Nikon Corporation

Disco Corporation

Ckd Corporation

Hiromitsu Yoshimoto

Yuichi Shibazaki

Koji Tanaka

Douglas C Watson

Hideo Mizutani

Alton Hugh Phillips

Tsuneyuki Hagiwara

Masayuki Kouketsu

Akihiro Ito

Hiroto Horikawa

Kyoji Nakamura

Zhiwen Chen

Yukiyasu Masuda

Tomoki Miyakawa

Taichi Taniuchi

Shigeru Morimoto

Teppei Nomura

Yusaku Uehara

Zentaro Kawasaki

Eizo Ohya

A cleaning apparatus includes a spinner table for holding a workpiece thereon, a cleaning nozzle for supplying cleaning water to the workpiece held on the spinner table, an ultrasonic vibrator for applying ultrasonic vibrations to the cleaning water supplied from the cleaning nozzle to the workpiece, a water layer forming unit for forming a layer of the cleaning water in a clearance between the cleaning nozzle and the workpiece, the water layer forming unit having a cover surrounding the cleaning nozzle, and a drain unit for draining the cleaning water out of the cleaning apparatus, the drain unit having a flow channel for allowing the cleaning water supplied from the cleaning nozzle to the workpiece to flow therethrough.

Cleaning apparatus

A conveying unit for conveying a device chip onto a predetermined electrode of a board has a chip chuck that holds under suction one surface of the device chip, a support base to which the chip chuck is fixed in an inclinable manner, and a moving unit that moves the support base, in which a fixing mechanism that fixes the chip chuck to the support base has a plurality of leaf springs extending laterally radially from the chip chuck, the plurality of leaf springs are connected to the support base in the surroundings of the chip chuck, and the plurality of leaf springs are pulled one another, so that the chip chuck is supported in air in an inclinable manner.

Die bonding for chip conveying apparatus

A cooling structure for a first electromagnetic coil includes the first electromagnetic coil having a space extending in the direction of a predetermined axis Z; a cooling member attached to an end surface, with respect to the direction of the predetermined axis Z, of the first electromagnetic coil and having a flow path for fluid internally formed; and an inlet pipe and an outlet pipe connected, within the space, to an inlet and outlet, respectively, of the flow path of the cooling member and extending through the space to a region outside the electromagnetic coil.

Cooling structure for electromagnetic coil, and electromagnetic actuator

An exposure method that uses a substrate (M) held by a holding member () to perform exposure processing, comprising a holding process, which holds a prescribed region (AR) of the substrate as the holding region by means of the holding member, and a deformation process, which selectively deforms one side of the holding region of the substrate held by the holding process with respect to the other side. According to the present invention, a prescribed region of the substrate is held as a holding region by means of a holding member, and one side of the holding region of said held substrate is selectively deformed with respect to the other side, so it is possible to selectively eliminate the nonlinear deformation components attributable to holding of the substrate with respect to one side from among the two sides of the substrate using the holding region as a reference. Since it is possible to put the pattern projected via the substrate into a linearly correctable status, it is possible to reduce warping of the pattern.

Exposure method and device manufacturing method including selective deformation of a mask

An exposure apparatus comprises a stage main body having a mounting surface, and a correcting mechanism that corrects a shape of the mounting surface.

Stage apparatus, exposure apparatus and device manufacturing method

A pellicle is provided to one end surface of end surfaces of a frame. Another end surface of the end surfaces of the frame has an area that opposes a substrate. A configuration is adopted that prevents the deformation of the one end surface of the frame and the shape of the opposing area on the other end surface from affecting one another.

Pellicle frame apparatus, mask, exposing method, exposure apparatus, and device fabricating method

A reticle holderhas; a first suction sectionfacing a precision warrantable area ARhaving a predetermined surface precision, of a lower face Ra of a reticle R; a second suction sectionfacing a precision unwarrantable area ARoutside of the precision warrantable area AR; a poreconnected to a suction apparatus which draws out gas in a space between the lower face Ra of the reticle R and the first suction section, and a poreconnected to the suction apparatuswhich draws out gas in the space between the lower face Ra of the reticle R and the second suction section. As a result, the reticle can be held stably, without deteriorating the surface precision of the precision warrantable area.

Holding apparatus, holding method, exposure apparatus and device manufacturing method

The illuminating optical system is divided into a first portion including movable blades moving during exposure, and a second portion not containing a movable portion moving over the movable blade during exposure. The second portion is installed on the exposure main portion, and the first portion, separately from the exposure main portion. The frames configuring the first and the second optical units, the second optical unit having optical elements of a smaller movable amount than the movable amount of the movable blades, are relatively displaceably connected via the bellows-shaped member. The frames configuring the second optical units are fixed to each other via the O-ring suppressing relative displacement. As a result, the effect of vibration of the illuminating optical system during exposure on the main portion can be reduced. Upon purging nitrogen gas or the like in the space interior of the frame and the space between adjacent frames, the degree of air-tightness and chemical cleanliness is improved, consequently improving the exposure accuracy.

Growing community of inventors

Saitama, Japan

Hiromitsu Yoshimoto