Soc Corporation

Sanoh Industrial Co., Ltd.

San-O-Industrial Corporation

Kyushu Institute of Technology

Hiroo Arikawa

Yasutada Yuza

Masaya Maruo

Koh Ishimura

Akira Taniguchi

Toshitaka Ogawa

Shinya Ohtsuka

Hiroki Suetomi

Manabu Furusawa

Fumihiro Akiyoshi

Akihiko Kanehara

Yuji Kuwana

Seiji Norisue

Yoshitake Ohga

A method for manufacturing a chip fuse, comprises: a liquid film forming step for forming a liquid film of dispersion liquid having metal nanoparticles dispersed therein on a principal surface of a substrate; a fuse film forming step for forming a fuse film on the principal surface by irradiating the liquid film with laser light; and a first terminal forming step for forming first terminals that each connects to the fuse film on each of both end sides in a longitudinal direction of the fuse film on the principal surface.

Chip fuse

An image forming device includes an attachment part to which a toner unit having a fuse that can be molten by being supplied with an electric current is detachably attached, and a control part that applies each of a non-melting conduction signal corresponding to a first current supply state where the fuse is not molten and a melting conduction signal corresponding to a second current supply state where the fuse is molten to the fuse. The control part detects each of whether or not the fuse is molten by applying the non-melting conduction signal and whether or not the fuse is molten by applying the melting conduction signal. The control part determines whether or not the toner unit attached to the attachment part is a specific exchange unit on the basis of a detection result of whether or not the fuse is molten.

Image forming device, exchange unit and method for determining exchange unit

A liquid matrix of a nonmagnetic material is accommodated within an insulative container of a nonmagnetic material, and a pair of electrodes is disposed within the insulative container such that the electrodes face each other via the liquid matrix. Conductive particles are fluidly dispersed in the liquid matrix. A magnetic field generation section is provided externally of the insulative container so as to generate a magnetic field in a direction orthogonal to a fuse element to be formed between the paired electrodes through chaining of the solid particles.

Self-recovery current limiting fuse

Fuse

A miniature fuse of surface mount type having a stable pre-arcing time-current characteristic and a strong time lag characteristic The fuse is easy to produce, and provides a constant pre-arcing time. The main body of the fuse is of rectangular ceramic construction of split type. A fusible member ( ) wound around a ceramic rod ( ) and is rested on a recessed portion ( ) of the lower ceramic casing ( ). The end portion ( ) of the fusible member ( ) is engaged with the side surface of the casing. The upper ceramic casing ( ) is laid on the lower casing, so that the caps ( ) are fit onto the opposite ends of the main body. The end portion ( ) of the fusible member ( ) and the cap ( ) are connected by welding. At the time of welding, projections ( ) to be fit in the recessed portions ( ) provided at the main body, is formed at the cap ( ), so that the cap ( ) can be fixed to the main body.

Miniature fuse of surface-mount type

An overcurrent protective circuit includes a N-type depletion mode FET, a P-type depletion mode FET, and a switch. The sources of the N-type depletion mode FET and the P-type depletion mode FET are connected to each other. The gate of the N-type depletion mode FET is connected through a resistor to the drain of the P-type depletion mode FET. The gate of the P-type depletion mode FET is connected through a resistor to the drain of the N-type depletion mode FET. The drain of the N-type depletion mode FET is a positive external terminal of the circuit, while the drain of P-type depletion mode FET is a negative external terminal of the circuit. A switch electrically connects and disconnects between the gate of the N-type depletion mode FET and the gate of the P-type depletion mode FET.

Resettable overcurrent protective circuit

A chip fuse is disclosed which includes a hollow insulating body and a fusible element extending through the body the respective ends thereof being engaged with end portions of the body. Two terminals are fitted onto the end portions of the body. Each terminal includes a projection for fixing the terminal to the end portion of the body. The body may include two grooves into which respective projections are fitted.

A chip fuse is disclosed which includes a hollow insulating body and a fusible element extending through the body, the respective ends thereof being engaged with end portions of the body. Two terminals are fitted onto the end portions of the body. Each terminal includes a projection for fixing the terminal to the end portion of the body. The body may include two grooves into which respective projections are fitted.

A microchip fuse is disclosed which includes a casing constructed from box-like upper and lower members. On the end surfaces of both members, electrode sections are provided which are formed by plating metal onto a sintered conductive paste on the end surfaces. Grooves are provided on the members and filled with insulating material. A fusible element extends through the insulating material and the inner surface as formed when the both members are jointed together. The end portions of the fusible element are soldered to the electrode sections. A hollow portion is provided in the casing adjacent to the inner space by way of a thin wall to dampen the pressure of a gas generated during the interruption process.

Microchip fuse with a casing constructed from upper and lower members

A chip fuse is disclosed which includes a rectangular parallelepiped box shaped main body with an opening on the upper side thereof, and a cover covering the opening. Two main terminals are disposed on opposite shorter side walls of the main body. A plurality of subsidiary terminals are located along inner faces of the opposite longer walls of the main body. A fusible element is extended, inside the main body, between one of the main terminals via a some or all of the plurality of subsidiary terminals and the other of the main terminals in a zigzag manner.

Time-current characteristics variable chip fuse

A chip-type micro-fuse including a fusible element, a hollow body made of heat-resistant and insulative materials having at lesat two recesses which are respectively formed on an outer peripheral surface thereof, near the ends thereof and two end caps adapted to respectively cover the ends of the body for electrically connecting the body with external circuits. The end portions of the fusible element are respectively connected at the recesses to the end portions of the body. Further, the recess defined near one end portion of the body is positioned diagonally spaced with respect to another recess defined near the other end of the body. Thus, the fusible element is diagonally stretched between the ends of the body across the inner space of the body. When assembled, the end portions of the fusible element are respectively drawn out from the interior of the fuse without damaging the fusible element and connected at the recesses to the body. Furthermore, the end portions of the body are respectively fitted into the corresponding end caps such that the end portions of the fusible element are firmly held between the outer peripheral surface of the body and the inner walls of the end caps, respectively. Thus, this highly reliable chip-type micro-fuse can readily be made simply by inserting the end portions of the body into the end caps by the use of a press.

Chip-type micro-fuse

A fuse for use in a high-voltage circuit which has a first fusible element through which most of a current in the fuse flows in a normal state of the fuse and which further breaks into two pieces when overcurrent flows therethrough and further has a second fusible element provided around the first fusible element and adapted to burn in response to the overcurrent for further melting to remaining pieces of the first fusible element in such a manner as to enlarge the distance between the remaining pieces of the first fusible element to an extent sufficient to prevent occurence of a surplus arc therebetween. Further, material of material the first fusible element has a smaller electrical resistance, a larger cross-sectional area and a lower melting point than that of the second fusible element.

Fuse for use in high-voltage circuit

A chip fuse comprises a fuse base and a cover therefor both made of a heat resistant and electrically insulating material. The fuse comprises a pair of electrically conductive terminals, each having one end exposed outside of said base for soldering to a printed circuit board, with the other ends of the conductive terminals being spaced apart and in opposed relation to one another inside the fuse base. A fusible element is stretched between the inner ends of said conductive terminals and is secured to said ends by soldering or other suitable means.

Chip type fuse

A chip type fuse comprises a fuse base and a cover therefor both made of a heat resistant and electrically insulating material. The fuse includes a pair of electrically conductive terminals, having portions exposed outside of the fuse base and having ends disposed within the fuse. A fusible element is stretched between the ends of the conductive terminals inside the fuse. The fuse base has leg portions extending below the bottom of the base and is adapted to be soldered to a printed circuit board.

Chip type fuse having connecting legs

A thermal cut-off device comprises a casing and a cover therefor both made of a highly heat conductive electrically insulating material such as ceramic. A pair of lead wires protrude from opposite ends of the casings with the other ends of the wires being electrically connected to an electrical assembly within the casing. The electrical assembly comprises a leaf spring, a conductive fixed terminal and a plastic mass for biasing the leaf spring so as to contact the fixed terminal during closed circuit condition. A helical spring in the casing stabilizes the leaf spring upon its release when the plastic mass melts due to overheating.

Growing community of inventors

Tokyo, Japan

Hiroo Arikawa