Seiko Epson Corporation

Hironori Suzuki

Chikara Kojima

Koji Ohashi

Hiroshi Matsuda

Kanechika Kiyose

Shuichi Tanaka

Tomoaki Nakamura

Yasuyuki Matsumoto

Katsuhiro Imai

Takahiro Kamijo

Jiro Tsuruno

Eiji Osawa

Tomohide Onogi

Tomohiro Sayama

A mounting structure includes: a first substrate that has a first surface on which a functional element is provided; a wiring portion that is provided at a position, which is different from a position of the functional element on the first surface, and is conductively connected to the functional element; a second substrate that has a second surface that is opposite to the first surface; and a conduction portion that is provided on the second surface, is connected to the wiring portion, and is conductively connected the functional element. The shortest distance between the functional element and the second substrate is longer than the longest distance between the second substrate and a position where the wiring portion is connected to the conduction portion.

Mounting structure, ultrasonic device, ultrasonic probe, ultrasonic apparatus, and electronic apparatus

A piezoelectric device includes a substrate having opening portions, a vibrating plate provided to overlap with the substrate and having a plurality of vibrating regions overlapping with the opening portions in a plan view as seen from a thickness direction of the substrate, piezoelectric elements provided in the vibrating regions, and bypass wires provided outside of the vibrating regions of the vibrating plate and electrically coupled to the plurality of piezoelectric elements, wherein slits penetrating the bypass wires in the thickness direction are provided in the bypass wires.

Piezoelectric device having plurality of vibrating regions and electronic apparatus

An MEMS device includes: a first member; a second member forming a sealed space with the first member therebetween; and a third member disposed between the first member and the second member and joined to the first member and the second member, in which the third member has lower rigidity than rigidity of the first member and the second member, and the third member is provided with a communication portion that establishes communication between the sealed space and an external space.

MEMs device and electronic device

An ultrasonic device according to an aspect of the present disclosure includes a substrate in which an opening section piercing through the substrate in a thickness direction is provided, a vibration plate provided on the substrate to close the opening section, a piezoelectric element provided in a position corresponding to the opening section on a first surface at the opposite side of the substrate side of the vibration plate, and an elastic layer provided in contact with a second surface at the substrate side of the vibration plate at the inner side of the opening section of the substrate. The elastic layer includes a curved surface recessed to the vibration plate side at the opposite side of the vibration plate side.

Ultrasonic device and ultrasonic sensor

An ultrasonic sensor includes a vibration plate that includes a vibration portion and is formed of a resin; a wall portion that is provided on the vibration plate, surrounds the vibration portion and is formed of a resin; and a piezoelectric element that is provided in the vibration portion of the vibration plate. Accordingly, the wall portion surrounding the vibration portion can suppress a frequency variation of an ultrasonic wave output from the ultrasonic sensor and can deform the ultrasonic sensor into a shape corresponding to a surface of an object having various shapes.

Ultrasonic sensor, ultrasonic device, and method of manufacturing ultrasonic sensor

A piezoelectric film includes a substrate having flexibility, and at least two piezoelectric elements provided to the substrate so as to be arranged at intervals of a first dimension along a first direction, the piezoelectric elements are each configured by stacking a first electrode film, a piezoelectric film made of an inorganic material, and a second electrode film along a thickness direction of the substrate, and an area between the piezoelectric elements adjacent to each other along the first direction forms a vibrational region which can be displaced in the thickness direction.

Piezoelectric film, piezoelectric module, and method of manufacturing piezoelectric film

An ultrasonic sensor includes an element substrate having a first and a second surface at an opposite side of the first surface, including an opening section piercing through the element substrate in a Z direction from the first to second surface, a vibrating plate on the first surface of the element substrate to close the opening section, a plurality of vibration regions extending along an X direction orthogonal to the Z direction on the vibration plate in positions overlapping the opening section, and a plurality of piezoelectric elements to correspond to the plurality of vibration regions of the vibration plate. The opening section includes, on the first surface, a first and second side parallel to the X direction and a third and fourth side coupling end portions in the X direction of the first and second sides at an acute or obtuse angle to the first and the second side.

Ultrasonic sensor and electronic device

An ultrasonic element includes an element substrate including a first surface, a second surface having a front-back relation with the first surface, an opening section piercing through the element substrate from the first surface to the second surface, and a partition wall section surrounding the opening section, a supporting film provided on the first surface of the element substrate to cover the opening section and including a third surface facing the opening section and a fourth surface having a front-back relation with the third surface, a piezoelectric element provided on the fourth surface of the supporting film and disposed in a region overlapping the opening section of the supporting film in a plan view from a film thickness direction extending from the third surface to the fourth surface, a sealing plate provided to be opposed to the fourth surface of the supporting film and joined to the supporting film by an adhesive member via a beam section projecting toward the supporting film, and a wall section provided on the fourth surface of the supporting film and provided to project toward the sealing plate between the beam section and the piezoelectric element.

Ultrasonic element and ultrasonic device

An ultrasonic sensor includes an opening portion, vibrating plate covering the opening portion, piezoelectric element overlapping with the opening portion, and a coupling electrode coupled to the piezoelectric element, extended from a position overlapping the opening portion to a position not overlapping the opening portion, and having a line width smaller than a width of the piezoelectric element. The piezoelectric has a first and second line portion, and a corner portion coupling the first and second line portions, when an intersection point connects a center of gravity of the piezoelectric and the corner portion with a virtual circle inscribed in the outline of the piezoelectric is a first intersection point of a tangent line. The first intersection point with the first and second line portions are a second and third intersection points, the coupling electrode coupled to a corner portion from the second intersection point to the third intersection point.

Ultrasonic sensor and ultrasonic apparatus

An ultrasonic device includes a base member including a first surface and a second surface different from the first surface, a vibration plate provided at the first surface of the base member, and a piezoelectric element provided at the vibration plate. The base member includes a hole formed from the first surface to the second surface, and a wall portion surrounding the hole. The vibration plate includes, when viewed in a direction from the first surface toward the second surface, a supporting portion overlapping the wall portion, and a blocking portion that overlaps the hole and blocks the hole. The piezoelectric element is laminated at the blocking portion. The supporting portion has a first Young's modulus. The blocking portion includes a first blocking portion having the first Young's modulus and a second blocking portion having a second Young's modulus smaller than the first Young's modulus.

Ultrasonic device and ultrasonic apparatus

An ultrasonic device includes nine ultrasonic array units arranged in a grid pattern of three rows and three columns, nine drive bypass wires that input and output drive signals to and from the respective ultrasonic array units, a first common bypass wire to which a common potential is applied, coupled to the eight ultrasonic array units, a second common bypass wire coupled to the ultrasonic array unit to which the first common bypass wire is not coupled, and a third common bypass wire coupling the first and the second common bypass wires. One of the drive bypass wires, the first common bypass wire, and the second common bypass wire is placed between the ultrasonic array units placed adjacent to each other. The third common bypass wire is placed inside of the ultrasonic array unit placed adjacent to the ultrasonic array unit coupled to the second common bypass wire.

A mounting structure includes a first substrate that has a first surface on which a functional element is provided, a wiring that is provided at a position which is different from a position of the functional element on the first surface, and is connected to the functional element, a second substrate that has a second surface facing the first surface, and a conductor that is provided on the second surface, and is connected to the wiring and the functional element, in which the shortest distance between the functional element and the second substrate is longer than a distance between a position where the wiring is connected to the conductor, and the second substrate.

An ultrasonic device has a substrate in which ultrasonic elements transmitting an ultrasonic wave in a first direction are arrayed. A reverberation reduction film which reduces reverberant vibration of the substrate is arranged on a side of the first direction in the ultrasonic element. In the reverberation reduction film, a groove is arranged between the ultrasonic elements next to each other.

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Chino, Japan

Hironori Suzuki