Mitsubishi Electric Corporation

Mitsubishi Denki Kabushiki Kaisha

Seiko Kabushiki Kaisha

Hiroo Sakamoto

Daisuke Echizenya

Shiro Takada

Masayuki Miyazaki

Hiroaki Morikawa

Atsushi Michimori

Takashi Okamuro

Tsutomu Yamaguchi

Kenzo Mori

Junko Itoh

Takehiro Nishida

Hiromichi Aoki

Hideya Ito

Tsuneo Hamaguchi

Takashi Sugahara

Keiichiro Utsunomiya

Hisashi Tominaga

Yoshihisa Tashiro

Tesshin Yazu

Takashi Shirase

Nobuaki Ando

Ikio Sugiura

Kazushi Nagasawa

Taisuke Sueda

Toshihiro Takahashi

Masaki Iwata

A failure prediction device is provided for predicting, using a structure having a high degree of design freedom, failure at a soldered joint due to vibration stress, and a circuit board using the same. The failure prediction device is disposed on a substrate having a mounting component that is fixed thereon through a solder joint. The failure prediction device is provided with a load amplifying portion that includes a pair of support leg portions each having one end to be fixed to the substrate or the mounting component, and a sacrificial fracture portion that is supported by the other ends of the pair of support leg portions, wherein the load amplifying portion transmits, to the sacrificial fracture portion via the pair of support leg portions, vibration that is applied to the substrate.

Failure prediction device and circuit board using the same

To obtain a reinforcing frame capable of securing sufficient reinforcing strength and adhesive strength while suppressing a manufacturing cost by omitting a rim-like frame. A reinforcing frame is adhered to a rear surface, which is a non-light receiving surface of a solar battery panel, and includes a cylindrical portion that has a cylindrical shape along a longitudinal direction of the reinforcing frame and on which an adhesive surface for adhering to the solar battery panel is formed, and protruding portions that protrude from end portions along a longitudinal direction of the adhesive surface and that are substantially parallel to the adhesive surface.

Reinforcing frame and solar battery module

A solar cell includes a silicon substrate, an aluminum electrode that collects electricity from the rear surface of the silicon substrate, and a silver electrode that extracts output from the aluminum electrode. The aluminum electrode includes an opening formed on the rear surface of the silicon substrate. On a side of the opening is formed a notch that recesses parallel to the direction in which principal stress acts in a plane of the silicon substrate. The silver electrode covers at least the opening and the notch of the aluminum electrode.

Solar cell

A solar cell module includes a plate-shaped solar panel including a plurality of solar cells arranged on same plane; a plate-shaped cell protection member that covers the plural solar cells that are arranged on the same plane; and a surface protection member that is bonded onto a top surface of the cell protection member; an outer frame that supports a circumference of the solar panel; and a brace having rigidity against bending and that supports a center area of a back surface of the solar panel in such a manner that both ends of the brace are joined to each of two opposed positions of the outer frame. An initial tension is provided to the brace.

Solar cell module

A semiconductor laser chip is joined to an AlN sub-mount in a junction-down manner. The sub-mount is joined to a package. The AlN sub-mount is joined to a stem. The direction perpendicular to the irradiation direction of a laser beam emitted from the semiconductor laser chip is the direction of the width of the sub-mount. The thickness and the width of the AlN sub-mount are determined so that the product of the equivalent stress applied to the center of the surface of the semiconductor laser chip joined to the sub-mount and the stress in the direction of the width of the sub-mount does not exceed 70% of the maximum value of the product obtained by changing the thickness and the width of the AlN sub-mount.

Semiconductor light emitting device and method for manufacturing the same

Cathode ray tube

The present invention relates to a band connection fitting which, in order to connect a band, is provided with a connector which is arranged at one end of the band, and which has a spring bar which is provided with press buttons which are pressable from both sides of the band in a crosswise direction; and a receiving member which is arranged on the other end of the band, and which has claws which engage the press buttons when in the normal state, and which release the engagement when the press buttons are pressed inward from both sides of the band in a crosswise direction. The band connection fitting of the present invention operates easily and with certainty, and has high durability.

Band connection fitting

Growing community of inventors

Tokyo, Japan

Hiroo Sakamoto