scanning; substitutes, into a probability density function having the signal intensity distribution as a random variable and the coordinates within the scanning region as a variable, a signal intensity distribution based on the signal obtained from the beam scanning; and for the plurality of positions within the scanning region, sets the coordinates within the scanning region at which the probability density function is at the maximum or at which prescribed conditions are met as the edge position.

Pattern measurement device and computer program

This invention pertains to an imaging method, the purpose of which is to reveal, over a wide range, information about a plurality of layers contained in a multilayer structure, or form an image of the revealed applicable layers. The method proposed includes: a step in which, while rotating the sample with the axis of the normal line of the sample surface as the axis of rotation, the sample is irradiated with an ion beam from a direction inclined with respect to the normal line direction, via a mask having an opening which selectively allows the passage of an ion beam and which is disposed at a position distant from the sample, thereby forming a hole with a band-shaped sloped surface that is inclined with respect to the sample surface; and a step in which a first image viewed from a direction intersecting with the sloped surface of the applicable layer is formed, on the basis of a signal obtained by irradiating, with a charged particle beam, the applicable layer contained in the band-shaped sloped surface.

Imaging method and imaging system

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Tokyo, Japan

Hiroshi Fukuda