Takeda Chemical Industries, Inc.

Toyota Jidosha Kabushiki Kaisha

Mitsui Takeda Chemicals, Inc.

Hiromu Miyashita

Koichi Akiyama

Takashi Shibata

Ken Hatta

Kenichi Nishino

Yasuhiro Mishima

Sanzi Aoki

Sanji Aoki

Yoshihiro Fukuda

Takashi Ino

Masahiro Hakotani

Haruyuki Yonehara

Tadao Fukui

The present invention presents an SMC with which the electrically conductive layer does not break down or become non-uniform during molding and with which molded articles with excellent electromagnetic wave shielding capability and electric conductivity can be produced. This SMC is a thermosetting resin sheet molding compound having at least one continuous layer of electrically conductive fibers with a fiber length of 50 &mgr; to 5 mm, and it is further preferred that electrically conductive powder is uniformly dispersed throughout the entire molding compound. These SMCs can be produced by impregnating a reinforcing material with a thermosetting resin composition which is combined with the above-mentioned electrically conductive fibers, or the electrically conductive fibers and electrically conductive powder, and forming at least one continuous layer of these electrically conductive fibers adjacent to this reinforcement layer.

Material for molding thermosetting resin sheet, production process, and molded product

The unsaturated polyester resin molding composition of the invention comprising an unsaturated polyester, a vinyl monomer, a stabilizer, a thermoplastic resin, an organic peroxide, a fluidity modifier, a thickening agent, a filler and a fibrous reinforcement material possesses curability at low temperatures of about 50.degree. to 120.degree. C., good fluidity and filling property on the occasion of molding at low pressures of about 0.1 to 20 kgf/cm.sup.2, and good storage stability at room temperature.

Low-pressure and low-temperature moldable composition and shaped article

Resin compositions containing (a) unsaturated polyester, (b) polymerizable monomer, (c) thermoplastic resin, (d) a polymerization initiator, and (e) hollow glass microspheres with a true density of 0.5 to 1.3 g/cm.sup.3 and an elution alkalinity of 0.05 meq/g or less; molding materials obtained by impregnating glass fibers with such resin compositions; and molded products obtained by curing such molding materials. The molding materials have a superior workability and are useful for the production of parts to be coated, such as automotive external body panels. The molded products are light in weight and are highly resistant to water. Defective adhesion of coating or blisters does not occur.

Unsaturated polyester resin compositions, molding materials, and molded

A resin composition comprising (a) an unsaturated polyester, (b) a vinyl monomer, (c) a thermoplastic resin, (d) a curing agent and (e) a hollow filler with a number average particle diameter of not more than 20 .mu., wherein (e) occurs in a proportion of 10 to 150 parts by weight to 100 parts by weight of (a), (b) and (c) combined, and the molding compounds obtainable by impregnating glass fiber with the said resin composition are very useful in that, because of their lower specific gravity, they provide lightweight products with excellent surface quality which are great use as automotive exterior body panels and other parts.

Unsaturated polyester resin compositions, molding compounds and molded

One-package type composition for in-mold coating is disclosed which contains (a) a urethane compound having at least two acryloyloxy or methacryloyloxy groups at the terminal and at least one 1-oxa-3,5-diazine-2,4,6-trione ring in the molecule, (b) an ester resin having at least one reactive double bond prepared by the reaction of an epoxy compound with an unsaturated carboxylic acid and (c) a vinyl monomer. The composition is useful for coating the molded product from fiberglass reinforced thermosetting polyester resin compounds within a mold. The composition, when coated, shows excellent adherence to the molded product and excellent water resistance.

In-mold coating composition

Growing community of inventors

Suita, Japan

Hiromu Miyashita