Rohm Co., Ltd.

Hiroo Mochida

Junichi Hikita

Yoshihiro Ikefuji

Hideki Hayashi

Takayuki Nakashima

Kazutaka Shibata

Goro Nakatani

Yoshikazu Shimada

Katsutoshi Nagi

There is provided a liquid crystal display device including a first transparent substrate and a second transparent substrate pasted to each other via a liquid crystal sealing space in between, and provided with a predetermined display region. The first transparent substrate is integrally formed with an extension extending further than an edge of the second transparent substrate and longitudinally of the edge of the second transparent substrate. The extension is provided with at least one semiconductor chip having a longitudinal axis laid longitudinally of the extension. The extension is formed with an external connection terminal region including a plurality of terminals. The external connection terminal region does not overlap the semiconductor chip widthwise of the extension.

Method of making semiconductor chips for liquid crystal display device

A semiconductor device has a first semiconductor chip and a second semiconductor chip superposed on and bonded to the surface of the first semiconductor chip. In the region on the first semiconductor chip where the second semiconductor chip is bonded thereto, connection pads are arranged in positions that fit a plurality of predetermined types of semiconductor chips. On the second semiconductor chip, connection pads are arranged in positions that fit the connection pads arranged on the first semiconductor chip.

Semiconductor device and semiconductor chip for use therein

A chip-on-chip-structure semiconductor device for a radio communication device, having a base band chip and a high-frequency chip piled up on and bonded to the surface thereof. The base band chip has a low-frequency signal processing unit for processing a signal in a first frequency band. The high-frequency chip has a high-frequency signal processing unit for processing a signal in a second frequency band of which frequency is higher than that of the first frequency band.

Semiconductor device for radio communication device, and radio communication device using said semiconductor device

There is provided a liquid crystal display device including a first transparent substrate and a second transparent substrate pasted to each other via a liquid crystal sealing space in between, and provided with a predetermined display region. The first transparent substrate is integrally formed with an extension extending further than an edge of the second transparent substrate and longitudinally of the edge of the second transparent substrate. The extension is provided with at least one semiconductor chip having a longitudinal axis laid longitudinally of the extension. The extension is formed with an external connection terminal region including a plurality of terminals. The external connection terminal region does not overlap the semiconductor chip longitudinally of the extension.

Liquid crystal display device and method of making semiconductor chips for liquid crystal display device

A semiconductor device is built by combining together a plurality of semiconductor chips, but nevertheless allows easy functional checking of the individual semiconductor chips before they are assembled together without provision of extra pads for such checking.

Semiconductor device

A semiconductor chip having an internal circuit formed on a semiconductor substrate and a chip connection pad formed on the semiconductor substrate and used for interchip connection to another semiconductor chip. Further formed on the semiconductor substrate are an other-service-than-interchip-connection pad used for other service than interchip connection, and a switching circuit for selectively connecting, to the internal circuit, the chip connection pad or the other-service-than-interchip-connection pad.

Semiconductor chip and multichip-type semiconductor device

An integrated circuit device as a first IC chip, a second IC chip, and a circuit board having a hole formed therein that is large enough to permit the second IC chip to be accommodated therein. The first and second IC chips are bonded together so as to be electrically connected together, and the first IC chip is mounted on the circuit board with the second IC chip accommodated in the hole formed in the circuit board. Here, one of the IC chips forming a chip-on-chip structure is accommodated in the hole formed in the circuit board, making further thickness reduction possible. Moreover, the obverse surfaces of the IC chips are located closer to the circuit board, making possible wireless mounting of the IC chips, despite forming a chip-on-chip structure, on the circuit board through connection using bumps. This helps reduce trouble due to inductance in a circuit that handles a high-frequency signal.

Integrated circuit device

A semiconductor chip is bonded to the surface of another semiconductor chip with a predetermined gap secured in between. The semiconductor chip has a plurality of bumps formed on the surface thereof facing the other semiconductor chip. The bumps include functional bumps that contribute to electrical connection between the chips and dummy bumps that do not contribute thereto.

Semiconductor chip and semiconductor device having a chip-on-chip structure

A liquid crystal display includes a compact LC panel. The LC panel includes transparent front and rear plates between which a liquid crystal layer is disposed. The rear plate has a projecting portion which avoids facing the front plate. The projecting portion carries a semiconductor chip for display control and two capacitors cooperating with the semiconductor chip. One of the capacitors, first capacitor, is located farther from the semiconductor chip than the other or second capacitor is. A first conductor is provided for connecting the first capacitor to the semiconductor chip, and a second conductor is provided for connecting the second capacitor to the same chip. The first and the second conductors are made substantially equal in electrical resistance.

Liquid crystal display having capacitors on a substrate with equal resistance conductors electrically connecting the capacitors to a chip

A semiconductor device has a first semiconductor chip having a device formed thereon and a second semiconductor chip having a protection circuit for protecting the device formed thereon. The second semiconductor chip is superposed on and bonded to the surface of the first semiconductor chip.

Semiconductor device having a chip-on-chip structure

A semiconductor device having a chip-on-chip structure in which a semiconductor chip having a connecting pad formed on its surface and a surface movable element overlapped with and joined to the surface of the semiconductor chip are overlapped with each other. The surface movable element has a movable element and a connecting pad on its surface opposite to the semiconductor chip. The connecting pad on the surface of the semiconductor device and the connecting pad on the surface of the surface movable element are connected to each other through a pad joint. The pad joint ensures an operating space for allowing an operation of moving the movable element between the semiconductor chip and the surface movable element. The movable element may be a surface acoustic wave element.

A semiconductor device has a semiconductor substrate, an internal circuit formed on the semiconductor substrate, a connection pad formed on the semiconductor substrate and connected to the internal circuit, and a test pad formed on the semiconductor substrate so as to be connected to the connection pad and used for functional testing of the internal circuit. The semiconductor substrate has a bonding region provided on the surface thereof so as to allow another semiconductor substrate to be superposed thereon by being bonded thereto, with the connection pad formed inside the bonding region and the test pad formed outside the bonding region.

A multichip semiconductor device has a first semiconductor chip and a second semiconductor chip superposed on and bonded to each other so as to form a chip-on-chip structure. The first semiconductor chip has a field-programmable gate array circuit and a switch circuit formed thereon. The second semiconductor chip has a non-volatile configuration memory circuit formed thereon for storing the setting information about how to set the circuit of the field-programmable gate array circuit.

Growing community of inventors

Kyoto, Japan

Hiroo Mochida