Lintec Corporation

Shin-Etsu Polymer Co., Ltd.

Arakawa Chemical Industries, Ltd.

Hironobu Fujimoto

Masaharu Ito

Kenichi Watanabe

Takeshi Kondo

Takeshi Segawa

Naoki Taya

Satoshi Odashima

Wataru Iwaya

Kiyofumi Tanaka

Noriyoshi Hosono

Tomohide Fukuzaki

Tsutomu Iida

A sheet is produced by curing an energy ray curable composition which includes a urethane acrylate oligomer and a compound having a thiol group in the molecule. The sheet has heat resistance to prevent outgassing.

Sheet and adhesive sheet

Provided is a curable resin composition comprising a thermoplastic resin (A) that includes a cyclic structure in its main chain, and has a glass transition temperature (Tg) of 140&#xb0; C. or more, and a monofunctional curable monomer (B). The present invention provides: a cured resin formed article that has heat resistance and low birefringence, a method for producing the same, a curable resin composition and a curable resin formed article that are useful as a raw material for producing the cured resin formed article, and a laminate that includes a layer formed of a cured resin.

Curable resin composition, curable resin molded body, cured resin molded body, method for producing each of same, and laminate body

The present invention is: a curable resin composition comprising a thermoplastic resin (A), a curable monomer (B), and a photoinitiator (C), the thermoplastic resin (A) including an aromatic ring in its molecule, and having a glass transition temperature (Tg) of 140&#xb0; C. or more, and the photoinitiator (C) having an absorbance at 380 nm of 0.4 or more when measured in a 0.1 mass % acetonitrile solution; a curable resin formed article obtained by forming the curable resin composition; a cured resin formed article obtained by curing the curable resin formed article; a laminate comprising at least one layer that is formed of a cured resin obtained by curing the curable resin composition. The present invention provides: a cured resin formed article that exhibits excellent heat resistance, includes only a small amount of residual low-boiling-point substance (e.g., solvent and curable monomer), and has small in-plane retardation, a method for producing the same, a curable resin composition and a curable resin formed article that are useful as a raw material for producing the cured resin formed article, and a laminate that includes a layer formed of a cured resin.

A backgrinding machineof a semiconductor wafer W includes: a tableset on the working plane of a mount; a multiple number of holding jigsarranged via check tableson table; a grinding machinefor performing a grinding process of the rear side of semiconductor wafer W held by holding jig; and a washing devicefor ground semiconductor wafers W. Each holding jigis constructed of a concavedepressed on the surface of a base plate, a multiple number of supporting projectionsprojectively arrayed on the bottom surface of concave, a deformable contact film, covering the concave, being supported by the multiple supporting projections, for detachably holding semiconductor wafer W in close contact with it; and an exhaust pathfor conducting air from the concavecovered by contact filmto the outside.

Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure

It is an object to provide a fixing jig which can unmovably suction a chip group produced by segmenting a semiconductor wafer into pieces, and can suction one chip by detaching the chip selectively and reliably from the chip group. A fixing jigis composed of a jig baseand an contact layer. A concave partis formed on one side of the jig base. The concave partis sectioned into small chambersby a partitionhaving a height almost equivalent to that of a sidewall. The contact layeris disposed on the upper edge of the sidewalland the partitionfor covering the concave part. A through holethat is communicated with the outside is formed in each small chamber

Growing community of inventors

Tokyo, Japan

Hironobu Fujimoto