Nec Corporation

Ricoh Company, Ltd.

Japan Aviation Electronics Industry, Limited

Otsuka Pharmaceutical Factory, Inc.

Pax Co., Ltd.

Otsuka Clinical Solutions, Inc.

Hiroshi Endoh

Satoshi Kojima

Yutaka Suzuki

Shingo Sakashita

Yoshiaki Ichimura

Rintaro Takahashi

Tomoki Murayama

Keisuke Tada

Kouzou Uekido

Mitsuo Komoto

Kenichi Uehara

Shinya Miike

Daisuke Misawa

Chihiro Kikuchi

Ayumi Oikawa

Yoshihiko Saruwatari

An image forming apparatus, including: photoconductor; charging unit; exposing unit; developing unit containing toner; transfer unit; and fixing unit, wherein the toner includes external additive and base particles containing binder resin, colorant, and release agent, the toner has melt viscosity at 100&#xb0; C. of 500 Pa&#xb7;s to 8,000 Pa&#xb7;s and the release agent has melt viscosity at 100&#xb0; C. of 20 mPa&#xb7;s to 30 mPa&#xb7;s, the fixing unit includes fixing member that has roller or belt shape and contacts toner image transferred onto recording medium, and the fixing member includes release layer on surface thereof that is to be brought into contact with the toner image transferred onto the recording medium, and wherein the release layer satisfies the following expressions:45&#x2266;&#x3b8;1&#x2266;60, and10&#x2266;&#x3b8;1&#x2212;&#x3b8;2,

Image forming apparatus

A method for manufacturing a toner, including at least: dissolving or dispersing a toner material including at least any one of a binder resin and a precursor of a binder resin in an organic solvent which is dispersed in a dispersant-including aqueous medium; forming particles by removing the organic solvent; washing the particles; forming voids in the particles by heating to a temperature T while or after dispersing the particles in an aqueous medium; forming toner base particles by adding a charge controlling agent; and adding an external additive to the toner base particles to obtain toner particles, wherein the T is between a glass transition temperature Tg of the toner particles and Tg+25&#xb0; C., and the toner has a cross-sectional void fraction Sp/St of 0.1% to 15.0%, where St is a cross-sectional area of the toner particles, and Sp is a cross-sectional area of the voids.

Method for manufacturing toner, toner and image forming method

An LSI package structure with high efficiency of the power supply and fast transmission of the signal is provided in which: adjacent to a pin 8 side surface of an LSI package 1, a power supply member 2 having an electrically conductive portions 6 and 7 for power supply bus and ground bus respectively, and a flexible interconnection board 3 having a power supply pattern layer 3b and a ground pattern layer 3a connected to the portions 6 and 7 respectively via a pin 9, are disposed; the pins 8 and 9 each extend through a through hole 3c formed on the interconnection board 3, the power supply pattern layer 3b and the pins 8 and 9 for power supply being interconnected within the through hole, the ground pattern layer 3a and the pins 8 and 9 for grounding being interconnected within the through hole; and the signal input/output pin 8 and a connector 5 of a signal input/output coaxial cable 5a are interconnected at the side of the interconnection board 3 oppsite the LSI package 1.

Large scale integrated package structure

A coaxial multicore receptacle is provided which has a plurality of ground pins set upright on an insulating substrate and arranged in a matrix pattern, a plurality of signal pins set upright on the substrate each being located at the center of each box of the matrix pattern, first metallic lattice boards provided perpendicularly to the substrate each being positioned correspondingly to and above each column of the ground pins, and second metallic lattice boards provided perpendicularly to the substrate each being positioned correspondingly to and above each row of the ground pins. The first and second lattice boards cross one another orthogonally to define angular coaxial contact insertion holes surrounded by the boards and arranged in the matrix pattern. Each of the first lattice boards is formed with notches in the end portion on the side of the substrate to provide ground pin contact springs which are in elastic contact with the corresponding ground pins. As a coaxial contact is inserted into one of the coaxial contact insertion holes, a center conductor of the coaxial contact comes into contact with the corresponding signal pin.

Coaxial multicore receptacle

Growing community of inventors

Tokyo, Japan

Hiroshi Endoh