Kaneka Corporation

Hiroshi Ando

Toshihiko Okamoto

Katsuyu Wakabayashi

Fumio Kawakubo

Hiroshi Ito

Atsushi Fukunaga

Yoshiteru Masaoka

Hidetoshi Odaka

Yoshiyuki Kohno

Hiroshi Iwakiri

Sadao Yukimoto

Junji Takase

Masashi Sakaguchi

Hideharu Jyono

Katsuyu Osaka Factory Kaneka Corp Wakabayashi

Katsuyu c/o Osaka Factory Wakabayashi

Disclosed are a curable composition characterized by using a curable composition including an organic polymer (A1) having one or more silicon-containing functional groups capable of cross-linking by forming siloxane bonds in which the one or more silicon-containing functional groups capable of cross-linking by forming siloxane bonds are silicon-containing functional groups each having three or more hydrolyzable groups on one or more silicon atoms thereof; and a method for controlling the recovery properties, durability and creep resistance of the cured article. Herewith, the present invention provides a curable composition capable of giving a cured article excellent in recovery properties, durability and creep resistance, and a method for controlling the recovery properties, durability and creep resistance of the cured article.

Curable composition and method for improving recovery properties and creep properties

Disclosed are a curable composition characterized by using a curable composition including an organic polymer (A) having one or more silicon-containing functional groups capable of cross-linking by forming siloxane bonds in which the one or more silicon-containing functional groups capable of cross-linking by forming siloxane bonds are silicon-containing functional groups each having three or more hydrolyzable groups on one or more silicon atoms thereof; and a method for controlling the recovery properties, durability and creep resistance of the cured article. Herewith, the present invention provides a curable composition capable of giving a cured article excellent in recovery properties, durability and creep resistance, and a method for controlling the recovery properties, durability and creep resistance of the cured article.

Curable composition and methods for improving recovery properties and creep properties

An object of the present invention is to provide a curing composition which is practically curable and highly adhesive even though a non-organotin compound is included as a curing catalyst. Problems involved are solved by a curing composition characterized by including (A) an organic polymer having one or more silicon-containing groups capable of cross linking by forming siloxane bonds, (B) a metal carboxylate and/or carboxylic acid, and (C) a silicon compound having a hetero atom on the carbon atom in the &#x3b1; or &#x3b2; position with respect to the silicon atom.

Curing composition

The present invention provides a curable composition which has a high recovery ratio, a high creep resistance, a practical curability and storage stability. The present invention relates to a curable composition comprising a reactive silicon group containing organic polymer (A) and a carboxylic acid (B), wherein the composition comprises (I), as the carboxylic acid (B), a carboxylic acid (C) in which the carbon adjacent to the carbonyl group is a quaternary carbon atoms and/or the composition comprises (II) a metal carboxylate (D) formed between a carboxylic acid in which the carbon atoms adjacent to the carbonyl group is a quaternary carbon atoms and a metal atom of 208 or less in atomic weight.

Curable composition

The present invention provides a novel photocurable composition containing an organic polymer having an epoxy group and/or oxetane group-containing silicon group at an end and a cationic photoinitiator. For example, the photocurable composition contains an organic polymer (A) having an epoxy group and/or oxetane group-containing silicon group at an end, and a cationic photoinitiator (B), the organic polymer (A) being produced by addition reaction between an organic polymer terminated with an unsaturated group and a hydrosilane compound having an epoxy group and/or an oxetane group.

Photocuring resin composition containing organic polymer having epoxy group and/or oxetane group-containing silicon group at end, and method for producing same

The present invention provides a one-part curable composition, comprising (A) an organic polymer having a silicon-containing group capable of cross-linking by forming siloxane bonds; (B) a metal carboxylate; and (C) a carboxylic acid smaller in molar quantity than the (B) component metal carboxylate, the one-part curable composition being simultaneously practical in recovery ratio, durability, creep resistance, storage stability and adhesion.

One-part curable composition

A curable composition is characterized by comprising an organic polymer having at least one silicon-containing group which has a hydroxy or hydrolyzable group bonded to the silicon atom and which is crosslinkable by forming siloxane bonds, and a specific metal salt of a carboxylic acid. The composition ensures practical curability and recovery properties and has mechanical properties including high strength and high elongation.

An organic polymer is provided which has an end structure expressed by general formula (1): In the formula, Rrepresents an alkyl group having a carbon number in the range of 1 to 20, an aryl group having a carbon number in the range of 6 to 20, an aralkyl group having a carbon number in the range of 7 to 20, or a triorganosiloxy group expressed by (R')SiO&#x2014;. Rrepresents an alkyl group having a carbon number in the range of 1 to 20, an aryl group having a carbon number in the range of 6 to 20, an aralkyl group having a carbon number in the range of 7 to 20, an alkoxy group having a carbon number in the range of 1 to 20, or a triorganosiloxy group expressed by (R&#x2032;)SiO&#x2014;. X represents a monovalent organic group having an epoxy group and/or an oxetanyl group. m represents an integer in the range of 0 to 20. n represents an integer of 1, 2, or 3.

Organic polymer having epoxy-and/or oxetanyl-containing silicon group at the end and process for producing the same

The invention provides a curing agent for two-pack type curable composition use having excellent storage stability, and also provides a curing agent composition which comprises a hydrolyzable silyl group-containing compound (a), a non-phthalic acid ester based plasticizer (b) having no phthalic acid ester structure in its molecule, and a bivalent tin based curing catalyst (c), that satisfies all of mechanical properties, recoverability and adhesiveness to substrate, can be mixed easily when used and has excellent storage stability, and a two-pack type curable composition which hardens when a base resin composition comprising a curable organic polymer (d) having in its molecule a functional group crosslinkable by a reaction catalyzed by a bivalent tin based curing catalyst (c), an epoxy group-containing silane compound (f) and an epoxy compound (g) is mixed with the above curing agent composition.

Two-pack type curable composition and hardener therefor

To provide curable resin compositions capable of exhibiting a low modulus, a high break strength, a high elongation and a satisfactory water-resistant adhesiveness to mortar. One of which includes (a) an organic polymer having at least one reactive silicon group in one molecule, (b) an amino group-substituted silane compound, and (c) an epoxy group-substituted silane compound; and another of which includes (a) an organic polymer having at least one reactive silicon group in one molecule, (b) an amino group-substituted silane compound, (c) an epoxy group-substituted silane compound, and (d) an epoxy resin.

Curable resin compositions

Process for the preparation of polyether oligomer containing reactive silicon group

A one-pack type curable resin composition having high adhesive strength to various substrates, good storage stability and excellent restoring properties is disclosed. The one-pack type curable resin composition contains an organic polymer (a) having at least one reactive silicon group per molecule, a compound (b) having reactive silicon group in its molecule, a non-phthalate plasticizer (c) having no phthalate structure in its molecule, and a stannous curing catalyst (d).

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Akashi, Japan

Hiroshi Ando