Komatsu Corporation

Hironori Akiba

Norio Takahashi

Shunsuke Miyamoto

Kanichi Kadotani

Makio Tsubota

Tadayuki Hanamoto

Tomohisa Sato

Toshiyuki Kamei

Masashi Osanai

Hiroaki Takechi

Tsutomu Hatanaka

Takumi Sugihara

Isao Shibata

A thermoelectric module with a simple structure with less breakage by thermal stress is provided. For this purpose, the thermoelectric module includes p-type and n-type thermoelectric elements () which are alternately placed, and outer electrodes () and inner electrodes (), which are alternately placed between the thermoelectric elements (), and at least part of at least either one of the outer electrode () or the inner electrode () has a shape approximately along an object which exchanges heat with the electrodes (). The inner electrodes () surround an object which exchanges heat with the electrodes ().

Thermoelectric module

The invention provides a temperature control device with excellent temperature uniformity and thermal response, which can be manufactured easily, and a manufacturing method for the same. A thermoelectric device is arranged between a substrate mounting plate and a cooling plate . Copper foil electrodes , . . . on the upper side of the thermoelectric device are adhered to a lower surface of the substrate mounting plate with an adhesive sheet covering substantially the entire lower surface of the substrate mounting plate , and copper foil electrodes , . . . on the lower side of the thermoelectric device are adhered to an upper surface of the cooling plate with an adhesive sheet covering substantially the entire upper surface of the substrate mounting plate . The total thickness of the adhesive sheet and the copper foil electrodes adhering to it, and the total thickness of the adhesive sheet and the copper foil electrodes adhering to it, is each set approximately 25 to 1000 &mgr;m thin, so as to make the thermal resistance sufficiently low. Thermoelectric conversion elements and are distributed across a large area covering at least the entire area corresponding to the substrate

Temperature control device and method for manufacturing the same

A temperature control system which performs control of an object whose temperature is to be controlled as accurately as possible. The system comprises: a chiller located in a fluid circulating and supplying system, for cooling a thermal fluid returning from a vacuum chamber, a first flow control valve located in the fluid circulating and supplying system in a position between the chiller and the vacuum chamber, a bypass passage for splitting and supplying thermal fluid returning from the vacuum chamber to a position between the first flow control valve and the vacuum chamber, before it reaches the chiller, a second flow control valve located in the bypass passage, and a halogen lamp heater located in the fluid circulating and supplying system in a position between a confluence point of the bypass passage and the vacuum chamber, for adjusting the temperature of the thermal fluid passing therethrough to a set temperature.

Temperature control device and temperature control method

Growing community of inventors

Tokyo, Japan

Hironori Akiba