Panasonic Corporation

Matsushita Electric Industrial Co., Ltd.

Sharp Corporation

Panasonic Intellectual Property Management Co., Ltd.

Hiroshi Fujii

Yukihiro Shimasaki

Hiroki Takeoka

Hiroshi Kubota

Nobuya Matsutani

Yukikazu Ohchi

Takeshi Takahashi

Osamu Inoue

Junichi Kato

Tsuyoshi Yoshino

Junichi Kurita

Masakazu Sugiyama

Wataru Iwahashi

Tsutomu Inuzuka

Tatsuo Fujii

Hiroshi Moritani

Shinji Harada

Michio Ohba

Tatsuji Aoyama

Koji Nomura

Yuji Mido

Kenji Kuranuki

Ayumi Kochi

Takeshi Masutani

Shogo Nakayama

Akihiko Ibata

Yoshitsugu Hirose

Katsuyuki Nakamura

Isao Ayukawa

Yuji Midou

Shinji Umeda

Hironori Motomitsu

Yasuhiro Hiraki

Hiroshi Serikawa

Ryo Majima

Takuya Kyouda

Ryosuke Kamiura

A metalized film capacitor includes metalized films, each of which is formed of an insulating film made of dielectric, and a vapor deposited metal electrode formed on an upper surface of the insulating film. An end of the vapor deposited metal electrode extends together with an end of the insulating film, and both the ends are connected to an electrode terminal. The vapor deposited metal electrode of the metalized film includes a center region and a low resistance section that is made of Al&#x2014;Zn&#x2014;Mg alloy. The low resistance section is disposed at an end of the electrode and is thicker than the center region. This metalized film capacitor has high humidity resistance.

Metalized film capacitor

A metallized film capacitor includes first and second metal electrodes, a dielectric film disposed between the first and second metal electrodes, and first and second external electrodes which are connected to the first and second metal electrodes, respectively. At least one of the first metal electrode and the second metal electrode comprises magnesium. The magnesium is distributed unevenly in the at least one of the first metal electrode and the second metal electrode.

Metallized film capacitor and case mold type capacitor including same

A metallized film capacitor includes a dielectric film and two metal vapor-deposition electrodes facing each other across the dielectric film. At least one of the metal vapor-deposition electrodes is made of substantially only aluminum and magnesium. This metallized film capacitor has superior leak current characteristics and moisture resistant performances, and can be used for forming a case mold type capacitor with a small size.

A metalized film capacitor includes a first dielectric film, a first metal thin-film electrode provided on a surface of the first dielectric film, a second dielectric film provided on the first metal thin-film electrode, and a second metal thin-film electrode provided on the second dielectric film, such that the second metal thin-film electrode faces the first metal thin-film electrode across the second dielectric film. The surface of the first dielectric film has a surface energy ranging from 25 mN/m to 40 mN/m. The metalized film capacitor exhibits high heat resistance and a preferable self-healing effect.

A metallization film capacitor that achieves both high heat resistance and high withstand voltage at the same time. A metal-deposited electrode is formed on a PEN film in each of a pair of metalized films. These metalized films are wound such that the metal-deposited electrodes face each other via the dielectric film in between. A metalized contact electrode is formed on both end faces of these wound metalized films to configure the metallization film capacitor. A divisional electrode is provided on the metal-deposited electrode. In addition, a fuse is coupled to this divisional electrode for providing a self-maintaining function. Pass rate a/b of a deposition pattern is set to 4.0 or smaller, where 'a' is the fuse width, and 'b' is the length of the divisional electrode in a lengthwise direction of the metalized films.

Metallization film capacitor having divided electrode with fuse

In a case-molded capacitor, an electrode of a capacitor element is connected with a busbar having an electrode terminal for external connection. The capacitor element and the busbar are placed in a metal case having an upper surface opening and are resin molded. A thermally-conductive insulator layer is provided between the capacitor element and a bottom surface of the metal case, hence providing the case-molded capacitor with a heat resistance.

Case-molded capacitor and method for using the same

A chip type solid electrolytic capacitor includes a capacitor element-laminate. In the capacitor element-laminate, a plurality of capacitor elements, each having an anode portion and a cathode portion, are laminated so that the anode portions of the adjacent capacitor elements are disposed in the direction opposite to each other. Anode lead terminals are joined to the bottom faces of the anode portions of the capacitor elements disposed at both ends of the capacitor element-laminate. A cathode lead terminal is joined to the bottom face of the cathode portion of the capacitor element disposed in the center of the capacitor element-laminate. An Electrically insulating exterior resin coats the capacitor element-laminate so as to expose at least a part of the bottom faces of the anode lead terminals and a part of the cathode lead terminal.

Chip type solid electrolytic capacitor

A common mode noise filter includes a nonmagnetic layer, first and second magnetic layers sandwiching the nonmagnetic layer between the magnetic layers and contacting the nonmagnetic layer, a plane coil provided between the first and second magnetic layers and contacting the nonmagnetic layer, and an external electrode connected electrically with the plane coil. The first and second magnetic layers include a magnetic oxide layer and an insulator layer provided on the magnetic oxide layer. The insulator layer contains glass component. This common mode noise filter has a large bonding strength between the external electrode and the insulator layer.

Common mode noise filter

A digital signal processor includes a component for processing a digital signal, a power line for supplying a power to the component, and a decoupling capacitor connected between the power line and a ground. The decoupling capacitor has an equivalent series resistance larger than zero and not larger than 25 m&#x3a9; at 100 kHz and an equivalent series inductance larger than zero and not larger than 800 pH at 500 MHz. This digital signal processor does not generate a lot of digital noise, and has a small, thin size.

Digital signal processor

A process for producing an aluminum electrode foil for a capacitor, which includes a first step of preparing an emulsion from a mixture including a first phase of a liquid resin or a resin solution obtained by dissolving a resin in a solvent, a second phase of a liquid that is incompatible with the first phase, and an emulsifier; a second step of coating the emulsion on a surface of an aluminum foil; a third step of removing the second phase to form a resin film having a plurality of pores on its surface; a fourth step of etching the aluminum foil having the resin film formed thereon; and a fifth step of removing the resin film after etching. The production process can form high-density etching pits with high accuracy.

Process for producing aluminum electrode foil for capacitor and aluminum foil for etching

The present invention provides a composite magnetic body containing metallic magnetic powder and thermosetting resin and having a packing ratio of the metallic magnetic powder of 65 vol % to 90 vol % and an electrical resistivity of at least 10&#x3a9;&#xb7;cm. When a coil is embedded in this composite magnetic body, a miniature magnetic element can be obtained that has a high inductance value and is excellent in DC bias characteristics.

Method of manufacturing a magnetic element

A chip-type solid electrolytic capacitor has a four-terminal structure. The chip-type solid electrolytic capacitor includes capacitor elements laminated such that anode electrodes face alternately in opposite directions; a pair of anode terminals opposing each other; and a pair of cathode terminals opposing each other. The magnetic fluxes generated by current passing between respective terminals are mutually cancelled, thus allowing ESL to be drastically reduced. Further reduction of ESL is feasible by shortening the distance between the terminals as much as possible so as to reduce the current loop area.

Chip-type solid electrolytic capacitor

Composite magnetic body, and magnetic element and method of manufacturing the same

Growing community of inventors

Toyama, Japan

Hiroshi Fujii