Nissan Chemical Industries Limited

Senju Metal Industry Co., Ltd.

Hiroo Nagai

Hisao Ikeda

Toshihiko Taguchi

Shozo Asano

Ken'ichi Osawa

Eiji Ohyama

Masahito Yoshimura

A water-soluble soldering flux and paste solder using the flux are disclosed, the flux comprising, as a main fluxing agent, a resinous reaction product of at least one carboxyl-containing compound having 8 or less carbon atoms, selected from the group consisting of monocarboxylic acids, polycarboxylic acids, and hydroxy-carboxylic acids with tris-(2,3-epoxypropyl)-isocyanurate.

Water-soluble soldering flux and paste solder using the flux

An isononyl acrylate monomer composition of acrylates of C.sub.9 alcohols obtained by a hydroformylation and a hydrogenation of C.sub.8 olefins obtained by a dimerization of a butane-butene fraction containing n-butene separated from butadiene which comprise 3 to 20 wt. % of olefins having one isobutane skeleton and less than 3 wt. % of olefins having quaternary carbon and more than 90 wt. % of a total of n-octenes, monomethylheptenes and dimethylhexenes and 0.8 to 2.0 of a ratio of a total of n-octenes and monomethylheptenes to dimethylhexenes.

Isononyl acrylate monomer composition

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Funabashi, Japan

Hiroo Nagai