Hitachi, Ltd.

Hironori Oikawa

Takeshi Hizono

Kenichi Yoshida

Hiroshi Ito

Shinji Matsushita

Takashi Maruyama

Hitoshi Yokota

Katsuya Sato

Kazuma Kishi

Mikihiro Tanaka

Hiroyuki Inokuchi

Hiroyuki Mano

Shigeo Ohashi

Kazushi Kobayashi

Kazuaki Tanaka

Takashi Naganawa

Rintaro Minamitani

Hitoshi Suzuki

Tomohisa Kohiyama

Takeshi Igarashi

Goro Ohnishi

Masayuki Saeki

Naohisa Koizumi

As an electronic device cooling apparatus which allows refrigerant liquid to circulate and flow in a cooling system by using a pump so as to cool a heat generating portion of an electronic device, a heat generating portion cooling unit which is connected to the pump, which receives heat from the heat generating portion of the electronic device, and which releases the heat to the refrigerant liquid through a fin portion so as to cool the heat generating portion includes independently therein a first flow channel through which the refrigerant liquid discharged from a discharging port of the pump is drawn in to be guided to the outside of the heat generating portion cooling unit through the fin portion, and a second flow channel through which the refrigerant liquid cooled at the outside is drawn in to be guided towards a sucking port of the pump.

Electronic device cooling apparatus and electronic device including the same

An electronic apparatusin which is mounted an electronic unit having a plurality of heat-generating sections including at least a first heat-generating section and a second heat-generating section includes: a hold framefor holding the electronic unit, a first heat-conducting memberfor transmitting heat generated by the first heat-generating section, a second heat-conducting memberfor transmitting heat generated by the second heat-generating section, and a cooling unitfor releasing the heat transmitted through the first and second heat-generating sections; in which apparatus, the first heat-conducting memberis heat-connected to the cooling unit, and the second heat-conducting memberis heat-connected to the cooling unitvia the hold frame

Cooling system for an electronic unit with plural heat-generating sections

In a liquid cooling system, comprising: a heat-receiving jacket for receiving heat from a heat-generation body therein; a heat-radiator for radiating the heat therefrom, which is received within the heat-receiving jacket; and a tank for accumulating refrigerant therein, which is connected with the heat-receiving jacket and the heat-radiator through flow passages, thereby enclosing a refrigerant within the heat-receiving jacket, the heat-radiator and the tank, including the flow passages provided therebetween, and further comprising: a liquid transfer means for generating a circulation flow of the refrigerant enclosed therein, wherein the tank is built up on one side surface of a substrate having superior heat-conductivity and heat-resistance, defined between a flexible film or sheet having superior heat-conductivity and heat-resistance, and the heat-radiator having a heat-radiation flow passage on the other side surface thereof, defined between the flexible film or sheet having superior heat-conductivity and heat-resistance.

Liquid cooling system and an electronic apparatus having the same therein

An electronic equipment is provided, which comprises a liquid-cooling system and a cooling fan as a cooling system, efficiently cools the liquid-cooling system, and reduces fan noise. The electronic equipment is provided with a liquid-cooling system, in which heat generated in a heat generating portion is transmitted to a heat radiating portion with a liquid as a medium to achieve cooling, and an air-cooling system, in which heat transmitted to the heat radiating portion is forcedly cooled, and comprises a pump that circulates the liquid between the heat generating portion and the heat radiating portion, a fan that forcedly discharges heat of the heat radiating portion to an outside, a temperature sensor that detects temperature of the heat generating portion, and storage information that beforehand prescribes the relationship between temperature of the heat generating portion and voltages of the pump and the fan, the electronic equipment being constructed such that a pump voltage is raised without changing a fan voltage when the detected temperature exceeds a first temperature, and a fan voltage is raised when temperature detected by the temperature sensor exceeds a second temperature higher than the first temperature, thus further increasing a cooling capacity.

Electronic equipment provided with cooling system

A cooling module designed so that the following components are stacked above a CPU: a cooling jacket allowing a cooling liquid to absorb heat generated by the CPU, a pump causing the cooling liquid to circulate, a reserve tank used to provide a supplementary cooling liquid and to bleed air from the cooling liquid, and a first radiator that cools the cooling liquid, the cooling module being also designed so that a second radiator is located at a side of the first radiator to cool the cooling liquid, wherein the cooling liquid is driven by the pump so as to circulate from the cooling jacket, which absorbs heat generated by the CPU, through the radiators to the reserve tank.

Liquid cooling module

In a liquid cooling jacket, to improve the heat transfer coefficient, extensibility and assembling, the liquid cooling jacket comprises a base bonded to a heating element; a post standing perpendicularly to the base; a plurality of radiating fins attached to the post and arranged so as to be parallel to the base; a partition filling up intervals between the plurality of radiating fins at a predetermined width; and a case which surrounds the post and the radiating fins and is bonded to the base, and to which an inlet and an outlet for coolant are attached at positions where flow of the coolant is divided by the partition. The plurality of radiating fins may be arranged at intervals each of which is narrow in comparison with a thickness of each of the plurality of radiating fins. Therefore, because the coolant flow within the liquid cooling jacket ensures a plurality of passages, the passage resistance is low. In addition, by setting the size of each of the inlet and outlet for the coolant to be substantially equal to the height of the arranged radiating fins, the flow rates on the radiating fins can be even.

Liquid cooling jacket

In order to efficiently cool highly heat generating components mounted on an electronic device, it is necessary to provide a large heat sink, which is the heat dissipation member, and this entails the problem of an enlarged device size and accordingly an increased installation space. A heat receiving member is attached to a heat generating component installed in a housing, a fan for discharging air within the housing out of the housing is attached on a part of a wall of the housing, a heat sink having a base and fins arranged on the base is attached opposite the fan on an outer face of the wall of the housing or protruding out of the wall with the fins facing the housing, and the heat sink and the heat receiving member are connected by heat transport means.

Electronic device having a heat dissipation member

There is provided a technology for realizing an PCI expansion adapter for a PC card which is connectable to a desktop type personal computer PCI expansion connector using a low profile PCI. The PCI expansion adapter includes an expansion unit which is provided with an electrical connector to a PCI bus, a low profile PCI expansion board provided with a PC card control element and an electrical connector to the PC card, wherein the low profile PCI expansion board and the expansion unit are connected by the electrical connectors mounted on the respective boards.

PCI expansion adapter with PC card slot and electronic apparatus provided with the same

In an information processing apparatus with a cooling structure using a heat transport measure such as a heat pipe and a liquid-cooling system, a heat radiation unit has reduced thickness and noise and an improved efficiency. Heat generated by a CPU is transmitted through a heat receiving header and a flexible tube to the heat radiation unit by liquid coolant transported by a pump. The heat radiation unit comprises a propeller, a wall surface in contact with the propeller, and a cooling pipe spirally wound around a propeller shaft in a plane perpendicular to the propeller shaft. Hot coolant is circulated so as to enter the central portion of the cooling pipe and to be discharged from the outer peripheral portion of the pipe. The cooling air from the propeller is made to flow from the central portion of the cooling pipe toward its peripheral portion. The cooling pipe is thermally connected to the wall surface so that the wall surface works as a heat spreader.

Computer having cooling device

An apparatus for information display for displaying not only periodic information in accordance with schedule, but also non-periodic information regardless of the schedule, to passengers and passersby in stations, airports, harbors, bus terminals and streets, and the like. The apparatus comprises an information-storing section for storing a plurality of non-periodic information to be displayed regardless of the schedule, an input circuit for receiving a plurality of input signals transmitted from an external device or a remote place and display control section for simultaneously displaying the non-periodic information and periodic information which correspond to the kind of an input signal, when the apparatus receives this input signal from the external apparatus or the remote place. The apparatus may be a multi-screen display type having a plurality of screens. In this case, a combined screen data consisting of a non-periodic information and a periodic information can be displayed, or the non-periodic information or the periodic information can be displayed, on at least one of the screens.

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Hadano, Japan

Hironori Oikawa