Panasonic Corporation

Nitto-denko Corporation

Hironori Kobayashi

Satoshi Shida

Yasuharu Ueno

Shoriki Narita

Makoto Morikawa

Shuichi Hirata

The present invention relates to an epoxy resin composition for semiconductor encapsulation, including the following ingredients A to E: A: an epoxy resin; B: a silicone mixture containing the following ingredients b1 and b2, with a weight ratio of the ingredients b1 and b2 being from 5/95 to 25/75 in terms of b1/b2: b1: a silicone compound having an amino group in both ends thereof and having a weight average molecular weight of from 600 to 900, and b2: a silicone compound having an amino group in both ends thereof and having a weight average molecular weight of from 10,000 to 20,000; C: a phenol resin; D: a curing accelerator; and E: an inorganic filler containing the following ingredients e1 and e2: e1: a crystalline silica, and e2: a fused silica.

Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

A suction nozzle () of a reversing head device () has a distal end surface () with a suction hole () opened therein, and a suction passage () communicated with the suction hole () at one end thereof. A portion of the distal end surface () outside of the suction hole () abuts against bumps () of an electronic component (). The suction hole () is opposed with a gap to a portion of a mounting side surface () where no bumps () are present. A vacuum pump () creates an air flow that flows from the gap between the suction hole () and the mounting side surface () into the suction passage () through the suction hole (). The electronic component () is held at the distal end surface () by a negative pressure generated by the air flow.

Component supply head device and component mounting head device

Growing community of inventors

Osaka, Japan

Hironori Kobayashi