Toray Industries, Inc.

Hiroo Hiramoto

Gentaro Ohbayashi

Masuichi Eguchi

Susumu Umemoto

A radiation-sensitive composition is described, which is comprised of (1) a polymer containing repeating units of the formula: ##STR1## wherein R.sup.1 is a trivalent or tetravalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R.sup.2 is a divalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R.sup.3 is hydrogen or an ammonium ion, n is 1 or 2, and COOR.sup.3 is located in an ortho or peri position with respect to the amide linkage, (2) an organic compound having a radiation-dimerizable or radiation-polymerizable olefinic double bond and an amino radical or a quaternary ammonium salt, and (3) an aromatic monoazide compound [III] having no substituent or having a neutral or acidic substituent. This composition has a highly improved radiation sensitivity and the sensitive wavelength region of this composition is very broad. This composition can give a highly heat-resistant relief pattern with a good edge sharpness. Heat-resistant relief patterns obtained from this composition are especially useful as insulating passivation or protective coatings in semiconductor devices.

Radiation-sensitive polyamide polymer composition with anthraquinone

A radiation-sensitive composition is described, which is comprised of (1) a polymer containing repeating units of the formula: ##STR1## wherein R.sup.1 is a trivalent or tetravalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R.sup.2 is a divalent aromatic or heteroaromatic residue having 6 to 30 carbon atoms, R.sup.3 is hydrogen or an ammonium ion, n is 1 or 2, and COOR.sup.3 is located in an ortho or peri position with respect to the amide linkage, (2) an organic compound having a radiation-dimerizable or radiation-polymerizable olefinic double bond and an amino radical or a quaternary ammonium salt, and (3) an aromatic secondary or tertiary amine compound which is chemically inactive to actinic radiation. This composition has an improved photo-sensitivity or radiation sensitivity and can give highly heat-resistant relief patterns with a good edge sharpness and good mechanical and chemical properties as well as good insulating properties. Heat-resistant relief patterns obtained from this composition are especially useful as insulating, passivating or protective coatings in semiconductor devices.

Radiation sensitive polymer composition

A process of forming a polyimide pattern on a base plate, which comprises exposing imagewise a layer of photosensitive polyimide precursor on the base plate, removing unexposed areas by developing and curing the resultant pattern of the polyimide precursor, characterized by employing a developer containing (A) at least one solvent selected from the group consisting of N,N-dimethylacetamide, N-methyl-2-pyrrolidone, N,N-dimethylformamide, dimethylsulfoxide and .gamma.-butyrolactone, (B) methanol and (C) at least one solvent represented by the formula;

Process of forming polyimide pattern and developer therefor

This invention relates to a photosensitive composition comprising a precursor of a heat resistant polymer having carboxylic groups and a compound having a photosensitive olefinic double bond and an amino or quaternary ammonium salt. The photosensitive composition can give highly heat resistant relief patterns with good edge sharpness, good mechanical and chemical properties as well as good insulating properties. The heat resistant relief patterns obtained from the composition of this invention are especially useful as insulating, passivation or protective coatings in semiconductor devices.

Growing community of inventors

Otsu, Japan

Hiroo Hiramoto