Kanegafuchi Kagaku Kogyo Kabushiki Kaisha

Kaneka Corporation

Kanegafuchi Chemical Ind. Co., Ltd.

Sanyo Electric Co., Ltd.

Kanegafuchi Kagaku Kogyo K.k.

Hirosaku Nagano

Shoji Hara

Hitoshi Nojiri

Hiroyuki Furutani

Hideki Kawai

Kazuya Yonezawa

Yoshifumi Okamoto

Junya Ida

Kiyokazu Akahori

Hiroyuki Tsuji

Hiroshi Wakabayashi

Kazuaki Kira

Takashi Itoh

Takashi Sakubata

Kazuhisa Danno

Takehiko Noguchi

Masaru Nishinaka

Junji Takase

Tsuneo Yamamoto

Tetsuo Yoshioka

Kosuke Kataoka

Akinori Hisanaga

Kiyoyuki Namura

Naoki Hase

Shigeru Sakamoto

Hiroko Sanda

Haruhiko Maki

Hidekazu Kuromatsu

Hiroshi Ito

Yoshihide Oonari

Yoshiaki Inaba

Shinji Inoue

Masao Nakata

A multilayer structure comprising a conductor layer, an adhesive layer, and a polymer film layer interposed between the conductor layer and the adhesive layer. The multilayer structure can be used to provide a multilayer wiring board having excellent electrical properties and an excellent balance of physical properties, high heat resistance, a narrow pitch wiring pattern, a small-diameter via, uniform insulating layer thickness, an appropriately low coefficient of linear expansion, and stable adhesiveness between a metal and the polymer film. The polymer film layer may contain at least one repeating unit represented by formula (1) in the molecule. The present invention also provides a multilayer wiring board obtained from the multilayer structure.

Multilayer structure and multilayer wiring board using the same

A solid polymer electrolyte membrane and a catalytic layer are properly assembled even when the solid polymer electrolyte membrane and an ion exchange resin in the catalytic layer are formed of different materials. In a fuel cell, a solid polymer electrolyte membraneis provided with a first solid polymer electrolyte membrane, and second solid polymer electrolyte membranesandprovided at respective sides thereof. The second solid polymer electrolyte membranesandare formed of the same material as the ion exchange resin (not shown) included in a catalytic layerand a catalytic layer

Solid polymer electrolyte membrane, solid polymer electrolyte fuel cell using the membrane and method of fabricating the same

Copper foil with insulating adhesive

Thermally fusible adhesive copolymer, articles made therefrom, and

The invention solves a problem of that sufficient adhesive intensity to satisfy recent demand for high adhesive property cannot be obtained by conventional surface treatment, and provides a method of improving adhesive property of polyimide film and achieving distinctly improved effect of adhesive property. The invention further provides novel polyimide film having improved adhesive property. A method for improving adhesive property of polyimide film according to the present invention comprises a combination of steps of; execution of a liquid applying process for treating polyimide film surface by exerting physical mechanical force on said film surface under the condition of that said film surface remains wet with water or organic solvent, or solution of organic solvent or aqueous solution; and execution of a surface treatment process for treating polyimide film surface by performing selected treatment among flame treatment, alkaline treatment, coupling agent treatment or surface treatment by way of projecting grinding material of fine grading onto film surface at high velocity, and said steps are performed in an arbitrary order. For example, using a surface treating device 10 shown in FIG. 1, consecutive execution of a surface treatment process for treating film surface, a liquid applying process and a drying process is realized by that polyimide film 22 is run from a feeding device 18 to a winding device 20.

Method of improving adhesive property of polyimide film and polymidefilm

The object of the invention is to solve a problem of bending of laminate caused by hardening contraction of epoxy resin that has been a subject in laminate used conventional epoxy resinous composition in laminate of two or more than two layers used for electric and electronic parts, and to provide a novel laminate obtaining excellent adhesive property and heat resistant property, and exhibiting no bending. The inventive laminate achieving the above object comprises laminating at least the following two components (a) and (b): (a) resin composition comprising thermosetting resin composed of imide carbonate synthesized by reacting cyanate resin and compound which containing at least 1 or more than 1 phenolic hydroxyl, and epoxy resin (b) heat resistant resin obtaining glass transition temperature of 150.degree. C. or more than 150.degree. C. and thermal expansion coefficient of 0.4 to 3.8.times.10.sup.-5 cm/cm/.degree.C. at the temperature of 20.degree. (ordinary temperature) to 150.degree. C. The inventive thermosetting resin composition has been consummated by converting cyanate resin into imide carbonate under the presence of epoxy resin.

Laminate

The invention provides novel thermoplastic polyimide featuring solid adhesive property under low temperature, low hygroscopic coefficient, and solid resistivity to radioactive rays. The invention also provides novel polyamide acid which is substantially precursor of the thermoplastic polyimide, and also provides novel thermally fusible laminated film for covering conductive wires, featuring solid adhesive property under low temperature, solid resistivity to radioactive rays, and distinct suitability for covering superconductive wires in particular. The novel thermoplastic polyimide is represented by general formula (1) corresponding to the chemical structure shown below; ##STR1## wherein, Ar.sub.1, Ar.sub.2, Ar.sub.4, and Ar.sub.6, respectively designate divalent organic radical, whereas Ar.sub.3 and Ar.sub.5 respectively designate quadrivalent organic radical, wherein, 1, m, and n, respectively designate positive integer 0 to 1 or more than 1, wherein the sum of 1 and m aggregates 1 or more than 1, and wherein t designates positive integer of 1 or more than 1.

Thermoplastic polyimide, polyamide acid, and thermally fusible laminated

The present invention provides an improved grade of polyimide containing an organic phosphorus compound, a film composed thereof and a method of making the aforementioned film. According to the present invention, it is possible to obtain a polyimide film improved in mechanical strength.

Polyimide film and manufacturing method thereof

Disclosed is a thermosetting resin composition comprising cyanate resin, a compound containing at least one or more than one of a phenolic hydroxyl radical and an epoxy resin, wherein said resin has excellent adhesive and heat resistant properties while at the same time possessing a low hardening contraction rate and contributing to higher dimensional stability, and method of making the same.

Thermosetting resin composition and method of manufacturing it from an

Thermoplastic polyimide polymer; thermoplastic polyimide film; polyimide

A process for producing a flexible printed circuit board comprising a metallic foil and a polyimide is provided, which comprises coating a metallic foil with a resin solution prepared by adding a tertiary amino compound to a solution of a polyamic acid (a polyimide precursor) represented by the following general formula (I): ##STR1## followed by the imidization thereof, the amount of said tertiary amino compound added to the solution being 10 to 50 parts by weight per 100 parts by weight of solid polyamic acid contained in said resin solution. According to the present invention, a flexible printed circuit board which is free from curling, wrinkling and warping, and which has excellent heat resistance, electrical characteristics and mechanical properties is provided with a simplified production process.

Process for producing flexible printed circuit board

The present invention provides a copolyimide characterized in that the copolyimide contains units represented by formulas (I) and (II) ##STR1## (wherein R.sub.0 represents an aromatic tetracarboxylic residue). The polyimide has excellent thermal dimensional stability, and can be fabricated by using conventional inexpensive materials.

Polyimide having excellent thermal dimensional stability

Disclosed is a film of polyimide having repeating units of formula (1) and a birefringence (.DELTA.n) of at least 0.13: ##STR1## wherein R.sup.1 is an aromatic group having a valency of 4, at carbon atoms constituting the aromatic ring, and R.sup.2 is an aromatic group having a valency of 2, at carbon atoms constituting the aromatic ring. This polyimide film exhibits good thermal dimensional stability.

Polyimide film

A process for manufacturing a polymer includes the first step of reacting a solution of one of two starting materials in an organic solvent with the other material in the form of a powder, and the second step of reacting a solution of the reaction product of the first step in an organic solvent with a solution of the other material in an organic solvent. The process preferably includes one or both of two additional steps, i.e. filtering the reaction product of the first step, and degassing the reaction product of the second step by stirring it at a reduced pressure. An apparatus for carrying out the process is also disclosed. This invention makes it possible to produce a polymer of high and uniform quality having a final viscosity controlled within a certain range and not containing foreign matter or bubbles.

Process and apparatus for manufacturing polymers

Disclosed is a process for continuously mixing two liquid components, whose one liquid component is a two-liquid curing type resin which comprises continuously supplying one liquid component under stirring into a mixing container and pouring the other liquid component into said container by pushing open a needle forcibly provided to a check valve, the improvement wherein said needle is pushed open with a non-curing liquid, thereafter, a curing liquid is poured into said mixing container. According to the present invention, when, for example, a polyamide acid and a curing agent are caused to mix and react with each other, a transparent polyimide mixed uniformly is obtained and high quality molded articles of polyimide are provided therefrom.

Process for continuous mixing of a two-liquid curing type resin

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Otsu, Japan

Hirosaku Nagano