Ngk Spark Plug Company, Limited

Sony Corporation

Murata Manufacturing Co., Ltd.

Hironori Sato

Tadahiko Kubota

Akira Yamaguchi

Kunihiko Hayashi

Yuzuru Fukushima

Masahiro Miyamoto

Masaki Kuratsuka

Hiroyuki Suzuki

Akira Ichihashi

Kazunaga Higo

Kimio Tajima

Erina Yamada

Hideto Watanabe

Takuya Torii

Kenji Suzuki

Masaki Muramatsu

Shigeru Taga

Eiji Kodera

Kenji Nishio

Masao Izumi

Hitoshi Nagura

Hidemasa Igarashi

Masatsune Arakawa

Tomohito Ando

A battery is provided including an anode, a cathode and an electrolyte; wherein the electrolyte includes one or both of fluoro ethylene carbonate and difluoro ethylene carbonate in an amount of 0.5% by mass or more and 10% by mass or less, wherein the anode includes an anode active material layer provided on an anode current collector, and wherein a thickness of the anode active material layer, after charging the battery, is 58 um or more and 75 um or less.

Battery

The present application provides a nonaqueous electrolyte secondary battery that includes, a cathode capable of being electrochemically doped/dedoped with lithium, an anode capable of being electrochemically doped/dedoped with lithium, and an electrolyte placed between the cathode and the anode, wherein the electrolyte contains at least one of fluoro ethylene carbonate represented by Chemical Formula (1) and difluoro ethylene carbonate represented by Chemical Formula (2) as a solvent and the ratio of a discharge capacity B during discharging at a 5C rate to a discharge capacity A during discharging at a 0.2C rate ((B/A)&#xd7;100) is 80% or more.

Nonaqueous electrolyte secondary battery

A nonaqueous electrolyte secondary battery includes a positive electrode, a negative electrode, and a separator disposed between the positive electrode and the negative electrode. The separator includes a substrate layer and a surface layer formed on at least one principal plane of the substrate layer, the surface layer contains polyvinylidene fluoride and an inorganic material particle, and an amount of deformation against pressure of the surface layer is larger than that of the substrate layer.

Nonaqueous electrolyte secondary battery and separator

A nonaqueous electrolyte battery is provided. The nonaqueous electrolyte battery includes an anode; a cathode; a separator; an electrolytic solution including a solvent and an electrolyte salt; wherein the solvent includes a fluoro ethylene carbonate, wherein the nonaqueous electrolyte battery has a discharge capacity ratio of a discharge capacity B when discharging at a 5 C rate to a discharge capacity A when discharging at a 0.2 C rate ((B/A)&#xd7;100%), and wherein the discharge capacity ratio is 80% or more. An electrical apparatus including a nonaqueous electrolyte battery is also provided.

Nonaqueous electrolyte battery and electrical apparatus

A wiring board including a conductor post corresponding to high-density packaging is provided. The wiring board may include a conductor layer, a solder resist layer laminated thereon, and a conductor post provided at least within the through-hole and that is electrically connected to a conductor layer which is disposed in a lower portion of a through-hole provided in the layer, wherein the solder resist layer comprises a thermosetting resin; the conductor post comprises tin, copper, or a solder and includes a lower conductor post located within the through-hole and an upper conductor post located above the lower conductor post and projected outside the layer; the lower conductor post includes an external alloy layer disposed on an external side surface thereof; and the conductor post is brought into intimate contact with an internal side surface of the through-hole via the external alloy layer.

Wiring board

A wiring board including a conductor post corresponding to high-density packaging is provided. The wiring board may comprise a conductor layer, a solder resist layer laminated on the conductor layer, and a conductor post that is electrically connected to a conductor layer which is disposed in a lower portion of a through-hole provided in the solder resist layer, wherein the solder resist layer comprises a thermosetting resin; the conductor post comprises tin, copper, or a solder; the conductor post includes a lower conductor post, which is located within the through-hole and includes an external side surface and a lower end surface, and an upper conductor post, which is located above the lower conductor post and is projected outside the solder resist layer; and at least a part of a lower end surface of the upper conductor post is brought into intimate contact with an outer surface of the solder resist layer.

Wiring board and method of manufacturing the same

A wiring substrate is configured such that each of laminate portions provided above and below a substrate core includes insulating layers and conductor layers stacked alternately. Of the conductor layers of the laminate portions, signal line layers are treated with a silane coupling treatment, which is a surface modification treatment, so that each signal line comprises a flat surface. A roughening treatment is performed on the remaining conductor layers of the laminate portions such that the surfaces of these layers are roughened. This structure provides an advantage when high-frequency signals are transmitted through the signal line layers. That is, when each signal line comprises a flat surface, an increase in conductor loss due to the skin effect can be prevented. In addition, by means of chemical bonding attained through the silane coupling treatment, the reliability of adhesion between the signal line layers and the insulating layer is sufficiently attained.

Wiring substrate and method of manufacturing the same

A method for manufacturing a reliable multilayer wiring substrate at a relatively low cost having little or no warpage or distortion is provided. In certain embodiments an insulation core made of an insulation material that is more rigid than that of resin insulation layers is prepared. A through hole is formed through core upper and lower surfaces of the insulation core, and a through hole conductor is formed therein. A plate-like substrate is prepared, and resin insulation layers and at least one conductor layer are laminated on the substrate to form a first buildup layer. The insulation core is laminated on the first buildup layer so as to electrically connect the conductor layer and the through hole conductor. Resin insulation layers and at least one conductor layer are then laminated on the insulation core. Lastly, the substrate is separated from the first buildup layer to yield a multilayer wiring substrate.

Method for manufacturing multilayer wiring substrate

A method of fabricating a wiring board including at least one conductor layer and at least one resin insulating layer, the method including a wiring groove forming step of forming a wiring groove in the resin insulating layer by irradiating a surface of the resin insulating layer with a laser, and a wiring layer forming step of forming the conductor layer such that at least a portion of the conductor layer is embedded in the wiring groove to form a wiring layer in the wiring groove.

Method of fabricating wiring board

A ceramic printed circuit substrate includes a glass ceramic substrate and a surface circuit pattern, which is formed on the substrate by use of a conductive paste. The conductive paste contains conductive components of silver and platinum and filler components of molybdenum, tungsten, manganese dioxide, silicon dioxide and copper oxide. A ceramic green sheet and a surface circuit pattern formed thereon by use of the conductive paste are simultaneously fired at a temperature not higher than 1000&deg; C., thereby yielding the ceramic printed circuit substrate.

Growing community of inventors

Aichi, Japan

Hironori Sato