Sony Semiconductor Solutions Corporation

Sony Corporation

Hironori Hoshi

Toshifumi Wakano

Minoru Ishida

Koji Kikuchi

Itaru Oshiyama

Shunsuke Maruyama

Atsushi Okuyama

Junichiro Fujimagari

Motonobu Torii

Katsuhisa Kugimiya

The present disclosure relates to an image capturing element, a manufacturing method, and an electronic device that make it possible to improve effects of reducing crosstalk. A trench part provided from a light-receiving surface side of a semiconductor substrate in which photoelectric conversion parts that photoelectrically convert emitted light are formed and between the plurality of photoelectric conversion parts; and a protrusion part provided with at least an inclined surface that is inclined with respect to a side surface of the trench part to widen a space of the trench part in one part of the trench part are provided. The present technology can be applied, for example, to backlit solid-state image capturing elements.

Image capturing element, manufacturing method, and electronic device

The present technique relates to a camera module and an electronic apparatus that allow a camera module to be used for various purposes. The camera module includes a first pixel array in which pixels that receive light having an R, G, or B wavelength are two-dimensionally arranged in a matrix form and a second pixel array in which pixels that receive light having a wavelength region of visible light are two-dimensionally arranged in a matrix form and a first optical unit that converges incident light onto the first pixel array and a second optical unit that converges the incident light onto the second pixel array. The present technique can be for example applied to a camera module and the like.

Camera module with stacked lens structure and electronic apparatus

A solid-state image pickup device includes pixels diagonally arranged, each including a photoelectric conversion unit and a plurality of transistors and wiring extending in the vertical and horizontal directions which is diagonally arranged around the photoelectric conversion unit in each of the pixels so that at least one portion of the wiring is arranged along at least one side of the photoelectric conversion unit.

Solid-state image pickup device

Growing community of inventors

Kanagawa, Japan

Hironori Hoshi