Daikin Industries, Ltd.

Other

Toho Kasei Ltd.

Hiroshi Aihara

Norio Maeda

Masao Oono

Mitsuru Kishine

Koji Sumi

Hiroyuki Tanaka

Yutaka Ueta

Tatsuya Morikawa

Masanori Kitaichi

Junpei Terada

Hideya Saito

Sadashige Irie

Naoaki Izutani

Katsuhide Otani

Mitsuo Tsukamoto

Kazuo Miura

Yoshiki Maruya

Hiroyuki Sagami

Nobuaki Yagi

Takayuki Matsuo

Takao Matsumoto

Naoaki Izu Tani

A fluorine-containing elastomer composition for a heat dissipation material, including a fluorine-containing elastomer being VdF-based fluoroelastomer having a Mooney viscosity at 121&#xb0; C. of 10 or lower and an insulating thermal conductive filler. Also disclosed is a sheet obtained by molding the fluorine-containing elastomer composition.

Fluorine-containing elastomer composition for heat dissipation material and sheet thereof

A device for drying substrate comprising a processing vessel housing a specified number of substrates such as semiconductor wafers installed erectedly in parallel to one another, a first substrate supporting member supporting substrates within the processing vessel, the processing fluid supplying section supplying to the processing vessel, the processing fluid for performing processing such as cleaning processing on the substrates, a processing fluid exhausting section exhausting processing fluid from the processing vessel, and a drying fluid supplying section supplying, to the processing vessel, the liquid drops of drying fluid for performing drying processing on the substrates.

Method and device for drying substrate

A device for drying substrates which stores a plurality of substrate () and which comprises a processing container () to which cleaning fluid () after cleaning the substrates () is drained and an injection nozzle () for injecting drying fluid located at the terminating part of a feed pipe () through which liquid drying fluid is supplied, whereby an exhaust equipment is eliminated or simplified, and the drying fluid is fed smoothly.

A device for processing a substrate comprises a processing vessel ( ), an outer vessel ( ) for surrounding the processing vessel ( ) which outer vessel ( ) can be sealed, a first supporting member ( ) for bringing the substrate ( ) into and out from the processing vessel ( ) which first supporting member ( ) supports the substrate ( ) in a standing manner, and a second supporting member ( ) for transferring the substrate ( ) between the first supporting member ( ) which second supporting member ( ) is movable up and down within the processing vessel ( ). The device processes the entire surface of the substrate ( ) uniformly and prevents varying in processing from occurrence.

Device for processing wafer

A process for preparing a fluorine-containing polymer through emulsion polymerization method which enhances productivity while maintaining excellent physical properties of the fluorine-containing polymer and comprises (a) a first polymerization step for emulsion-polymerizing a fluorine-containing monomer or a mixture of a fluorine-containing monomer and a non-fluorine-containing monomer in an aqueous medium in the presence of a radical polymerization initiator and an emulsifying agent, (b) a dilution step for diluting the obtained aqueous emulsion of polymer particles with water to reduce the number of emulsified polymer particles per unit amount of aqueous medium in the emulsion and a concentration of emulsifying agent, and (c) a second polymerization step for emulsion-polymerizing a fluorine-containing monomer and/or a non-fluorine-containing monomer in the obtained diluted emulsified solution.

Process for preparing fluorine-containing polymer

Flourine-containing elastic copolymer excellent in molding

To perform an even, high temperature baking treatment at about 450.degree. C. to a cryopump for the achievement of an extremely high vacuum, the cryopump is divided into two, a pump section P and a refrigerator R; the pump section P is cut off, with a vacuum state maintained, from the refrigerator R; and cooling stages 49 and 69 of the refrigerator R are connected through detachable heat transfer means 53 and 73 to cryopanel 2 and 5 of the pump section P, whereby the pump section P and the refrigerator R being detachably connected together. A drive unit of the refrigerator R and a casing 1 of the pump section P are connected together by a bellows 36, and at least a part of the transfer means 53, which connects the cooling stage 49 and 69 of the refrigerator R to the cryopanels 2 and 5 of the pump section P, made of a flexible material.

Cryopump

Growing community of inventors

Sakai, Japan

Hiroshi Aihara