Toyo Kohan Co., Ltd.

Sumitomo Electric Industries, Limited

Toyo Kohan., Ltd.

Hironao Okayama

Teppei Kurokawa

Takashi Koshiro

Kouji Nanbu

Kotaro Ohki

Yusuke Hashimoto

Tsuneyuki Ide

Akira Ikeda

Yasuo Tahara

Akira Kaneko

Tatsuoki Nagaishi

Hajime Ota

Takashi Yamaguchi

Hitoshi Ohmura

Genki Honda

Hirokazu Moriyama

Susumu Sigemasa

Hidenori Inai

Akio Miyaji

Takeshi Kato

Kazuhiko Hayashi

Kazuya Ohmatsu

Masaya Konishi

Yoshihiko Isobe

Taizo Sato

Susumu Shigemasa

Takahiko Miyazaki

Setsuo Takaki

Hiroshi Fujishige

Kazuya Ohmastu

Hiroaki Ikenaga

Toshiharu Kataoka

It is an object to provide a substrate for epitaxial growth having a metal base material laminated with a copper layer. On a surface of the copper layer, an area occupied by crystal grains having crystal orientations other than a (200) plane present within 3 μm from the surface can be less than 1.5%. A surface roughness along a same direction as a rolling direction per unit length of 60 μm when measured by AFM can be Ra1<10 nm.

Substrate for epitaxial growth and method for producing same

It is an object to provide a method for producing a substrate for epitaxial growth having a higher degree of biaxial crystal orientation without forming an irregular part a. The method for producing a substrate for epitaxial growth comprising a step of laminating a metal base material and a copper layer having an fcc rolling texture by surface-activated bonding, a step of applying mechanical polishing to the copper layer, and a step of carrying out orientation heat treatment of the copper layer, wherein the copper layer is laminated in such a way that, when ratios of the (200) plane of the copper layer before laminated and of the copper layer after laminated when measured by XRD are I0and I0, respectively and ratios of the (220) plane of the copper layer before laminated and of the copper layer after laminated are I2and I2, respectively, I0&#x3c;20%, I2=70 to 90%, and I0&#x3c;20%, I2=70 to 90% and I0&#x2212;I0&#x3c;13%.

Substrate for epitaxtail, growth and method for producing same

It is an objective of the present invention to provide a metal laminate material, which has sufficient strength as well as molding processability, lightweight properties, and radiation performance, which is a metal laminate material that has a two-layer structure of a stainless steel layer and an aluminum layer or a three-layer structure of a 1st stainless steel layer, an aluminum layer, and a 2nd stainless steel layer, wherein tensile strength TS is 200&#x2264;TS&#x2264;550 (MPa), elongation EL is not less than 15%, and a surface hardness Hv of the stainless steel layer is not more than 300 for the metal laminate material.

Metal laminate material and production method therefor

This invention provides a substrate for a superconducting wire used for manufacturing a superconducting wire with excellent superconductivity and a method for manufacturing the same. Such substrate for a superconducting wire exhibits the crystal orientation of metals on the outermost layer, such as a c-axis orientation rate of 99% or higher, a &#x394;&#x3c9; of 6 degrees or less, and a percentage of an area in which the crystal orientation is deviated by 6 degrees or more from the (001) [100] per unit area of 6% or less.

Substrate for superconducting wire, production method therefor, and superconducting wire

An object of the present invention is to provide a production method for efficiently producing a metal laminate having high bonding strength. A method for producing a metal laminate material comprising the steps of: sputter etching faces to be bonded of a stainless steel and an aluminum such that an oxide layer remains on each face; temporarily bonding the faces to be bonded of the stainless steel and the aluminum by roll pressure bonding; and thermally treating the temporarily bonded laminate material at a temperature lower than the recrystallization temperature of the stainless steel to thermally diffuse at least a metal element comprised in the stainless steel into the aluminum.

Method for producing metal laminate material

This invention provides a method for forming an oxide layer on a metal substrate, which enables manufacture of an oxide layer with improved crystal orientation in comparison with that of the outermost layer of a metal substrate. The method for forming an oxide layer on a metal substratevia RF magnetron sputtering comprises a step of subjecting the crystal-oriented metal substrateexhibiting a c-axis orientation of 99% on its outermost layer to RF magnetron sputtering while adjusting the angle &#x3b1; formed by a perpendicular at a film formation positionon the metal substrateand a line from the film formation positionto a pointat which the perpendicular magnetic flux density is zero on the targetlocated at the position nearest to the film formation positionto 15 degrees or less.

Method for forming oxide layer, laminated substrate for epitaxial growth, and method for producing the same

This invention provides a substrate for a superconducting wire used for manufacturing a superconducting wire with excellent superconductivity and a method for manufacturing the same. Such substrate for a superconducting wire has crystal orientation of metals on the outermost layer, such as a c-axis orientation rate of 99% or higher and a &#x394;&#x3c6; of 6 degrees or less, and a percentage of an area in which the crystal orientation is deviated by 6 degrees or more from the (001) [100] per unit area is 6% or less.

Substrate for superconducting wire, method for manufacturing the same, and superconducting wire

An objective of the present invention is to provide a copper substrate for epitaxial growth, which has higher biaxial crystal orientation, and a method for manufacturing the same. The substrate for epitaxial growth of the present invention contains a biaxially crystal-oriented copper layer, wherein the full width at half maximum &#x394;&#x3d5; of a peak based on the pole figure of the copper layer is within 5&#xb0; and the tail width &#x394;&#x3b2; of the peak based on the pole figure is within 15&#xb0; Such a substrate for epitaxial growth is manufactured by a 1step of performing heat treatment of a copper layer so that &#x394;&#x3d5; is within 6&#xb0; and the tail width &#x394;&#x3b2; is within 25&#xb0;, and after the 1step, a 2step of performing heat treatment of the copper layer at a temperature higher than the temperature for heat treatment in the 1step, so that &#x394;&#x3d5; is within 5&#xb0; and the tail width &#x394;&#x3b2; is within 15&#xb0;.

Substrate for epitaxial growth, manufacturing method therefor, and substrate for superconducting wire

A metal laminated substrate for an oxide superconducting wire is manufactured such that a non-magnetic metal plate Thaving a thickness of not more than 0.2 mm and a metal foil Tmade of Cu alloy which is formed by cold rolling at a draft of not less than 90% and has a thickness of not more than 50 &#x3bc;m is laminated to each other by room-temperature surface active bonding, after lamination, crystal of the metal foil is oriented by heat treatment at a temperature of not less than 150&#xb0; C. and not more than 1000&#xb0; C. and, thereafter, an epitaxial growth film Tmade of Ni or an Ni alloy having a thickness of not more than 10 &#x3bc;m is laminated to the metal foil.

Method for producing metal laminated substrate for oxide superconducting wire, and oxide superconducting wire using the substrate

Provided are a substrate for a superconducting compound and a method for manufacturing the substrate which can realize the excellent adhesive strength simultaneously with high orientation of copper. An absorbed material on a surface of a copper foil to which rolling is applied at a draft of 90% or more is removed by applying sputter etching to the surface of the copper foil, sputter etching is applied to a nonmagnetic metal sheet, the copper foil and the metal sheet are bonded to each other by applying a pressure to the copper foil and the metal sheet using reduction rolls, crystals of the copper in the copper foil are oriented by heating a laminated body formed by such bonding, copper is diffused into the metal sheet by heating with a copper diffusion distance of 10 nm or more, and a protective layer is laminated to a surface of the copper foil of the laminated body.

Substrate for superconducting compound and method for manufacturing the substrate

A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.

Metal laminated substrate for use as an oxide superconducting wire material, and manufacturing method therefor

A material is provided for marking aperture grilles for use in a color picture tube which has excellent yield strength, high temperature creep strength, and superior magnetic characteristics as compared to conventional materials. The material is made by cold-rolling a low carbon sheet containing 9 to 30 weight % of Ni or 9 to 30 weight % of Ni and 0.1 to 5 weight % of Co, and annealing the cold-rolled steel sheet at a temperature of 400-500&deg; C.

Material for aperture grill for color picture tube, process for making the same, aperture grill, and picture tube

It is an object of this invention to provide a shadow mask material for use in a color picture tube excellent in tensile strength and excellent in high temperature creep strength, a shadow mask and a picture tube incorporating the same. For this purpose, the shadow mask material according to this invention uses a low carbon alloy steel sheet containing from 0.05 to 2.5% by weight of Cu and 0.001 to 0.4% by weight of P, or from 0.05 to 2.5% by weight of Cu, from 0.001 to 0.4% by weight of P and from 0.01 to 1.75% by weight of Ni.

Color picture tube shadow mask material

A purpose of the present invention is to provide material of an aperture grille used for a color picture tube having excellent yield strength, excellent high temperature creep strength and excellent magnetic characteristic, material of an aperture grille used for a color picture tube for improving an occurrence of cracking during a hot rolling step, a method for producing these material, an aperture grille and a color picture tube with the aperture grille. After adding nickel of 0.01 to 1.75 wt % to low carbon alloy steel including copper of 0.05 to 2.5 wt % and phosphor of 0.001 to 0.4 wt %, material according to the present invention is cold rolled. Then, a precipitation treatment is processed at a temperature of 300 to 700&deg; C. Alternatively, the material is cold rolled and secondary rolled after passing through an intermediate annealing at a temperature of 500 to 800&deg; C. Then, the precipitation treatment is processed.

Aperture grill material for color picture tube, production method thereof, aperture grill and picture tube

An invar alloy steel sheet for shadow masks is provided which has improved etchability, an economical production method, a shadow mask made of the invar alloy steel sheet, and a color picture tube which incorporates the shadow mask. The invar alloy steel sheet is produced by hot working an alloy slab consisting of 33 top 40 wt % nickel with the balance being iron, and then subjecting the slab to a primary cold rolling at a rolling reduction ratio of not more than 80%, annealing at a temperature of at least 550&deg; C., and subjecting the slab to a secondary cold rolling at a rolling reduction ratio of not more than 50%. The invar alloy steel sheet has a percentage of &lcub;100&rcub; texture of 60 to 80%.

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Kudamatsu, Japan

Hironao Okayama