Fuji Xerox Co., Ltd.

Hiroshi Fujimagari

Kenichi Kobayashi

Kazuhiro Sakai

Masao Funada

Shinobu Ozeki

Tsutomu Hamada

Junji Okada

Chikaho Ikeda

Eiichi Akutsu

Masaki Hirota

Yoshihiko Fujimura

Kiyoshi Horie

Nanao Inoue

Koichi Saito

Hiroki Ishida

Takeshi Kamimura

Hiroo Soga

Takashi Ozawa

Koichi Haga

Koichi Saitoh

Ryoki Kato

Seiichi Kato

Koichi Naito

Shinya Kyouzuka

The invention relates to a multiprocessor system having plural processors and an optical bus shared by the plural processors, and intends to simplify the cache control, reduce the volume of hardware, and shorten the memory access processing time. For this purpose, the multiprocessor system of the invention includes a shared memory, a cache memory connected to the shared memory, an optical bus connected to the cache memory, and plural processors connected to the optical bus, which access to the cache memory through the optical bus.

Multiprocessor system

An optical bus system comprising an optical bus is furnished, along two opposed edges, with a plurality of signal light input/output portions for inputting and outputting signal light to and from the bus. Any one of the signal light input/output portions on one edge of the bus inputs signal light thereto and propagates the light to the opposite edge at which another signal light input/output portion outputs the propagated signal light from the bus. The system also comprises a plurality of light emitting/receiving circuits corresponding to the signal light input/output portions. Each light emitting/receiving circuit has a signal light sending unit and a signal light receiving unit. The signal light sending unit generates signal light and sends the generated signal light into the optical bus through the corresponding signal light input/output portion. The signal light receiving unit acquires a received light signal upon receipt of the signal light output by the corresponding signal light input/output portion. At least one of the light receiving/emitting circuits on each edge of the optical bus has a repeating or reflecting part that causes the corresponding signal light sending unit to send out the signal light received by the corresponding signal light receiving unit.

Optical bus system and signal processor

The present invention provides a multiple bus control device and others which can also be applied to access control by a signal having a directional propagation property for implementing various communication between/among modules. Each of plural modules makes a request for communication to a multiple bus control device by sending communication request information for specifying one or more communication partner modules to the multiple bus control device. The multiple bus control device checks an idle state of a module to be communicated and an idle channel in a multiple bus based upon received communication request information and permits communication between a module which sends communication request information using the idle channel and a communication partner module specified in the communication request information.

Communication device, multiple bus control device and LSI for controlling multiple bus

An optical-signal transmission apparatus and method for optical-signal transmission, or a signal processing apparatus for signal processing including optical-signal transmission. A number of terminals (circuit boards and the like) are connected, and communication can be freely performed among the terminals. A plurality of transmission nodes input optical signals having different light intensity levels into an optical transmission medium. A desired signal is separated and extracted from a multiplex signal where these optical signals transmitted from a reception node are overlaid.

Optical-signal transmission apparatus and method, and signal processing apparatus

When a forward or reverse voltage is applied to two diodes 1 and 2 connected in series in the same direction, the junction CP of the two diodes is switched for a comparatively low-impedance state to a high-impedance state or vice versa, so that a photoelectric transducer 3 connected to the junction CP is brought to either a reset or storage state. With an improved image pickup device having this construction, the impedance at the junction CP can definitely be held at low level in all instances without being influenced by the amount of illumination on the photoelectric transducer 3, whereby it can be saturated within a predetermined reset time so as to prevent the generation of residual charges.

Image pickup device providing decreased image lag

An image sensor is provided with a plurality of photodiodes each having a better forward-current responsiveness and a smaller dark current in the reverse direction. Each of the photodiodes includes a two-layered photoelectric conversion layer made of non-doped hydrogenated amorphous silicon. One of these two layers, which has an interface that prevents electrons from escaping when photogenerated electric charge is stored, is deposited at a lower temperature than the other. The photodiodes are arranged in rows on a transparent electrode. The photodiodes operate in pairs, each pair corresponding to one picture element and having a first photodiode connected to a second photodiode in series, with opposite polarity. All the first photodiodes are connected to a detecting circuit and all the second photodiodes are connected to a pulse generating circuit.

Image sensor

An image sensor capable of reading with high sensitivity at high speed, in which each light-receiving element consists of two photodiodes PD1 and PD2, which comprise a transparent substrate 1, a metal electrode 2, photoelectric transducing layers 3a and 3b, transparent electrodes 4a and 4b and an insulating layer 5, which layers are formed in superposition and patterned to provide PD1 and PD2 that are interconnected in such a way that the relationship of polarities of one photodiode is reverse to that of the other photodiode. The transparent electrode 4a of photodiode PD1 is connected to a common electrode wiring 7 (typically made of aluminum) via a contact hole 6a formed in the insulating layer 5, whereas the transparent electrode 4b of photodiode PD2 is connected to a lead wiring 8 (typically made of aluminum) via a contact hole 6b also formed in the insulating layer 5. The metal electrode 2 inter-connecting the photodiodes PD1 and PD2 is so specified in position that it is located only in an area that is capable of light reception.

Image sensor with noise reduction and diminishment of residual images

An image sensor having a linear array of a plurality of photodetecting element groups each including a plurality of photodetecting elements each consisting of first and second photo diodes connected in series and oppositely in polarity, in which read pulses are applied sequentially to the second photo diodes of the photodetecting elements of each photodetecting element group by a matrix drive system, and image signals are read by a read circuit connected to the first photo diodes of the photodetecting elements. In the image sensor, first capacitor portions are connected to the second photo diodes of the photodetecting elements. A first shift register is connected to the first capacitor portions for each photodetecting element group. The first shift register sequentially applies drive pulses to the photodetecting element groups. Second capacitor portions are connected to the second photo diodes of the photodetecting elements. A second shift register is connected to the second capacitor portions in a matrix fashion. The second shift register sequentially applies read pulses to the respective photodetecting elements. A leak unit is coupled with the second photo diodes of the photodetecting elements.

Image sensor having dual shift registers and a plurality of capacitors

An image sensor comprising a plurality of light-receiving elements, each of which consists of a pair of photodiodes connected in series-opposition. Since the voltages generated at these photodiodes when equal intensities of light is projected on them are equal to each other, no current leaks, thereby generating no noise.

Noise free, line form image sensor

A metal film and a doped a-Si film are deposited on a glass substrate, and successively etched by photolithography using the same resist pattern, to form a metal electrode and doped a-Si layers. The doped a-Si layers thus formed are then re-etched to remove portions protruding from the metal electrode. Then, a non-doped a-Si layer and a transparent electrode are successively formed on the doped a-Si layer. A protection film may additionally be deposited on the glass substrate before the deposition of the metal film.

Method of manufacturing an image sensor

A plurality of recording electrodes are disposed in parallel form on an elastic metallic thin plate through an insulating layer, a protrusion made of a conductive material is formed in the proximity of the tip of each of recording electrodes, and notched grooves are formed between the recording electrodes to partition the recording electrodes.

Print recording head

A print storage medium comprises a heat-generating layer for generating heat with an electrical signal input in accordance with a picture, the signal being supplied from a printing signal applying electrode to which the heat-generating layer is in pressure contact, an electrically conductive layer, an ink layer provided on the heat generated layer. The print storage medium is further provided with a plurality of microscopic electrodes on the storage medium with which the printing signal-applying electrode is in pressure contact, each of the microscopic electrodes being isolated from others. The electrically conductive layer may be formed of striped electrodes. The isolated microscopic patterns may be formed of electrically conductive ceramics or of electrically conductive resin.

Print storage medium

A current-conducting thermosensitive recording media used for non-impact recording which attains better energy efficiency and higher printing speeds through a thermosensitive recording ink medium comprising: a stratified ink support in which electrical conductivity in the direction of the thickness is greater than the electrical conductivity in the direction of the surface; a thermogenetic resistor layer for producing heat; a return electrode layer; a thermally melting ink layer; and an ink separating layer. The thermogenetic resistor layer, the electrode layer, the ink separating layer, and the thermally melting ink layer are laminated on the ink support in that order.

Thermal transfer recording media

A thermal-electrostatic ink jet recording head is formed of two spaced-apart insulating substrates with an electrostatic field forming electrode and an array of electric heating elements in the slit between the substrates. The heating elements are paired and each of the adjacent heating elements of a pair joined by a common electrode, with each heater having an independent electrode connectable to a switching circuit for selectively heating portions of the ink under the influence of an electrostatic field to cause ink in the heated portions to be jetted. The common electrode preferably is U-shaped with each of its free ends connected to the inner ends of the adjacent electrodes of a pair.

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Kanagawa, Japan

Hiroshi Fujimagari