Star Micronics Company Limited

Star Micronics., Ltd.

Hiroshi Fujinami

Yoshio Imahori

Kentaro Yonehara

Motoaki Ito

Yasunori Tsukuda

Takahiro Sone

Kazushi Suzuki

Yoshiharu Oishi

A circuit board forming member, a case forming member, a spacer forming member, a diaphragm sheet and a diaphragm plate forming member are laminated to form a portion, as excepting a back plate and a contact spring, of a condenser microphone, in plurality in a laminate. Moreover, the back plate and the contact spring are arranged in the air chamber, which is defined by the individual forming members, to form a plurality of condenser microphone constituents in the laminate. Next, the laminate is cut to separate the individual condenser microphone constituents thereby to manufacture the condenser microphones.

Method for manufacturing condenser microphone

By integrating plural condenser microphone constituting bodies in an array state, a condenser microphone array is obtained. The condenser microphone array is formed by dicing a laminate of a circuit board forming member, a housing forming member, a spacer forming member, diaphragm sheet, diaphragm plate forming member and a cover forming member which form a part of the plural condenser microphone constituting bodies respectively. In an air chamber of each condenser microphone constituting body constituted in the laminate, a back plate and a contact spring are built.

Microphone array

Microphone

Electroacoustic transducer

To provide an electret capacitor microphone in which change of sensitivity characteristic caused by thermal deformation of an electret layer can be prevented even in the case where a reflow process is carried out. An electret capacitor microphone includes: an electret capacitor portion including a diaphragm, and a back electrode plate disposed opposite to the diaphragm through a spacer; an electrically insulating bush for electrically insulating/supporting an outer circumferential edge portion of the back electrode plate; a metal cover in which the electret capacitor portion and the electrically insulating bush are stored; and a gate spring having a pressing function for elastically pressing the back electrode plate toward the diaphragm to form a predetermined gap between the electrically insulating bush and an inner surface of a rear wall of the metal cover. Consequently, collapse of a spacer-abutting portion of an electret layer is prevented from being caused by thermal expansion.

Electret capacitor microphone

An electroacoustic transducer adapted to be mounted on a printed circuit board in which a coil spring is accommodated and supported in a cylindrical recess of a frame while it is fixed to neither a terminal plate nor the frame. Particularly, a protruding pin of the coil spring is passed through a though hole of the terminal plate to allow a leading portion of the protruding pin to be hooked thereon. When the electroacoustic transducer is mounted on the printed circuit board, any horizontal displacement between the compressed spring and the printed circuit board would not cause stress concentration on the coil spring since the coil spring is onlly horizontally shifted in the cylindrical recess until a coil portion of the coil spring hits against the wall of the cylindrical recess.

A method of ultrasonic welding for a resin case in which an ultrasonic vibration is applied to the resin case in a direction parallel to the welding surface.

Growing community of inventors

Shizuoka, Japan

Hiroshi Fujinami