Nitto-denko Corporation

Hironao Ootake

Katsuhiko Kamiya

Takeshi Matsumura

Shuuhei Murata

Akiko Takahashi

Naofumi Kosaka

Keisuke Shimokita

Kenichi Yamamoto

Asami Doi

Mizuho Chiba

Eriko Funatsu

Kai Okahara

A separator containing a substrate and a release layer formed on at least one side of the substrate wherein the separator shows a strain of not more than 7% when a load of 5N/20 mm is applied for one minute in the pulling direction, and when the substrate is cut in half in the thickness direction to divide the separator into two, an apparent elastic modulus in the pulling direction of one of the divided separators is larger than an apparent elastic modulus in the pulling direction of the other divided separator.

Separator

Provided is a dicing die-bonding film which is excellent in balance between retention of a semiconductor wafer upon dicing and releasability upon picking up. Disclosed is a dicing die-bonding film comprising a dicing film having a pressure-sensitive adhesive layer on a substrate material, and a die-bonding film formed on the pressure-sensitive adhesive layer, wherein the pressure-sensitive adhesive layer contains a polymer including an acrylic acid ester as a main monomer, 10 to 40 mol % of a hydroxyl group-containing monomer based on the acrylic acid ester, and 70 to 90 mol % of an isocyanate compound having a radical reactive carbon-carbon double bond based on the hydroxyl group-containing monomer, and is also cured by irradiation with ultraviolet rays under predetermined conditions after film formation on the substrate material, and wherein the die-bonding film contains an epoxy resin, and is also bonded on the pressure-sensitive adhesive layer after irradiation with ultraviolet rays.

Dicing/die bonding film

A dicing die-bonding film having a pressure-sensitive adhesive layer on a base and a die-bonding film on the pressure-sensitive adhesive layer, the pressure-sensitive adhesive layer comprising an acrylic polymer comprising acrylic ester A represented by CH&#x2550;CHCOOR(where Ris an alkyl group having 6-10 carbon atoms), acrylic ester B represented by CH&#x2550;CHCOOR(where Ris an alkyl group having 11 carbon atoms or more), a hydroxyl group-containing monomer, and an isocyanate compound having a radical reactive carbon-carbon double bond where the ratios of components are 40-10 mol % of the acrylic ester B with respect to 60-90 mol % of the acrylic ester A, 10-30 mol % hydroxyl group-containing monomer with respect to 100 mol % of the total of the acrylic ester A and the acrylic ester B, and 70-90 mol % isocyanate compound with respect to 100 mol % of the monomer containing a hydroxl group.

Dicing die-bonding film

The present invention provides a dicing die-bonding film including: a dicing film having a pressure-sensitive adhesive layer provided on a base material; and a die-bonding film provided on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer of the dicing film is an active energy ray-curable pressure-sensitive adhesive layer which contains a gas-generating agent in a ratio of 10 to 200 parts by weight based on 100 parts by weight of a base polymer which is a specific acrylic polymer A, and the die-bonding film is formed of a die-adhering layer.

Dicing die-bonding film and process for producing semiconductor device

Growing community of inventors

Ibaraki, Japan

Hironao Ootake