Fujitsu General Limited

Hiroshi Abiko

Takashi Sugiyama

Atsushi Itagaki

Toshiyuki Fuji

Nobuyuki Dobata

Masanori Noguchi

A heat pump apparatus includes: a refrigerant circuit which includes a compressor, a utilization-side heat exchanger for exchanging heat between water and refrigerant, an electronic expansion valve, and an outdoor heat exchanger; a controller which controls the compressor and the electronic expansion valve; a subcooling value calculating unit which calculates a subcooling value of the refrigerant circuit; a condensing pressure detector which detects condensing pressure of the compressor; a compressor rotation number detector which detects rotation number of the compressor; and an objective subcooling value extracting unit which selects and extracting an objective subcooling value stored in advance, from the condensing pressure and the rotation number of the compressor. The controller adjusts an opening degree of the electronic expansion valve so that the calculated subcooling value of the refrigerant circuit reaches the objective subcooling value.

Growing community of inventors

Kawasaki, Japan

Hiroshi Abiko