Shin-etsu Chemical Co., Ltd.

Shin-etsu Polymer Co., Ltd.

Nissan Motor Company Limited

Other

Yazaki Corporation

Toto Ltd.

Asahi Kasei Kabushiki Kaisha

Mitsubishi Engineering-plastics Corporation

Shin-estu Chemical Co., Ltd.

Shin-etsu Polymer

Shin-etsu Corporation

Shin-etsu Technical Services, Inc.

Mitsubishi Engineering Plastics Co., Ltd.

Hironao Fujiki

Masayuki Ikeno

Shigeki Shudo

Hiroyasu Hara

Mikio Shiono

Toshiaki Takahashi

Takafumi Sakamoto

Tsuneo Kimura

Yasushi Yamamoto

Takeo Yoshida

Takehide Okami

Takeshi Miyao

Masanobu Miyakoshi

Masatoshi Arai

Yoshio Inoue

Kunio Itoh

Kenichi Fukuda

Motoo Fukushima

Hiroshi Inomata

Yoshifumi Inoue

Kei Miyoshi

Masachika Yoshino

Akira Matsuda

Kaoru Michimata

Shinichi Sato

Atsushi Taniguchi

Toshiyuki Kawaguchi

Atsushi Yaginuma

Kazutoki Tahara

Tadashi Araki

Kazuhiko Tomaru

Kunihiko Mita

Shohei Nakamura

Ikuo Sakurai

Miyuki Tanaka

Naoto Obayashi

Masatoshi Miyake

Hironobu Muramatsu

Yoshifumi Harada

Shigeru Muramatsu

Takashi Gonda

Kousi Anai

Nobuyuki Hasebe

Morio Ohashi

Mitsuaki Igarashi

Yasuhiko Matsuoka

Tarou Kita

Akira Yamamoto

Akira Yoshida

Hideto Kato

Takeshi Fukuda

Tsutomu Nakamura

Hiroshi Hashimoto

Hirofumi Kishita

Noriyuki Meguriya

Koichi Yamaguchi

Makoto Hayakawa

Toshiya Watanabe

Kouichi Yamaguchi

Noriyoshi Ogawa

Masahiro Kanda

Kazuyoshi Yoshida

Kazutoshi Fujioka

Syuuichi Azechi

Kouichi Tanaka

Noboru Shimamoto

Tailu Ning

Jun Horikoshi

Mitsuhiro Iwata

Akio Suzuki

Makoto Chikuni

Hideki Sugahara

Takashi Kondou

Yoshitaka Aoki

Toshiaki Takata

Kazunori Kawasaki

Hiroki Konno

Masaya Arakawa

Mitsuaki Negishi

Yuji Hinoto

Chinami Matsui

Hisao Okamoto

Kenichi Kimura

Kazukiyo Nagai

Takanori Suzuki

Morio Oohasi

Shiniti Ide

Kazumi Okada

Morio Oohashi

Nobuhiro Nakagawa

Clara Y Kim

Yuji Fujita

Eiji Kuchiki

Kazuyasu Satoh

Yoshifumi Inatani

Tadashi Harada

Manabu Narumi

Hiroyuki Tanaka

A transparent conductive film with fewer problems originating from amine compounds is provided using a conductive composition stably and pseudo-solubly dispersed in a solvent consisting mainly of an organic solvent. This invention relates to: a conductive composition which is pseudo-solubly dispersed in a solvent consisting mainly of an organic solvent and which contains (a) a &#x3c0;-conjugated conductive polymer, (b) polyanions doping the &#x3c0;-conjugated conductive polymer (a), and (c) a reaction product of those anions of the polyanions (b) that were not needed for doping, and an oxirane group- and/or oxetane group-containing organic compound; a production method of said conductive composition; an anti-static resin composition formed by mixing said conductive composition and a resin solution dissolved in an organic solvent; and antistatic resin film formed by curing said antistatic resin composition.

Conductive composition, conductive composition production method, anti-static resin composition and antistatic resin film

A capacitor having a high degree of electric strength, a high electrostatic capacity, and a low ESR, which can be readily downsized, is provided. The capacitor according to the present invention includes an anode made of porous valve metal, a dielectric layer formed by oxidizing the surface of the anode, and a solid electrolyte layer formed on the surface of the dielectric layer. The solid electrolyte layer includes a &#x3c0; conjugated conductive polymer, a polyanion, and an ion-conductive compound.

Capacitor and method for producing thereof

An electromagnetic noise suppressor of the present invention includes a base material containing a binding agent and a composite layer formed by integrating the binding agent that is a part of the base material and the magnetic material. This electromagnetic noise suppressor has high electromagnetic noise suppressing effect in the sub-microwave band, and enables it to reduce the space requirement and weight. The electromagnetic noise suppressor can be manufactured by forming the composite layer on the surface of the base material by physical vapor deposition of the magnetic material onto the surface of the base material. The article with an electromagnetic noise suppressing function of the present invention is an electronic component, a printed wiring board, a semiconductor integrated circuit or other article of which at least a part of the surface is covered by the electromagnetic noise suppressor of the present invention.

Electromagnetic noise suppressor, article with electromagnetic noise suppressing function and their manufacturing methods

An electromagnetic noise suppressor of the present invention includes a base materialcontaining a binding agent and a composite layerformed by integrating the binding agent that is a part of the base materialand the magnetic material. This electromagnetic noise suppressor has high electromagnetic noise suppressing effect in the sub-microwave band, and enables it to reduce the space requirement and weight. The electromagnetic noise suppressor can be manufactured by forming the composite layeron the surface of the base materialby physical vapor deposition of the magnetic material onto the surface of the base material. The article with an electromagnetic noise suppressing function of the present invention is an electronic component, a printed wiring board, a semiconductor integrated circuit or other article of which at least a part of the surface is covered by the electromagnetic noise suppressor of the present invention.

Electromagnetic noise suppressor, article with electromagnetic noise suppressing function, and their manufacturing methods

A heat dissipating member which is disposed between a heat generating electronic component which when operated generates heat and reaches a temperature higher than room temperature and a heat dissipating component is characterized in that the heat dissipating member is non-fluid in a room temperature state prior to operation of the electronic component and acquires a low viscosity, softens or melts under heat generation during operation of the electronic component to fluidize at least a surface thereof so as to fill between the electronic component and the heat dissipating component without leaving any substantial voids, and the heat dissipating member is formed of a composition comprising a silicone resin and a heat conductive filler.

Heat dissipating member

A conductive fluoro-resin composition of the addition reaction curing type is provided comprising (A) a reactive fluorinated polyether compound comprising fluorinated polyether units and having at least two aliphatic unsaturated hydrocarbon radicals in a molecule, (B) a compound having at least two hydrogen atoms each directly attached to a silicon atom, (C) a platinum group metal catalyst, and (D) silver particles. The composition cures into rubbery parts having improved heat resistance, weather resistance and solvent resistance and optionally forming firm bonds to various substrates.

Conductive fluoro-resin compositions

An electromagnetic wave absorbing heat conductive composition is used to form an electromagnetic wave absorbing heat dissipating article that is placed between a heat generating electronic component which, when operated, generates heat, reaches a temperature higher than room temperature and acts as an electromagnetic wave generating source, and a heat dissipating component. The composition is non-fluid at room temperature prior to operation of the electronic component, but acquires a low viscosity, softens or melts under heat generation during operation of the electronic component, to fluidize at least a surface of the composition so that the composition substantially fills any gaps between the electronic component and the heat-dissipating component.

Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work

Replicas are molded by curing a photo-curable liquid silicone rubber composition to form a transparent mother mold having a cavity corresponding to the outer contour of a master model, casting a photo-curable liquid resin into the mold cavity, and irradiating light to the liquid resin through the mold wall. Replicas can be fabricated by simple steps and within a short time.

Replica molding

A rubber composition comprising (A) a polyisobutylene polymer having an allyl radical at an end, (B) an optional organpolysiloxane, (C) an organohydrogenpolysiloxane having at least two SiH radicals per molecule, and (D) a platinum group metal catalyst forms a seal member on a periphery of one side of a polymer electrolyte fuel-cell separator. Due to improved acid resistance, weather resistance, creep resistance and gas permeability, the seal member remains effective for a long period of time.

Polymer electrolyte fuel-cell separator sealing rubber composition

An electromagnetic wave (EM) absorber is constructed by integrally laminating an EM-absorbing layer having an EM-absorbing filler dispersed in a silicone resin on at least one surface of an EM-reflecting layer having an electrically conductive filler dispersed in a silicone resin. It has satisfactory EM-absorbing and shielding abilities and is workable, flexible, weather resistant and heat resistant due to the nature of the silicone resin itself. The use of the silicone resin in both the EM-absorbing and reflecting layers ensures that a firm bond is established between the layers. In a preferred embodiment wherein a heat conductive filler is blended, the absorber has a satisfactory heat transfer ability as well.

Electromagnetic wave absorber

A conductive composition is obtained by dispersing conductive particles in a curable polymer. At least 50% by weight of the entire conductive particles are those conductive particles coated with a metal on their outermost layer surface and having a specific gravity which differs within &plusmn;1.5 from the specific gravity of the curable polymer. The composition remains stable during storage, experiences a minimal change with time of curability, and cures into a conductive rubber which experiences a minimal change with time of volume resistivity.

Conductive composition

In a silicone rubber composition of the condensation curing type comprising a diorganopolysiloxane having at least two silicon-attached hydroxyl or hydrolyzable radicals as a base polymer, and a silane having at least two hydrolyzable radicals or a partial hydrolytic condensate thereof, at least 2 mol % of the entire substituent radicals attached to silicon atoms in the diorganopolysiloxane are monovalent hydrocarbon radicals having at least two carbon atoms. The cured composition has excellent non-staining and sealing properties, and when applied as a coating, filled into joints, or used as a solid gasket, it does not cause staining of the building, joints, or the area around joints.

Non-staining silicone rubber compositions

A silicone rubber composition for use in rubber construction materials contains dispersed particles having a photocatalytic activity. The particles are surface-treated with a compound that can easily be deteriorated by the photocatalytic activity under outdoor exposure to ultraviolet light. Rubber construction materials made of the cured form of the composition, when exposed to ultraviolet light, undergo surface hydrophilization that endows them with excellent stain resistance, and also have excellent sealing properties. When the composition is applied as a coating, filled into joints, or used as a solid gasket, it does not cause staining of the building, joints, or the area around joints.

Silicone rubber compositions for rubber construction materials

A room temperature curable organopolysiloxane composition comprising (a) an organopolysiloxane having a specific structure, (b) a alkenoxysilane or substituted alkenoxysilane or a partial hydrolyzate thereof, and (c) a siloxane or a partial hydrolyzate thereof cures into a product which experiences no decline of insulation resistance upon application of voltage in a hot humid environment and is resistant to electrolytic corrosion.

Room temperature curable organopolysiloxane compositions

A silicone rubber adhesive composition comprising (A) a heat curable organopolysiloxane composition of the addition curing type or peroxide curing type, (B) reinforcing silica fines, (C) an adhesive agent, and (D) a compound having at least one ester group in a molecule is easily moldable within a short time by injection molding, suitable in primerless molding, and bondable with various thermoplastic resins. Integrally molded articles in which the silicone rubber adhesive composition is firmly bonded to the thermoplastic resin are obtainable without a need for modification of the resin.

Silicone rubber adhesive composition and integrally molded article thereof

Growing community of inventors

Takasaki, Japan

Hironao Fujiki